Soldering or alloying

Industry

CPC
H01L2224/83801

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83801Soldering or alloying

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor component and method for producing a power semi...
- Patent number 12,165,950
- Issue date Dec 10, 2024
- Vitesco Technologies GmbH
- Christina Quest-Matt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with interposer between integrated circuit dies
- Patent number 12,136,615
- Issue date Nov 5, 2024
- Qorvo US, Inc.
- Matthew Essar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 12,107,057
- Issue date Oct 1, 2024
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using semiconductor light-emitting elements and manu...
- Patent number 12,080,689
- Issue date Sep 3, 2024
- LG Electronics Inc.
- Dohee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal joint, metal joint production method, semiconductor device, a...
- Patent number 12,076,967
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Takashi Ijima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,068,741
- Issue date Aug 20, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,063,030
- Issue date Aug 13, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and semiconductor device
- Patent number 12,051,662
- Issue date Jul 30, 2024
- Rohm Co., Ltd.
- Masatoshi Aketa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and display device using the same
- Patent number 12,021,056
- Issue date Jun 25, 2024
- LG Display Co., Ltd.
- Chang Hyun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 11,936,369
- Issue date Mar 19, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,810,881
- Issue date Nov 7, 2023
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the manufacture of integrated devices including a die fi...
- Patent number 11,756,916
- Issue date Sep 12, 2023
- STMicroelectronics S.r.l.
- Michele Calabretta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 11,735,505
- Issue date Aug 22, 2023
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 11,728,801
- Issue date Aug 15, 2023
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having a compressive strain layer and metho...
- Patent number 11,705,370
- Issue date Jul 18, 2023
- OSRAM OLED GmbH
- Benjamin Michaelis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for attachment and devices produced using the methods
- Patent number 11,699,632
- Issue date Jul 11, 2023
- Alpha Assembly Solutions Inc.
- Monnir Boureghda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and method for fabricating a power semic...
- Patent number 11,652,028
- Issue date May 16, 2023
- Infineon Technologies AG
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor having double-sided substrate
- Patent number 11,631,627
- Issue date Apr 18, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module package and method of manufacturing the same
- Patent number 11,615,967
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,545,454
- Issue date Jan 3, 2023
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering device and a method for producing a solder connection of...
- Patent number 11,491,567
- Issue date Nov 8, 2022
- Pink GmbH Thermosysteme
- Aaron Hutzler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the manufacture of integrated devices including a die fi...
- Patent number 11,482,503
- Issue date Oct 25, 2022
- STMicroelectronics S.r.l.
- Michele Calabretta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 11,450,642
- Issue date Sep 20, 2022
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display apparatus and manufacturing method thereof
- Patent number 11,444,066
- Issue date Sep 13, 2022
- Samsung Electronics Co., Ltd.
- Youngki Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged dies with metal outer layers extending from die back sides...
- Patent number 11,437,276
- Issue date Sep 6, 2022
- NXP USA, INC.
- Jaynal A Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structures and methods of manufacture
- Patent number 11,437,304
- Issue date Sep 6, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and power conversion device
- Patent number 11,432,419
- Issue date Aug 30, 2022
- Hitachi Astemo, Ltd.
- Tokihito Suwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Creating 3D features through selective laser annealing and/or laser...
- Patent number 11,430,758
- Issue date Aug 30, 2022
- Texas Instruments Incorporated
- Simon Joshua Jacobs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
JOINED BODY, METHOD OF MANUFACTURING JOINED BODY, AND METHOD OF EVA...
- Publication number 20240429108
- Publication date Dec 26, 2024
- MITSUBISHI MATERIALS CORPORATION
- Shujie Fei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
- Publication number 20240421109
- Publication date Dec 19, 2024
- EV GROUP E. THALLNER GMBH
- Viorel Dragio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SAME,...
- Publication number 20240387438
- Publication date Nov 21, 2024
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS
- Publication number 20240355724
- Publication date Oct 24, 2024
- Mitsubishi Electric Corporation
- Tatsuya KAWASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY HAVING A POWER SEMICONDUCTOR COMPONENT BETWEEN...
- Publication number 20240349429
- Publication date Oct 17, 2024
- ROBERT BOSCH GmbH
- Arne Stephen Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE
- Publication number 20240339421
- Publication date Oct 10, 2024
- ROHM CO., LTD.
- Masatoshi AKETA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION AND METHOD FOR...
- Publication number 20240332114
- Publication date Oct 3, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
- Publication number 20240312945
- Publication date Sep 19, 2024
- LG Display Co., Ltd.
- Chang Hyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240304567
- Publication date Sep 12, 2024
- Mitsubishi Electric Corporation
- Aya MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE ARRANGEMENT
- Publication number 20240304538
- Publication date Sep 12, 2024
- INFINEON TECHNOLOGIES AG
- Christoph Bayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING DEVICE AND ELECTRONIC CIRCUIT
- Publication number 20240275373
- Publication date Aug 15, 2024
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGING THERMAL INTERFACE MATERIAL ALLOY CREATED IN-SITU
- Publication number 20240243091
- Publication date Jul 18, 2024
- The Indium Corporation of America
- Richard McDonough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240194581
- Publication date Jun 13, 2024
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A POWER SEMI...
- Publication number 20240096738
- Publication date Mar 21, 2024
- Vitesco Technologies GMBH
- Christina Quest-Matt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240047430
- Publication date Feb 8, 2024
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240014159
- Publication date Jan 11, 2024
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGING MEMBER, SEMICONDUCT...
- Publication number 20230411256
- Publication date Dec 21, 2023
- JCET SEMICONDUCTOR (SUQIAN) CO., LTD.
- KAI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230402420
- Publication date Dec 14, 2023
- Hitachi Power Semiconductor Device, Ltd.
- Osamu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20230378117
- Publication date Nov 23, 2023
- ROHM CO., LTD.
- Hiromasa KONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20230369279
- Publication date Nov 16, 2023
- STMicroelectronics S.r.l
- Thomas GOTTARDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE COMPRISING AT LEAST ONE POWER SEMICONDUC...
- Publication number 20230352362
- Publication date Nov 2, 2023
- SIEMENS AKTIENGESELLSCHAFT
- Christian Radüge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230317672
- Publication date Oct 5, 2023
- Kabushiki Kaisha Toshiba
- Takeyuki SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230298983
- Publication date Sep 21, 2023
- Hitachi Astemo, Ltd.
- Osamu IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230275005
- Publication date Aug 31, 2023
- Mitsubishi Electric Corporation
- Shogo TOKUMARU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING DEVICE AND ELECTRONIC CIRCUIT
- Publication number 20230268914
- Publication date Aug 24, 2023
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20230268332
- Publication date Aug 24, 2023
- Agency for Science, Technology and Research
- Gongyue TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING DEVICE AND ELECTRONIC CIRCUIT
- Publication number 20230268915
- Publication date Aug 24, 2023
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING DEVICE AND ELECTRONIC CIRCUIT
- Publication number 20230261647
- Publication date Aug 17, 2023
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MANUFACTURING COLOR MICRO LED DISPLAY CHIP MODULE
- Publication number 20230246060
- Publication date Aug 3, 2023
- Fujian Prima Optoelectronics Co., Ltd.
- Fan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, CHIP SYSTEM, METHOD OF FORMING A SEMICONDUCTOR...
- Publication number 20230230903
- Publication date Jul 20, 2023
- INFINEON TECHNOLOGIES AG
- Hooi Boon TEOH
- H01 - BASIC ELECTRIC ELEMENTS

Soldering or alloying

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Power semiconductor component and method for producing a power semi...

Electronic package with interposer between integrated circuit dies

Method for permanent connection of two metal surfaces

Package with different types of semiconductor dies attached to a fl...

Display device using semiconductor light-emitting elements and manu...

Metal joint, metal joint production method, semiconductor device, a...

Switching device and electronic circuit

Switching device and electronic circuit

Electronic component and semiconductor device

Electronic device and display device using the same

Switching device and electronic circuit

Semiconductor device

Method for the manufacture of integrated devices including a die fi...

Semiconductor device

Switching device and electronic circuit

Semiconductor component having a compressive strain layer and metho...

Methods for attachment and devices produced using the methods

Power semiconductor device and method for fabricating a power semic...

Method of manufacturing semiconductor having double-sided substrate

Power module package and method of manufacturing the same

Semiconductor device

Soldering device and a method for producing a solder connection of...

Method for the manufacture of integrated devices including a die fi...

Soldering a conductor to an aluminum metallization

Display apparatus and manufacturing method thereof

Packaged dies with metal outer layers extending from die back sides...

Substrate structures and methods of manufacture

Power semiconductor device and power conversion device

Creating 3D features through selective laser annealing and/or laser...

Patents Applicationslast 30 patents

JOINED BODY, METHOD OF MANUFACTURING JOINED BODY, AND METHOD OF EVA...

METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES

CERAMIC SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SAME,...

SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS

ELECTRONIC ASSEMBLY HAVING A POWER SEMICONDUCTOR COMPONENT BETWEEN...

ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION AND METHOD FOR...

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE ARRANGEMENT

SWITCHING DEVICE AND ELECTRONIC CIRCUIT

PHASE CHANGING THERMAL INTERFACE MATERIAL ALLOY CREATED IN-SITU

POWER MODULE AND MANUFACTURING METHOD THEREFOR

POWER SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A POWER SEMI...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGING MEMBER, SEMICONDUCT...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

POWER SEMICONDUCTOR MODULE COMPRISING AT LEAST ONE POWER SEMICONDUC...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SWITCHING DEVICE AND ELECTRONIC CIRCUIT

POWER MODULE PACKAGE AND METHOD OF FORMING THE SAME

SWITCHING DEVICE AND ELECTRONIC CIRCUIT

SWITCHING DEVICE AND ELECTRONIC CIRCUIT

METHOD FOR MANUFACTURING COLOR MICRO LED DISPLAY CHIP MODULE

SEMICONDUCTOR CHIP, CHIP SYSTEM, METHOD OF FORMING A SEMICONDUCTOR...