TREA

Solid-liquid interdiffusion

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Industry

  • CPC
  • H01L2224/80825
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80825Solid-liquid interdiffusion
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Method of transferring micro device
    • Patent number 10,964,662
    • Issue date Mar 30, 2021
    • MIKRO MESA TECHNOLOGY CO., LTD.
    • Li-Yi Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for transferring micro device
    • Patent number 10,777,527
    • Issue date Sep 15, 2020
    • MIKRO MESA TECHNOLOGY CO., LTD.
    • Li-Yi Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Processing of thick metal pads
    • Patent number 9,673,157
    • Issue date Jun 6, 2017
    • Infineon Technologies AG
    • Paul Ganitzer
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD OF TRANSFERRING MICRO DEVICE
    • Publication number 20210013172
    • Publication date Jan 14, 2021
    • MIKRO MESA TECHNOLOGY CO., LTD.
    • Li-Yi CHEN
    • H01 - BASIC ELECTRIC ELEMENTS