Solid-liquid interdiffusion

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H01L2224/80825

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80825Solid-liquid interdiffusion

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Patents Grantslast 30 patents

Information Patent Grant
Method of transferring micro device
- Patent number 10,964,662
- Issue date Mar 30, 2021
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring micro device
- Patent number 10,777,527
- Issue date Sep 15, 2020
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing of thick metal pads
- Patent number 9,673,157
- Issue date Jun 6, 2017
- Infineon Technologies AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF TRANSFERRING MICRO DEVICE
- Publication number 20210013172
- Publication date Jan 14, 2021
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi CHEN
- H01 - BASIC ELECTRIC ELEMENTS