Source or drain electrodes for field effect devices

Industry

CPC
H01L29/41725

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier

Current Industry

H01L29/41725Source or drain electrodes for field effect devices

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,967,624
- Issue date Apr 23, 2024
- Hitachi, Ltd.
- Naoki Tega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicide-sandwiched source/drain region and method of fabricating same
- Patent number 11,967,621
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with multichannel heterostructure and manufact...
- Patent number 11,961,902
- Issue date Apr 16, 2024
- INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- Anbang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices comprising a dielectric material, and related sy...
- Patent number 11,948,992
- Issue date Apr 2, 2024
- Micron Technology, Inc.
- Michael A. Lindemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a timing circuit arrangements for flip-flops
- Patent number 11,942,945
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huaixin Xian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact features of semiconductor devices
- Patent number 11,935,786
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsui-Ling Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with contact structure
- Patent number 11,935,834
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio shared contacts
- Patent number 11,935,929
- Issue date Mar 19, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive contact having barrier layers with different depths
- Patent number 11,929,328
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Yang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing semiconductor device...
- Patent number 11,923,420
- Issue date Mar 5, 2024
- Kabushiki Kaisha Toshiba
- Tatsuo Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits having source/drain structure and method of making
- Patent number 11,923,200
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked complementary field effect transistors
- Patent number 11,916,073
- Issue date Feb 27, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 11,908,906
- Issue date Feb 20, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Hailong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a FinFET by implanting a dielectric with a...
- Patent number 11,901,455
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with edge-protecting spacers over bonding pad
- Patent number 11,894,328
- Issue date Feb 6, 2024
- NANYA TECHNOLOGY CORPORATION
- Jung-Hsing Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a semiconductor device
- Patent number 11,894,273
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, battery protection circuit, and power managem...
- Patent number 11,894,456
- Issue date Feb 6, 2024
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Kouki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flash memory device with three-dimensional half flash structure and...
- Patent number 11,888,074
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Chu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensor device
- Patent number 11,881,493
- Issue date Jan 23, 2024
- United Microelectronics Corp.
- Ming-Shing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,881,529
- Issue date Jan 23, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,877,436
- Issue date Jan 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Tsu-Chieh Ai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III-nitride high-electron mobility transistors with buried p-...
- Patent number 11,862,719
- Issue date Jan 2, 2024
- Wolfspeed, Inc.
- Saptharishi Sriram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit conductive line arrangement for circuit structur...
- Patent number 11,862,562
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GAN-based, lateral-conduction, electronic device with improved meta...
- Patent number 11,854,977
- Issue date Dec 26, 2023
- STMicroelectronics S.r.l.
- Santo Alessandro Smerzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical interconnect features and methods of forming
- Patent number 11,855,154
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,855,187
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Yi Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,843,039
- Issue date Dec 12, 2023
- Samsung Electronics Co., Ltd.
- Doosan Back
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure comprising source and drain protecti...
- Patent number 11,810,872
- Issue date Nov 7, 2023
- Vanguard International Semiconductor Corporation
- Jian-Hsing Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor and method for forming the same
- Patent number 11,810,962
- Issue date Nov 7, 2023
- Vanguard International Semiconductor Corporation
- Cheng-Wei Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end-of-line devices
- Patent number 11,799,001
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hsiang Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Flash Memory Device with Three-Dimensional Half Structure and Metho...
- Publication number 20240136444
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Chu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240136290
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Jee Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240128332
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Sang Shin JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM ENHANCED LINER-LESS VIA CONTACT FOR REDUCED MOL RESISTANCE
- Publication number 20240128331
- Publication date Apr 18, 2024
- International Business Machines Corporation
- RUILONG XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY STACKED FeFETS WITH COMMON CHANNEL
- Publication number 20240121965
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Georgios Vellianitis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240120278
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Bo Ram LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III-NITRIDE HIGH-ELECTRON MOBILITY TRANSISTORS WITH BURIED P-...
- Publication number 20240105829
- Publication date Mar 28, 2024
- Wolfspeed, Inc.
- Saptharishi SRIRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER DISTRIBUTION NETWORK AND BACKSIDE SINGLE CRYSTAL TRA...
- Publication number 20240105612
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE SIGNAL INTEGRATION THROUGH VIA TO SIGNAL LINE CONNECTION
- Publication number 20240105611
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FORMING THE SAME
- Publication number 20240097004
- Publication date Mar 21, 2024
- UNITED MICROELECTRONICS CORP.
- Po-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION
- Publication number 20240096750
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Qingqing LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240096976
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR DEVICE
- Publication number 20240088280
- Publication date Mar 14, 2024
- Kabushiki Kaisha Toshiba
- Hung HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240088267
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yi PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSHEET CHANNEL-TO-SOURCE AND DRAIN ISOLATION
- Publication number 20240088268
- Publication date Mar 14, 2024
- TESSERA LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240088260
- Publication date Mar 14, 2024
- DB HiTek Co., Ltd.
- Ji Houn JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS
- Publication number 20240079332
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Yang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FORK SHEET DEVICES
- Publication number 20240072047
- Publication date Feb 29, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTORS HAVING REDUCED DRAIN CURRENT DRI...
- Publication number 20240063300
- Publication date Feb 22, 2024
- Wolfspeed, Inc.
- Kyle Bothe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240063279
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- DOOSAN BACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240047550
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Ki Heun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Standard Cell with Contact Structure
- Publication number 20240047459
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lung Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240049448
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Tsu-Chieh AI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DSFET STANDARD CELL ARCHITECTURE WITH SOURCE-DRAIN JUNCTION ISOLATION
- Publication number 20240047456
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Ming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH SELF-ALIGNED CONDUCTIVE FEATURES
- Publication number 20240038855
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hao CAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STRUCTURE OF SEMICONDUCTOR DEVICES HAVING SHARED CONTACT...
- Publication number 20240030297
- Publication date Jan 25, 2024
- RICHTEK TECHNOLOGY CORPORATION
- Chin-Chin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING TWO-DIMENSIONAL MATERIAL AND METHOD...
- Publication number 20240030294
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Minsu SEOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES WITH REDUCED CAPACITANCES
- Publication number 20240021468
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240021715
- Publication date Jan 18, 2024
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Chuan HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240021682
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen YU
- H01 - BASIC ELECTRIC ELEMENTS

Source or drain electrodes for field effect devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Silicide-sandwiched source/drain region and method of fabricating same

Semiconductor device with multichannel heterostructure and manufact...

Electronic devices comprising a dielectric material, and related sy...

Method for forming a timing circuit arrangements for flip-flops

Contact features of semiconductor devices

Method for preparing semiconductor device with contact structure

High aspect ratio shared contacts

Conductive contact having barrier layers with different depths

Semiconductor device, method for manufacturing semiconductor device...

Integrated circuits having source/drain structure and method of making

Stacked complementary field effect transistors

Semiconductor structure and fabrication method thereof

Method of manufacturing a FinFET by implanting a dielectric with a...

Semiconductor device with edge-protecting spacers over bonding pad

Methods of forming a semiconductor device

Semiconductor device, battery protection circuit, and power managem...

Flash memory device with three-dimensional half flash structure and...

Semiconductor image sensor device

Semiconductor device and method of fabricating the same

Semiconductor device and method for fabricating the same

Group III-nitride high-electron mobility transistors with buried p-...

Integrated circuit conductive line arrangement for circuit structur...

GAN-based, lateral-conduction, electronic device with improved meta...

Vertical interconnect features and methods of forming

Semiconductor device and manufacturing method thereof

Semiconductor device

Semiconductor device structure comprising source and drain protecti...

High electron mobility transistor and method for forming the same

Back-end-of-line devices

Patents Applicationslast 30 patents

Flash Memory Device with Three-Dimensional Half Structure and Metho...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICES

BOTTOM ENHANCED LINER-LESS VIA CONTACT FOR REDUCED MOL RESISTANCE

VERTICALLY STACKED FeFETS WITH COMMON CHANNEL

SEMICONDUCTOR DEVICE

GROUP III-NITRIDE HIGH-ELECTRON MOBILITY TRANSISTORS WITH BURIED P-...

BACKSIDE POWER DISTRIBUTION NETWORK AND BACKSIDE SINGLE CRYSTAL TRA...

BACKSIDE SIGNAL INTEGRATION THROUGH VIA TO SIGNAL LINE CONNECTION

HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FORMING THE SAME

SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

NITRIDE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

NANOSHEET CHANNEL-TO-SOURCE AND DRAIN ISOLATION

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS

STACKED FORK SHEET DEVICES

HIGH ELECTRON MOBILITY TRANSISTORS HAVING REDUCED DRAIN CURRENT DRI...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Integrated Standard Cell with Contact Structure

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

3DSFET STANDARD CELL ARCHITECTURE WITH SOURCE-DRAIN JUNCTION ISOLATION

SEMICONDUCTOR STRUCTURE WITH SELF-ALIGNED CONDUCTIVE FEATURES

INTEGRATED STRUCTURE OF SEMICONDUCTOR DEVICES HAVING SHARED CONTACT...

SEMICONDUCTOR DEVICE INCLUDING TWO-DIMENSIONAL MATERIAL AND METHOD...

DEVICES WITH REDUCED CAPACITANCES

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF