Spark gaps

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CPC
H05K1/026

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/026Spark gaps

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Battery module printed circuit board assembly system and method
- Patent number 12,208,694
- Issue date Jan 28, 2025
- CPS Technology Holdings LLC
- Ronald J. Dulle
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Printed circuit board for transmitting electrical energy and for si...
- Patent number 12,207,402
- Issue date Jan 21, 2025
- Airbus Defence and Space GmbH
- Stephan Friedl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Droplet actuator fabrication apparatus, systems, and related methods
- Patent number 12,201,980
- Issue date Jan 21, 2025
- Abbott Laboratories
- Andrew Fischer
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Package device
- Patent number 12,200,857
- Issue date Jan 14, 2025
- Innolux Corporation
- Yeong-E Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple circuit board tester
- Patent number 12,188,975
- Issue date Jan 7, 2025
- LAT Enterprises Inc.
- Laura Thiel
- G01 - MEASURING TESTING
Information Patent Grant
Circuit assemblies including metallic bars
- Patent number 12,185,454
- Issue date Dec 31, 2024
- Maxim Integrated Products, Inc.
- Alexandr Ikriannikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separable interface cable structure for high voltage under-module p...
- Patent number 12,183,999
- Issue date Dec 31, 2024
- International Business Machines Corporation
- Xin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED backlight system and mounting system
- Patent number 12,181,132
- Issue date Dec 31, 2024
- BrooksCo, LLC
- David Brooks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board and method of manufacturing flexible...
- Patent number 12,177,977
- Issue date Dec 24, 2024
- Sumitomo Electric Industries, Ltd.
- Koji Nitta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level bump stack for chip scale package
- Patent number 12,177,988
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor apparatus with inspection terminals
- Patent number 12,171,061
- Issue date Dec 17, 2024
- Seiko Epson Corporation
- Kyosuke Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded interconnect system
- Patent number 12,167,582
- Issue date Dec 10, 2024
- GITech, Inc.
- John Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED circuit board structure and LED testing and packaging method
- Patent number 12,150,242
- Issue date Nov 19, 2024
- Ingentec Corporation
- Yi-Chuan Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,144,106
- Issue date Nov 12, 2024
- TPK Auto Tech (Xiamen) Limited
- Li Hua Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Educational electronics systems and methods
- Patent number 12,137,520
- Issue date Nov 5, 2024
- HEATHKIT COMPANY, INC.
- Andrew S. Cromarty
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Bus bar link for battery cell interconnections in a battery module
- Patent number 12,134,323
- Issue date Nov 5, 2024
- CPS Technology Holdings LLC
- Matthew R. Tyler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for detecting and adjusting poor back drills in printed circ...
- Patent number 12,135,347
- Issue date Nov 5, 2024
- R&D Circuits
- Michael Caprio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit structure and fabrication method thereof
- Patent number 12,133,337
- Issue date Oct 29, 2024
- INNOLUX CORPORATION
- Yi Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for multiple input power distribution to adjac...
- Patent number 12,126,147
- Issue date Oct 22, 2024
- Legrand DPC, LLC
- Carrel W. Ewing
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible printed board having improved recognition accuracy
- Patent number 12,108,525
- Issue date Oct 1, 2024
- Yazaki Corporation
- Hidehiko Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of electronic device
- Patent number 12,089,345
- Issue date Sep 10, 2024
- INNOLUX CORPORATION
- Yi-Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for delivering power to semiconductors
- Patent number 12,088,208
- Issue date Sep 10, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package structure and method for fabricating the same
- Patent number 12,089,346
- Issue date Sep 10, 2024
- Realtek Semiconductor Corp.
- Hai-Tao Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, semiconductor device, power converter, and moving ob...
- Patent number 12,075,556
- Issue date Aug 27, 2024
- Mitsubishi Electric Corporation
- Yuta Fukushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device
- Patent number 12,074,152
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Dae Hyuk Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control unit for a motor vehicle and method for producing and measu...
- Patent number 12,058,809
- Issue date Aug 6, 2024
- Vitesco Technologies Germany GmbH
- Christian Walda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Battery interconnects
- Patent number 12,040,511
- Issue date Jul 16, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rigid flexible printed circuit board and electronic device includin...
- Patent number 12,041,717
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Hyunmo Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder joint life predictor and solder joint life prediction method
- Patent number 12,032,039
- Issue date Jul 9, 2024
- Mitsubishi Electric Corporation
- Takuya Saeki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic carrier substrate and power module
- Patent number 12,028,974
- Issue date Jul 2, 2024
- Robert Bosch GmbH
- Peter Tauber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING AN ELECTRICAL CONNECTION FOR A POWER MODULE OF...
- Publication number 20250031314
- Publication date Jan 23, 2025
- SAFRAN
- Rabih KHAZAKA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20250024608
- Publication date Jan 16, 2025
- Innolux Corporation
- Yi Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR PRINTED WIRING BOARD
- Publication number 20250024596
- Publication date Jan 16, 2025
- Sumitomo Electric Industries, Ltd.
- Ryo IRIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUS BAR LINK FOR BATTERY CELL INTERCONNECTIONS IN A BATTERY MODULE
- Publication number 20250018798
- Publication date Jan 16, 2025
- CPS Technology Holdings LLC
- Matthew R. TYLER
- B60 - VEHICLES IN GENERAL
Information Patent Application
METHODS, APPARATUSES, INTEGRATED CIRCUITS, AND PRINTED CIRCUIT BOAR...
- Publication number 20250016911
- Publication date Jan 9, 2025
- Murata Manufacturing Co., Ltd.
- Gregory Szczeszynski
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
APPARATUS AND METHOD FOR DETECTING WARPAGE IN AN ELECTRONIC SYSTEM
- Publication number 20250004044
- Publication date Jan 2, 2025
- Intel Corporation
- Vijay HOSAMANI
- G01 - MEASURING TESTING
Information Patent Application
DETECTING HUMIDITY BY MEASURING IMPEDANCE BETWEEN TWO TRACKS
- Publication number 20250003904
- Publication date Jan 2, 2025
- SAGEMCOM ENERGY & TELECOM SAS
- Abbas SABRAOUI
- G01 - MEASURING TESTING
Information Patent Application
PRINTED CIRCUIT BOARD FOR A REFLOW PROFILING PROCESS
- Publication number 20240414851
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240381540
- Publication date Nov 14, 2024
- Innolux Corporation
- Yi-Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...
- Publication number 20240357736
- Publication date Oct 24, 2024
- Hitachi Astemo, Ltd.
- Takanori SEKIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD HAVING OVERCURRENT PROTECTION FUNCTION
- Publication number 20240357735
- Publication date Oct 24, 2024
- LG ENERGY SOLUTION, LTD.
- Young Joong KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BGA Element Self-Alignment Structure and Alignment Method
- Publication number 20240334592
- Publication date Oct 3, 2024
- SHENZHEN SIPTORY TECHNOLOGY CO., LTD
- Dongdong Shao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MECHANICAL PACKAGING FOR MODULAR ENERGY SYSTEM
- Publication number 20240324098
- Publication date Sep 26, 2024
- Cilag GMBH International
- Madeleine C. Jayme
- G02 - OPTICS
Information Patent Application
DISPLAY CONTROL DEVICE AND VEHICLE EMPLOYING DEVICE
- Publication number 20240324114
- Publication date Sep 26, 2024
- Futaijing Precision Electronics (Yantai) Co., Ltd.
- DIAN-RONG HAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MONITORING METHOD THEREFOR
- Publication number 20240310431
- Publication date Sep 19, 2024
- Wiwynn Corporation
- Gong-Bo SONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VOLTAGE REGULATOR MODULE HAVING A POWER STAGE
- Publication number 20240314926
- Publication date Sep 19, 2024
- Infineon Technologies Austria AG
- Luca Peluso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT PAD WITH TEST LINE
- Publication number 20240304503
- Publication date Sep 12, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALF-BRIDGE SWITCH ARRANGEMENT
- Publication number 20240298417
- Publication date Sep 5, 2024
- SEG Automotive Germany GmbH
- Nima SAADAT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, CHIP ON FILM, DISPLAY APPARATUS AND BONDING METHOD
- Publication number 20240298403
- Publication date Sep 5, 2024
- HEFEI BOE DISPLAY TECHNOLOGY CO., LTD.
- Yunyun LIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MASK FAULT FIBER OPTICS SENSOR
- Publication number 20240284590
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Chan H. Yoo
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD ASSEMBLY SHEET
- Publication number 20240260173
- Publication date Aug 1, 2024
- Nitto Denko Corporation
- Yusaku TAMAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTIPLE CIRCUIT BOARD TESTER
- Publication number 20240241171
- Publication date Jul 18, 2024
- LAT Enterprises Inc., d/b/a MediPak Energy Systems
- Laura Thiel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY SHEET
- Publication number 20240244756
- Publication date Jul 18, 2024
- Nitto Denko Corporation
- Chihiro WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board and Manufacturing Method Thereof, and Terminal Device
- Publication number 20240237194
- Publication date Jul 11, 2024
- Honor Device Co., Ltd.
- Junjie Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER DISTRIBUTION UNIT WITH PLANAR BUSBARS
- Publication number 20240208442
- Publication date Jun 27, 2024
- Dana Heavy Vehicle Systems Group, LLC
- Sylvain CASTONGUAY
- B60 - VEHICLES IN GENERAL
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240213181
- Publication date Jun 27, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Hao SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL BUSBAR DEVICE
- Publication number 20240213692
- Publication date Jun 27, 2024
- MAHLE International GmbH
- Tihomir Angelov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC DEVICE THEREOF
- Publication number 20240206050
- Publication date Jun 20, 2024
- WUHAN TIANMA MICROELECTRONICS CO., LTD.
- Xuejing XIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Display Device
- Publication number 20240206259
- Publication date Jun 20, 2024
- LG Display Co., Ltd.
- Taeyung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED BUSBARS FOR LOAD SWITCHING
- Publication number 20240206049
- Publication date Jun 20, 2024
- Valmet Automotive EV Power Oy
- Juuso Kelkka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Battery module printed circuit board assembly system and method

Printed circuit board for transmitting electrical energy and for si...

Droplet actuator fabrication apparatus, systems, and related methods

Package device

Multiple circuit board tester

Circuit assemblies including metallic bars

Separable interface cable structure for high voltage under-module p...

LED backlight system and mounting system

Flexible printed circuit board and method of manufacturing flexible...

Wafer level bump stack for chip scale package

Semiconductor apparatus with inspection terminals

Shielded interconnect system

LED circuit board structure and LED testing and packaging method

Electronic device

Educational electronics systems and methods

Bus bar link for battery cell interconnections in a battery module

Method for detecting and adjusting poor back drills in printed circ...

Circuit structure and fabrication method thereof

Method and apparatus for multiple input power distribution to adjac...

Flexible printed board having improved recognition accuracy

Manufacturing method of electronic device

Method and apparatus for delivering power to semiconductors

Die package structure and method for fabricating the same

Circuit board, semiconductor device, power converter, and moving ob...

Display device

Control unit for a motor vehicle and method for producing and measu...

Battery interconnects

Rigid flexible printed circuit board and electronic device includin...

Solder joint life predictor and solder joint life prediction method

Ceramic carrier substrate and power module

Patents Applicationslast 30 patents

METHOD FOR PRODUCING AN ELECTRICAL CONNECTION FOR A POWER MODULE OF...

CIRCUIT STRUCTURE

SUBSTRATE FOR PRINTED WIRING BOARD

BUS BAR LINK FOR BATTERY CELL INTERCONNECTIONS IN A BATTERY MODULE

METHODS, APPARATUSES, INTEGRATED CIRCUITS, AND PRINTED CIRCUIT BOAR...

APPARATUS AND METHOD FOR DETECTING WARPAGE IN AN ELECTRONIC SYSTEM

DETECTING HUMIDITY BY MEASURING IMPEDANCE BETWEEN TWO TRACKS

PRINTED CIRCUIT BOARD FOR A REFLOW PROFILING PROCESS

MANUFACTURING METHOD OF ELECTRONIC DEVICE

WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...

FLEXIBLE PRINTED CIRCUIT BOARD HAVING OVERCURRENT PROTECTION FUNCTION

BGA Element Self-Alignment Structure and Alignment Method

METHOD FOR MECHANICAL PACKAGING FOR MODULAR ENERGY SYSTEM

DISPLAY CONTROL DEVICE AND VEHICLE EMPLOYING DEVICE

CIRCUIT BOARD AND MONITORING METHOD THEREFOR

VOLTAGE REGULATOR MODULE HAVING A POWER STAGE

SPLIT PAD WITH TEST LINE

HALF-BRIDGE SWITCH ARRANGEMENT

CIRCUIT BOARD, CHIP ON FILM, DISPLAY APPARATUS AND BONDING METHOD

SOLDER MASK FAULT FIBER OPTICS SENSOR

METHOD FOR PRODUCING WIRING CIRCUIT BOARD ASSEMBLY SHEET

MULTIPLE CIRCUIT BOARD TESTER

ASSEMBLY SHEET

Circuit Board and Manufacturing Method Thereof, and Terminal Device

POWER DISTRIBUTION UNIT WITH PLANAR BUSBARS

DISPLAY PANEL AND DISPLAY DEVICE

ELECTRICAL BUSBAR DEVICE

CIRCUIT BOARD AND ELECTRONIC DEVICE THEREOF

Display Device

EMBEDDED BUSBARS FOR LOAD SWITCHING