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H01L2225/1041

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

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H01L2225/1041Special adaptations for top connections of the lowermost container

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Molded product for semiconductor strip and method of manufacturing...
- Patent number 12,308,253
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Seunghwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 12,308,308
- Issue date May 20, 2025
- Siliconware Precision Industries Co., Ltd.
- Sung-Hua Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 12,300,509
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Junyong Chung
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,300,560
- Issue date May 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Ming-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including heat dissipation structure
- Patent number 12,293,996
- Issue date May 6, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Moon Hee Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,288,745
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Donguk Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having wiring patterns
- Patent number 12,278,191
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Youngchan Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having package on package structure and method...
- Patent number 12,261,157
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with thermal relaxation block and manufacturi...
- Patent number 12,255,196
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,249,550
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a dummy pattern
- Patent number 12,211,777
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Minjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for forming the same
- Patent number 12,211,799
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly protective wafer edge sidewall protection layer
- Patent number 12,211,766
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and manufacuring method thereof
- Patent number 12,205,934
- Issue date Jan 21, 2025
- Diodes Incorporated
- Shiau-Shi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package, package-on-package structure, and manuf...
- Patent number 12,198,996
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,191,203
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging semiconduct...
- Patent number 12,191,163
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with tiered pillar and manufacturing method th...
- Patent number 12,183,594
- Issue date Dec 31, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,183,664
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,176,258
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 12,176,327
- Issue date Dec 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method using tape attachment
- Patent number 12,176,335
- Issue date Dec 24, 2024
- STATS ChipPAC Pte. Ltd.
- GunHyuck Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures, packaged semiconductor devices, and method...
- Patent number 12,159,862
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing same
- Patent number 12,154,859
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Woonchun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-tier IC package including processor and high bandwidth memory
- Patent number 12,154,890
- Issue date Nov 26, 2024
- Huawei Technologies Co., Ltd.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip integrated fan-out package
- Patent number 12,148,728
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimension large system integration
- Patent number 12,136,612
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with fan-out feature
- Patent number 12,125,797
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250149515
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Kiju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250149466
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Jaesic Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250149494
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE ASSEMBLY AND A METHOD FOR FORMING THE SAME
- Publication number 20250140773
- Publication date May 1, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132296
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250125236
- Publication date Apr 17, 2025
- SAMUNG ELECTRONICS CO., LTD.
- Hyungmin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL-LEVEL PACKAGED (PLP) INTEGRATED CIRCUITS AND METHODS OF MANUF...
- Publication number 20250125247
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Jaeean Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118650
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- SUNJAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY PROTECTIVE WAFER EDGE SIDEWALLl PROTECTION LAYER
- Publication number 20250112102
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20250105224
- Publication date Mar 27, 2025
- JCET Management Co., Ltd.
- Cheng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105077
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105116
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- JU-IL CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT LEVEL SEMICONDUCTOR PACKAGE
- Publication number 20250105159
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Pyunghwa Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF PACKAGING SEMICONDUCT...
- Publication number 20250096008
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250096044
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087647
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250087572
- Publication date Mar 13, 2025
- AaltoSemi Inc.
- Yin-Ju CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079251
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND INTEGRATED CIRCUIT DEVICE
- Publication number 20250062238
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Bong Wee YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20250054870
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- WOONCHUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20250046726
- Publication date Feb 6, 2025
- STATS ChipPAC Pte Ltd.
- MingYu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20250046771
- Publication date Feb 6, 2025
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSERS, SEMICONDUCTOR PACKAGES AND METHODS OF PRODUCING THE SAME
- Publication number 20250029930
- Publication date Jan 23, 2025
- TOPPAN Holdings Inc.
- Fusao TAKAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250029935
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Kyuil Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250015062
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250015005
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- KEUNYOUNG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-INTERCONNECT
- Publication number 20250015031
- Publication date Jan 9, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240429153
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429192
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- CHAJEA JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240429213
- Publication date Dec 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Syu-Tang LIU
- H01 - BASIC ELECTRIC ELEMENTS

Special adaptations for top connections of the lowermost container

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Molded product for semiconductor strip and method of manufacturing...

Electronic package

Method of manufacturing semiconductor package

Semiconductor device package and method of manufacturing the same

Semiconductor package including heat dissipation structure

Semiconductor package

Semiconductor packages having wiring patterns

Semiconductor package having an encapulant comprising conductive fi...

Semiconductor device having package on package structure and method...

Semiconductor package with thermal relaxation block and manufacturi...

Secure semiconductor integration and method for making thereof

Semiconductor package and method manufacturing the same

Semiconductor package including a dummy pattern

Semiconductor packages and methods for forming the same

Highly protective wafer edge sidewall protection layer

Electronic component package and manufacuring method thereof

Integrated fan-out package, package-on-package structure, and manuf...

Semiconductor package

Packaged semiconductor devices and methods of packaging semiconduct...

Semiconductor device with tiered pillar and manufacturing method th...

Semiconductor package

Semiconductor package and method manufacturing the same

Method for fabricating electronic package

Semiconductor device and method using tape attachment

Interconnect structures, packaged semiconductor devices, and method...

Semiconductor package and method of manufacturing same

Multi-tier IC package including processor and high bandwidth memory

Multi-chip integrated fan-out package

Three-dimension large system integration

Package structure with fan-out feature

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC PACKAGE ASSEMBLY AND A METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

PANEL-LEVEL PACKAGED (PLP) INTEGRATED CIRCUITS AND METHODS OF MANUF...

SEMICONDUCTOR PACKAGE

HIGHLY PROTECTIVE WAFER EDGE SIDEWALLl PROTECTION LAYER

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

FAN-OUT LEVEL SEMICONDUCTOR PACKAGE

PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF PACKAGING SEMICONDUCT...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME

METHOD FOR FABRICATING ELECTRONIC PACKAGE

INTERPOSERS, SEMICONDUCTOR PACKAGES AND METHODS OF PRODUCING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

3D-INTERCONNECT

PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE