Special adaptations for top connections of the lowermost container

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CPC
H01L2225/1041

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/1041Special adaptations for top connections of the lowermost container

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multi-chip integrated fan-out package
- Patent number 12,148,728
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimension large system integration
- Patent number 12,136,612
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with fan-out feature
- Patent number 12,125,797
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
- Patent number 12,119,338
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,113,004
- Issue date Oct 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Chung-Yu Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,113,044
- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dual sides of metal routing
- Patent number 12,113,025
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure
- Patent number 12,100,666
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with conductive patterns in a redistribution layer
- Patent number 12,100,682
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,094,728
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 12,087,744
- Issue date Sep 10, 2024
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor die having edge with multiple grad...
- Patent number 12,087,618
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of chip package with fan-out structure
- Patent number 12,080,653
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having thermal conductive pattern
- Patent number 12,068,224
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,068,173
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with through via extending through redistribution...
- Patent number 12,068,212
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 12,062,632
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Kyung Don Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,062,602
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 12,051,616
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with redistribution structure having multiple chips
- Patent number 12,046,548
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure
- Patent number 12,046,588
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Dong-Han Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a through intervia through the molding...
- Patent number 12,033,976
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) semiconductor package and electronic syste...
- Patent number 12,033,991
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Tong-suk Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with dummy thermal features on interposer
- Patent number 12,021,068
- Issue date Jun 25, 2024
- Mediatek Inc.
- Bo-Jiun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including interposer and method of manufactur...
- Patent number 12,021,036
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Jongbo Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,021,051
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,009,350
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch BVA using reconstituted wafer with area array accessible...
- Patent number 11,990,382
- Issue date May 21, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,990,454
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual RDL stacked die package using vertical wire
- Patent number 11,990,449
- Issue date May 21, 2024
- Intel Corporation
- Hyoung Il Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387463
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240387434
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATI...
- Publication number 20240387498
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing the Same
- Publication number 20240387330
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTUR...
- Publication number 20240387308
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND MANUFACURING METHOD THEREOF
- Publication number 20240387485
- Publication date Nov 21, 2024
- DIODES INCORPORATED
- Shiau-Shi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240379638
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSION LARGE SYSTEM INTEGRATION
- Publication number 20240379637
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240379577
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240371814
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING EDGE WITH MULTIPLE GRADIENTS
- Publication number 20240363398
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240363365
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING THERMAL CONDUCTIVE PATTERN
- Publication number 20240363488
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20240363573
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- KYUNG DON MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363464
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240355721
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE STRUCTURE
- Publication number 20240355795
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dong-Han Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240355794
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE HAVING MULTIPLE CHIPS
- Publication number 20240347439
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE PITCH BVA USING RECONSTITUTED WAFER WITH AREA ARRAY ACCESSIBLE...
- Publication number 20240347404
- Publication date Oct 17, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20240347442
- Publication date Oct 17, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Keun Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240332268
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Kyoung Lim SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321839
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kyungdon Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBS...
- Publication number 20240321759
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTE...
- Publication number 20240321842
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Tong-Suk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240304606
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Wei-Hao CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240304583
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282713
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240266336
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240250008
- Publication date Jul 25, 2024
- Samsung Electronics Co., Ltd.
- JUSUK KANG
- H01 - BASIC ELECTRIC ELEMENTS

Special adaptations for top connections of the lowermost container

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-chip integrated fan-out package

Three-dimension large system integration

Package structure with fan-out feature

Semiconductor device packages, packaging methods, and packaged semi...

Electronic package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package with dual sides of metal routing

Method for forming chip package structure

Package structure with conductive patterns in a redistribution layer

Semiconductor device

Semiconductor package device

Method for forming semiconductor die having edge with multiple grad...

Formation method of chip package with fan-out structure

Semiconductor packages having thermal conductive pattern

Package structure and manufacturing method thereof

Package structure with through via extending through redistribution...

Semiconductor package device

Semiconductor package and method of manufacturing the same

Wafer level chip scale packaging intermediate structure apparatus a...

Chip package with redistribution structure having multiple chips

Package on package structure

Semiconductor package having a through intervia through the molding...

Package-on-package (PoP) semiconductor package and electronic syste...

Semiconductor device with dummy thermal features on interposer

Semiconductor package including interposer and method of manufactur...

Semiconductor package and method of forming the same

Semiconductor package and method of fabricating the same

Fine pitch BVA using reconstituted wafer with area array accessible...

Package structure and method of forming the same

Dual RDL stacked die package using vertical wire

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATI...

Semiconductor Package and Method of Manufacturing the Same

MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTUR...

ELECTRONIC COMPONENT PACKAGE AND MANUFACURING METHOD THEREOF

INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME

THREE-DIMENSION LARGE SYSTEM INTEGRATION

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

PACKAGE STRUCTURE

SEMICONDUCTOR DIE HAVING EDGE WITH MULTIPLE GRADIENTS

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES HAVING THERMAL CONDUCTIVE PATTERN

SEMICONDUCTOR PACKAGE DEVICE

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE ON PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

CHIP PACKAGE HAVING MULTIPLE CHIPS

FINE PITCH BVA USING RECONSTITUTED WAFER WITH AREA ARRAY ACCESSIBLE...

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBS...

PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTE...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE