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H01L2225/1041

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/1041Special adaptations for top connections of the lowermost container

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package on active silicon semiconductor packages
- Patent number 11,978,727
- Issue date May 7, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including post
- Patent number 11,967,578
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Jaekul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and package-on-package including the same
- Patent number 11,961,795
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Bongken Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 11,961,797
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Keun Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,435
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including seed structure and method of manufa...
- Patent number 11,935,858
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Seungmin Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a redistribution layer
- Patent number 11,935,856
- Issue date Mar 19, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management for package on package assembly
- Patent number 11,935,877
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Itai Leshniak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming device and package structure
- Patent number 11,929,322
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D-interconnect
- Patent number 11,929,337
- Issue date Mar 12, 2024
- Invensas LLC
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including fine redistribution patterns
- Patent number 11,923,309
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Hyunsu Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LTHC as charging barrier in info package formation
- Patent number 11,923,353
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,908,759
- Issue date Feb 20, 2024
- Mediatek Inc.
- Nan-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including composite molding structure
- Patent number 11,908,774
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Heeseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,901,252
- Issue date Feb 13, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,901,230
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad for semiconductor device
- Patent number 11,901,320
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,901,337
- Issue date Feb 13, 2024
- Kioxia Corporation
- Yasuo Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,894,333
- Issue date Feb 6, 2024
- Samsung Electronics Co., Ltd.
- Dahee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,881,472
- Issue date Jan 23, 2024
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material paste and semiconductor package
- Patent number 11,876,031
- Issue date Jan 16, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,876,083
- Issue date Jan 16, 2024
- Samsung Electronics Co., Ltd.
- Dongho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with metal line crack prevention design
- Patent number 11,862,606
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,862,570
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Jung Joo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 11,855,045
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buffer design for package integration
- Patent number 11,855,063
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with interconnection features in a seal regi...
- Patent number 11,854,987
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide layered structure and methods of forming the same
- Patent number 11,854,826
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,855,018
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer structures for integrated circuit package
- Patent number 11,848,271
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240153856
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Joonghyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240153860
- Publication date May 9, 2024
- InnoLux Corporation
- Te-Hsun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE
- Publication number 20240153879
- Publication date May 9, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE AND METHOD FOR F...
- Publication number 20240153878
- Publication date May 9, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240145360
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hwanjoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240145444
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Kiju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240145375
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyeonjeong HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240136266
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240136272
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240136263
- Publication date Apr 25, 2024
- Siliconware Precision Industries Co., Ltd.
- Hung-Kai WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128122
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing the Same
- Publication number 20240128157
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240128179
- Publication date Apr 18, 2024
- Unimicron Technology Corp.
- Jyun-Hong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING
- Publication number 20240128211
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128176
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- SEOK GEUN AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
- Publication number 20240128145
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- HYEONSEOK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240120325
- Publication date Apr 11, 2024
- Powertech Technology Inc.
- Pei-chun TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE ANTIOXIDANT LAYER
- Publication number 20240120266
- Publication date Apr 11, 2024
- SAMSUNG-RO, YEONGTONG-GU
- Sujung HYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTERCONNECT STRUCTURES
- Publication number 20240113032
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240112974
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Min Sek JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240105689
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Seokhyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240105664
- Publication date Mar 28, 2024
- Chipbond Technology Corporation
- Yu-Chung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240105536
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Seokbong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZAT...
- Publication number 20240105688
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240096815
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Jaegwon Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PACKAGE ON PACKAGE
- Publication number 20240096860
- Publication date Mar 21, 2024
- MEDIATEK INC.
- Tai-Hao PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240088075
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Sunkyoung SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN
- Publication number 20240088104
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER DESIGN FOR PACKAGE INTEGRATION
- Publication number 20240088122
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Structures for Integrated Circuit Package
- Publication number 20240079324
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Special adaptations for top connections of the lowermost container

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package on active silicon semiconductor packages

Semiconductor package including post

Semiconductor package and package-on-package including the same

Semiconductor package and fabricating method thereof

Semiconductor package and method

Semiconductor devices including seed structure and method of manufa...

Semiconductor device having a redistribution layer

Thermal management for package on package assembly

Method of forming device and package structure

3D-interconnect

Semiconductor package including fine redistribution patterns

LTHC as charging barrier in info package formation

Semiconductor device

Semiconductor package including composite molding structure

Semiconductor device package and method of manufacturing the same

Semiconductor package and manufacturing method thereof

Contact pad for semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor package

Semiconductor package

Thermal interface material paste and semiconductor package

Semiconductor package

Packages with metal line crack prevention design

Semiconductor package

Semiconductor device with discrete blocks

Buffer design for package integration

Semiconductor packages with interconnection features in a seal regi...

Metal oxide layered structure and methods of forming the same

Semiconductor device and method of manufacture

Redistribution layer structures for integrated circuit package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE AND METHOD FOR F...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES

ELECTRONIC PACKAGE

SEMICONDUCTOR PACKAGE

Semiconductor Package and Method of Manufacturing the Same

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME

STACKED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE ANTIOXIDANT LAYER

PACKAGED INTERCONNECT STRUCTURES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZAT...

SEMICONDUCTOR PACKAGE

MULTI-DIE PACKAGE ON PACKAGE

SEMICONDUCTOR PACKAGE

PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN

BUFFER DESIGN FOR PACKAGE INTEGRATION

Redistribution Layer Structures for Integrated Circuit Package