Special sequence of power, ground and signal layers in multilayer PCB

Industry

CPC
H05K2201/09327

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09327Special sequence of power, ground and signal layers in multilayer PCB

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electrically coupled trace routing configuration in multiple layers
- Patent number 11,657,862
- Issue date May 23, 2023
- Intel Corporation
- Rogelio Alfonso Moreyra Gonzalez
- G11 - INFORMATION STORAGE
Information Patent Grant
Battery module printed circuit board assembly system and method
- Patent number 11,628,728
- Issue date Apr 18, 2023
- CPS Technology Holdings LLC
- Ronald J. Dulle
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Bus bar link for battery cell interconnections in a battery module
- Patent number 11,529,873
- Issue date Dec 20, 2022
- CPS Technology Holdings LLC
- Matthew R. Tyler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method and apparatus for arranging fuses in a printed circuit board
- Patent number 11,476,659
- Issue date Oct 18, 2022
- GE Aviation Systems Limited
- David Alan Elliott
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Battery module constant current relay control systems and methods
- Patent number 11,296,389
- Issue date Apr 5, 2022
- CPS Technology Holdings LLC
- Ronald J. Dulle
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems, methods, and devices for pre-charge control of a battery m...
- Patent number 11,241,965
- Issue date Feb 8, 2022
- CPS Technology Holdings LLC
- Ronald J. Dulle
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic device comprising flexible printed circuit board having...
- Patent number 11,202,364
- Issue date Dec 14, 2021
- Samsung Electronics Co., Ltd.
- Eunseok Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual dynamic random (DDR) access memory interface design for aerosp...
- Patent number 11,109,485
- Issue date Aug 31, 2021
- UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF NASA.
- David J. Petrick
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and structure for layout and routing of PCB
- Patent number 10,869,386
- Issue date Dec 15, 2020
- ZHENGZHOU YUNHAI INFORMATION TECHNOLOGY CO., LTD.
- Deheng Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board for integrated LED driver
- Patent number 10,856,376
- Issue date Dec 1, 2020
- Lumileds LLC
- Zhihua Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board for integrated LED driver
- Patent number 10,813,182
- Issue date Oct 20, 2020
- Lumileds LLC
- Zhihua Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board with improved bonding flatness
- Patent number 10,681,803
- Issue date Jun 9, 2020
- GigaLane Co., Ltd.
- Byung Hoon Jo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual dynamic random (DDR) access memory interface design for aerosp...
- Patent number 10,667,398
- Issue date May 26, 2020
- UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF NASA.
- David J. Petrick
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method for establishing connections of a battery module
- Patent number 10,593,925
- Issue date Mar 17, 2020
- CPS Technology Holdings LLC
- John P. Dinkelman
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems, methods, and devices for pre-charge control of a battery m...
- Patent number 10,581,056
- Issue date Mar 3, 2020
- CPS Technology Holdings LLC
- Ronald J. Dulle
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Circuit board
- Patent number 10,575,396
- Issue date Feb 25, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Ryosuke Shiozaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board with narrower line width
- Patent number 10,448,499
- Issue date Oct 15, 2019
- GigaLane Co., Ltd.
- Sang Pil Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed board
- Patent number 10,375,818
- Issue date Aug 6, 2019
- NEC Corporation
- Kazuhiro Kashiwakura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-functional high-current circuit board
- Patent number 10,375,824
- Issue date Aug 6, 2019
- ZF Friedrichshafen AG
- Michael Sperber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board having three-layer dielectric body and four-...
- Patent number 10,362,675
- Issue date Jul 23, 2019
- Gigalane Co., Ltd.
- Sang Pil Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-functional high-current circuit board
- Patent number 10,334,718
- Issue date Jun 25, 2019
- ZF Friedrichshafen AG
- Wilfried Lassmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate
- Patent number 10,206,281
- Issue date Feb 12, 2019
- Onkyo Corporation
- Makoto Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory arrangement
- Patent number 10,199,077
- Issue date Feb 5, 2019
- Axis AB
- Henrik Hovmoller
- G11 - INFORMATION STORAGE
Information Patent Grant
Printed circuit board for integrated LED driver
- Patent number 10,165,640
- Issue date Dec 25, 2018
- Lumileds LLC
- Zhihua Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitive compensation structures using partially meshed ground pl...
- Patent number 10,158,339
- Issue date Dec 18, 2018
- Intel Corporation
- Jackson Chung Peng Kong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for embedding a discrete electrical device in a printed circ...
- Patent number 10,149,388
- Issue date Dec 4, 2018
- International Business Machines, Corporation
- Bruce J. Chamberlin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board structure
- Patent number 10,143,077
- Issue date Nov 27, 2018
- QUANTA COMPUTER INC.
- Chao-Hung Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedding a discrete electrical device in a printed circuit board
- Patent number 9,839,131
- Issue date Dec 5, 2017
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB based semiconductor package having integrated electrical functi...
- Patent number 9,629,246
- Issue date Apr 18, 2017
- Infineon Technologies AG
- Qianli Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and memory module including the same
- Patent number 9,520,160
- Issue date Dec 13, 2016
- Samsung Electronics Co., Ltd.
- Chil-Nam Yoon
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND A DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20240015897
- Publication date Jan 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- HYO-CHUL LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND COMMUNICATION DEVICE
- Publication number 20220369451
- Publication date Nov 17, 2022
- ZTE CORPORATION
- Jinlong LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20220174819
- Publication date Jun 2, 2022
- DONGWOO FINE-CHEM CO., LTD.
- Jongmin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING FLEXIBLE PRINTED CIRCUIT BOARD HAVING...
- Publication number 20210274645
- Publication date Sep 2, 2021
- Samsung Electronics Co., LTD
- Eunseok HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND APPARATUS INCLUDING THE SAME
- Publication number 20200245448
- Publication date Jul 30, 2020
- Samsung Electronics Co., LTD
- Yong Hee CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND STRUCTURE FOR LAYOUT AND ROUTING OF PCB
- Publication number 20200137880
- Publication date Apr 30, 2020
- ZHENGZHOU YUNHAI INFORMATION TECHNOLOGY CO., LTD.
- Deheng LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD WITH NARROWER LINE WIDTH
- Publication number 20190230785
- Publication date Jul 25, 2019
- GIGALANE CO., LTD.
- Sang Pil Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD WITH IMPROVED BONDING FLATNESS
- Publication number 20190230787
- Publication date Jul 25, 2019
- GIGALANE CO., LTD.
- Byung Hoon Jo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR ARRANGING FUSES IN A PRINTED CIRCUIT BOARD
- Publication number 20190214812
- Publication date Jul 11, 2019
- GE AVIATION SYSTEMS LIMITED
- David Alan Elliott
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PRINTED CIRCUIT BOARD FOR INTEGRATED LED DRIVER
- Publication number 20190166669
- Publication date May 30, 2019
- Lumileds LLC
- Zhihua Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD HAVING THREE-LAYER DIELECTRIC BODY AND FOUR-...
- Publication number 20180206332
- Publication date Jul 19, 2018
- GIGALANE CO., LTD.
- Sang Pil Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-FUNCTIONAL HIGH-CURRENT CIRCUIT BOARD
- Publication number 20160286639
- Publication date Sep 29, 2016
- ZF Friedrichshafen AG
- Wilfried LASSMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND MEMORY MODULE INCLUDING THE SAME
- Publication number 20140301125
- Publication date Oct 9, 2014
- Samsung Electronics Co., Ltd.
- CHIL-NAM YOON
- G11 - INFORMATION STORAGE
Information Patent Application
HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC DEVICE
- Publication number 20140176254
- Publication date Jun 26, 2014
- Murata Manufacturing Co., Ltd.
- Kanto IIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20140153200
- Publication date Jun 5, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- SHAO-YOU TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20140133115
- Publication date May 15, 2014
- Daisuke IGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20130228366
- Publication date Sep 5, 2013
- SAE MAGNETICS (H.K.) LTD.
- Fuk Ming LAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED WIRING BOARD
- Publication number 20120201087
- Publication date Aug 9, 2012
- SONY CORPORATION
- Satoshi Mizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED HIGH-FREQUENCY MODULE
- Publication number 20110284281
- Publication date Nov 24, 2011
- Murata Manufacturing Co., Ltd.
- Takahiro AKIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER FLEXIBLE PRINTED WIRING BOARD AND ELECTRONIC APPARATUS
- Publication number 20110139492
- Publication date Jun 16, 2011
- Fujitsu Limited
- Mitsuhiko Sugane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20110139489
- Publication date Jun 16, 2011
- Samsung Electro-Mechanics CO., LTD.
- Hee-Soo Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device and Process for Making a Multilayer Circuit Device Having E...
- Publication number 20110083881
- Publication date Apr 14, 2011
- Vinh T. Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY DEVICE AND COMMUNICATIONS APPARATUS
- Publication number 20100062727
- Publication date Mar 11, 2010
- Hitachi Metals, Ltd.
- Shigeru Kemmochi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SUBSTRATE HAVING A STRUCTURE FOR SUPPRESSING NOISE GENERATED IN A P...
- Publication number 20090184778
- Publication date Jul 23, 2009
- Kwang-Soo Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reduction of jitter in a semiconductor device by controlling printe...
- Publication number 20090173520
- Publication date Jul 9, 2009
- Xilinx, Inc.
- Anthony T. Duong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for Making a Multilayer Circuit Device Having Electrically...
- Publication number 20090158581
- Publication date Jun 25, 2009
- Verticaltest, Inc.
- Vinh T. Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER CIRCUIT SUBSTRATE MANUFACTURING METHOD AND MULTI-LAYER...
- Publication number 20090032285
- Publication date Feb 5, 2009
- Matsushita Electric Industrial Co., Ltd.
- Yoji Ueda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PWB AND A METHOD FOR PRODUCING THE MULTILAYER PWB
- Publication number 20090008139
- Publication date Jan 8, 2009
- Sony Ericsson Mobile Communications AB
- Patrik Lundell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed board assembly and a method
- Publication number 20080257594
- Publication date Oct 23, 2008
- Lars Engblom
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board through-hole impedance tuning using clearance size va...
- Publication number 20080075070
- Publication date Mar 27, 2008
- Force10 Networks, Inc.
- Joel R. Goergen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Special sequence of power, ground and signal layers in multilayer PCB

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrically coupled trace routing configuration in multiple layers

Battery module printed circuit board assembly system and method

Bus bar link for battery cell interconnections in a battery module

Method and apparatus for arranging fuses in a printed circuit board

Battery module constant current relay control systems and methods

Systems, methods, and devices for pre-charge control of a battery m...

Electronic device comprising flexible printed circuit board having...

Dual dynamic random (DDR) access memory interface design for aerosp...

Method and structure for layout and routing of PCB

Printed circuit board for integrated LED driver

Printed circuit board for integrated LED driver

Flexible circuit board with improved bonding flatness

Dual dynamic random (DDR) access memory interface design for aerosp...

System and method for establishing connections of a battery module

Systems, methods, and devices for pre-charge control of a battery m...

Circuit board

Flexible printed circuit board with narrower line width

Printed board

Multi-functional high-current circuit board

Flexible circuit board having three-layer dielectric body and four-...

Multi-functional high-current circuit board

Multilayer substrate

Memory arrangement

Printed circuit board for integrated LED driver

Capacitive compensation structures using partially meshed ground pl...

Method for embedding a discrete electrical device in a printed circ...

Printed circuit board structure

Embedding a discrete electrical device in a printed circuit board

PCB based semiconductor package having integrated electrical functi...

Printed circuit board and memory module including the same

Patents Applicationslast 30 patents

CIRCUIT BOARD AND A DISPLAY DEVICE INCLUDING THE SAME

CIRCUIT BOARD AND COMMUNICATION DEVICE

FLEXIBLE PRINTED CIRCUIT BOARD

ELECTRONIC DEVICE COMPRISING FLEXIBLE PRINTED CIRCUIT BOARD HAVING...

PRINTED CIRCUIT BOARD AND APPARATUS INCLUDING THE SAME

METHOD AND STRUCTURE FOR LAYOUT AND ROUTING OF PCB

FLEXIBLE PRINTED CIRCUIT BOARD WITH NARROWER LINE WIDTH

FLEXIBLE CIRCUIT BOARD WITH IMPROVED BONDING FLATNESS

METHOD AND APPARATUS FOR ARRANGING FUSES IN A PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD FOR INTEGRATED LED DRIVER

FLEXIBLE CIRCUIT BOARD HAVING THREE-LAYER DIELECTRIC BODY AND FOUR-...

MULTI-FUNCTIONAL HIGH-CURRENT CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND MEMORY MODULE INCLUDING THE SAME

HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD

MULTILAYER WIRING BOARD

PRINTED CIRCUIT BOARD

LAMINATED WIRING BOARD

LAMINATED HIGH-FREQUENCY MODULE

MULTILAYER FLEXIBLE PRINTED WIRING BOARD AND ELECTRONIC APPARATUS

PRINTED CIRCUIT BOARD

Device and Process for Making a Multilayer Circuit Device Having E...

HIGH-FREQUENCY DEVICE AND COMMUNICATIONS APPARATUS

SUBSTRATE HAVING A STRUCTURE FOR SUPPRESSING NOISE GENERATED IN A P...

Reduction of jitter in a semiconductor device by controlling printe...

Process for Making a Multilayer Circuit Device Having Electrically...

MULTI-LAYER CIRCUIT SUBSTRATE MANUFACTURING METHOD AND MULTI-LAYER...

MULTILAYER PWB AND A METHOD FOR PRODUCING THE MULTILAYER PWB

Printed board assembly and a method

Circuit board through-hole impedance tuning using clearance size va...