specially adapted for supporting large square shaped substrates

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H01L21/6734

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/6734specially adapted for supporting large square shaped substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Automated transfer of edge ring requiring rotational alignment
- Patent number 12,142,466
- Issue date Nov 12, 2024
- Lam Research Corporation
- Damon Tyrone Genetti
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Fluidic assembly MicroLED mass transfer method
- Patent number 12,132,034
- Issue date Oct 29, 2024
- eLux, Inc.
- Paul J. Schuele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encircling a semiconductor device with stacked frames on a substrate
- Patent number 12,119,296
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer supporting mechanism and method for wafer dicing
- Patent number 12,112,965
- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Bo Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separators for handling, transporting, or storing semiconductor wafers
- Patent number 12,106,988
- Issue date Oct 1, 2024
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing apparatus
- Patent number 12,094,742
- Issue date Sep 17, 2024
- Disco Corporation
- Yoshinobu Saito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier with vertical grid for supporting substrates in coater
- Patent number 12,068,142
- Issue date Aug 20, 2024
- View, Inc.
- Bo Neilan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate support apparatus and method
- Patent number 12,027,407
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yueh Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluidic assembly carrier substrate for microLED mass transfer
- Patent number 11,990,453
- Issue date May 21, 2024
- eLux Inc.
- Paul J. Schuele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magazine supporting equipment and semiconductor manufacturing appar...
- Patent number 11,955,359
- Issue date Apr 9, 2024
- Samsung Electronics Co., Ltd.
- Jun Young Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluidic assembly enabled mass transfer for microLED displays
- Patent number 11,894,350
- Issue date Feb 6, 2024
- e Lux, Inc.
- Paul J. Schuele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated guided vehicle with multistage loading structure
- Patent number 11,891,254
- Issue date Feb 6, 2024
- Samsung Electronics Co., Ltd.
- Bosung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic-layer-deposition equipment and atomiclayer-deposition method...
- Patent number 11,891,694
- Issue date Feb 6, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Loading system
- Patent number 11,834,283
- Issue date Dec 5, 2023
- Daifuku Co., Ltd.
- Takafumi Fuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holding and rotation mechanism and substrate processing a...
- Patent number 11,837,482
- Issue date Dec 5, 2023
- Ebara Corporation
- Shuichi Suemasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking apparatus and stacking method
- Patent number 11,823,935
- Issue date Nov 21, 2023
- Nikon Corporation
- Hajime Mitsuishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frames stacked on substrate encircling devices and manufacturing me...
- Patent number 11,823,991
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tray module, tray assembly including the same, and method for manuf...
- Patent number 11,810,806
- Issue date Nov 7, 2023
- Samsung Display Co., Ltd.
- Jahuem Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming dice and structure of die
- Patent number 11,810,804
- Issue date Nov 7, 2023
- Vanguard International Semiconductor Corporation
- Hsiu-Mei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transport apparatus and control method
- Patent number 11,791,188
- Issue date Oct 17, 2023
- HIRATA CORPORATION
- Hirofumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch substrate support with warped substrate capability
- Patent number 11,784,075
- Issue date Oct 10, 2023
- Applied Materials, Inc.
- Shashidhara Patel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate transfer mechanism to reduce back-side substrate contact
- Patent number 11,784,076
- Issue date Oct 10, 2023
- Applied Materials, Inc.
- Masato Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier FOUP and a method of placing a carrier
- Patent number 11,756,816
- Issue date Sep 12, 2023
- Applied Materials, Inc.
- Steven Trey Tindel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate storage container
- Patent number 11,735,449
- Issue date Aug 22, 2023
- Shin-Etsu Polymer Co., Ltd.
- Kazumasa Onuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask arrangement for masking a substrate in a processing chamber, a...
- Patent number 11,718,904
- Issue date Aug 8, 2023
- Applied Materials, Inc.
- Stefan Bangert
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Carrier with vertical grid for supporting substrates in coater
- Patent number 11,688,589
- Issue date Jun 27, 2023
- View, Inc.
- Bo Garrett Neilan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dynamic interface for providing a symmetric radio frequency return...
- Patent number 11,664,247
- Issue date May 30, 2023
- Applied Materials, Inc.
- Ravikumar Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin material handling carrier
- Patent number 11,658,059
- Issue date May 23, 2023
- II-VI DELAWARE, INC.
- John W. Stayt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacture of at least two solar cell arrangements,...
- Patent number 11,600,741
- Issue date Mar 7, 2023
- Applied Materials Italia S.R.L.
- Daniele Gislon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier device
- Patent number 11,587,808
- Issue date Feb 21, 2023
- Powertech Technology Inc.
- Shih-Chun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
WAFER CLEANING APPARATUS AND WAFER TRANSFER DEVICE
- Publication number 20240420977
- Publication date Dec 19, 2024
- Beijing NAURA Microelectronics Equipment Co., Ltd.
- Hongshuai MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371743
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER HOUSING CONTAINER AND METHOD OF MANUFACTURING SEMICONDUCTOR D...
- Publication number 20240332052
- Publication date Oct 3, 2024
- Mitsubishi Electric Corporation
- Mikihito SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT APPARATUS AND METHOD FOR MANUFACTURING SUBSTRATE...
- Publication number 20240258143
- Publication date Aug 1, 2024
- LG Display Co., Ltd.
- Dongwook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER FOR SECURING FABRICATED WAFERS
- Publication number 20240242990
- Publication date Jul 18, 2024
- CIENA CORPORATION
- Simon Savard
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
FRAME SYSTEM FOR HOLDING A SUBSTRATE
- Publication number 20240213066
- Publication date Jun 27, 2024
- Semsysco GmbH
- Ulrich Tschinderle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET, HANDLING SHEET FOR THINNED WAFER, METHOD FOR HANDLING THIN W...
- Publication number 20240203755
- Publication date Jun 20, 2024
- Shin-Etsu Chemical Co., Ltd.
- Hideto KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING APPARATUS AND SUBSTRATE TRANSFER METHOD
- Publication number 20240178034
- Publication date May 30, 2024
- TOKYO ELECTRON LIMITED
- Tadashi OBIKANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER HOLDER AND OPERATING METHOD OF THE SAME
- Publication number 20240170316
- Publication date May 23, 2024
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Xudong ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluidic Assembly MicroLED Mass Transfer Method
- Publication number 20240145443
- Publication date May 2, 2024
- eLux Inc.
- Paul J. Schuele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BOAT AND PLATE FOR WAFER BOAT
- Publication number 20240038560
- Publication date Feb 1, 2024
- Hanwha Solutions Corporation
- Kyoungsup SHIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE TRANSFER MECHANISM TO REDUCE BACK-SIDE SUBSTRATE CONTACT
- Publication number 20230420279
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Masato ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230386991
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER FILM FRAME CARRIER
- Publication number 20230360940
- Publication date Nov 9, 2023
- Applied Materials, Inc.
- Jason A. Rye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SEMICONDUCTOR STORAGE SYSTEM
- Publication number 20230343621
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Rong Syuan FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGE APPARATUS, CHARGED PARTICLE BEAM APPARATUS, AND OPTICAL INSPE...
- Publication number 20230343622
- Publication date Oct 26, 2023
- HITACHI HIGH-TECH CORPORATION
- Takanori KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC INTERFACE FOR PROVIDING A SYMMETRIC RADIO FREQUENCY RETURN...
- Publication number 20230298911
- Publication date Sep 21, 2023
- Applied Materials, Inc.
- Ravikumar Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CARRIER WITH RETICLE TEMPLATE FOR MARKING RETICLE FIELDS ON A...
- Publication number 20230282502
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Gabe Glass
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CARRIER WITH VERTICAL GRID FOR SUPPORTING SUBSTRATES IN COATER
- Publication number 20230282458
- Publication date Sep 7, 2023
- VIEW, INC.
- Bo Garrett Neilan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ASSEMBLED GRID TRAY
- Publication number 20230260811
- Publication date Aug 17, 2023
- Applied Materials, Inc.
- Shinobu ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSFER DOOR ASSEMBLIES WITH RADIATING ELEMENTS FOR SUBS...
- Publication number 20230253217
- Publication date Aug 10, 2023
- LAM RESEARCH CORPORATION
- John DREWERY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluidic Assembly Carrier Substrate for MicroLED Mass Transfer
- Publication number 20230253377
- Publication date Aug 10, 2023
- eLux Inc.
- Paul J. Schuele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin Material Handling Carrier
- Publication number 20230253235
- Publication date Aug 10, 2023
- II-VI Delaware, Inc.
- John W. Stayt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY PANEL TRANSPORT APPARATUS AND DUMMY PANEL TRANSPORT METHOD US...
- Publication number 20230215748
- Publication date Jul 6, 2023
- SAMSUNG DISPLAY CO., LTD.
- KANG-HYUK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC-LAYER-DEPOSITION EQUIPMENT AND ATOMICLAYER-DEPOSITION METHOD...
- Publication number 20230203653
- Publication date Jun 29, 2023
- SKY TECH INC.
- JING-CHENG LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER SUPPORTING MECHANISM AND METHOD FOR WAFER DICING
- Publication number 20230197487
- Publication date Jun 22, 2023
- Advanced Semiconductor Engineering, Inc.
- Bo Hua CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230163004
- Publication date May 25, 2023
- BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Liangliang ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOAD PORT ADAPTER
- Publication number 20230163008
- Publication date May 25, 2023
- NIDEC-READ CORPORATION
- Toshihide MATSUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Lifting Apparatus and Substrate Transferring Method
- Publication number 20230163010
- Publication date May 25, 2023
- ULVAC TECHNO, LTD.
- Katsunori Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20230051695
- Publication date Feb 16, 2023
- HKC Corporation Limited
- Jia-He CHENG
- H01 - BASIC ELECTRIC ELEMENTS

specially adapted for supporting large square shaped substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Automated transfer of edge ring requiring rotational alignment

Fluidic assembly MicroLED mass transfer method

Encircling a semiconductor device with stacked frames on a substrate

Wafer supporting mechanism and method for wafer dicing

Separators for handling, transporting, or storing semiconductor wafers

Processing apparatus

Carrier with vertical grid for supporting substrates in coater

Substrate support apparatus and method

Fluidic assembly carrier substrate for microLED mass transfer

Magazine supporting equipment and semiconductor manufacturing appar...

Fluidic assembly enabled mass transfer for microLED displays

Automated guided vehicle with multistage loading structure

Atomic-layer-deposition equipment and atomiclayer-deposition method...

Loading system

Substrate holding and rotation mechanism and substrate processing a...

Stacking apparatus and stacking method

Frames stacked on substrate encircling devices and manufacturing me...

Tray module, tray assembly including the same, and method for manuf...

Method of forming dice and structure of die

Transport apparatus and control method

Batch substrate support with warped substrate capability

Substrate transfer mechanism to reduce back-side substrate contact

Carrier FOUP and a method of placing a carrier

Substrate storage container

Mask arrangement for masking a substrate in a processing chamber, a...

Carrier with vertical grid for supporting substrates in coater

Dynamic interface for providing a symmetric radio frequency return...

Thin material handling carrier

Apparatus for manufacture of at least two solar cell arrangements,...

Chip carrier device

Patents Applicationslast 30 patents

WAFER CLEANING APPARATUS AND WAFER TRANSFER DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

WAFER HOUSING CONTAINER AND METHOD OF MANUFACTURING SEMICONDUCTOR D...

SUBSTRATE SUPPORT APPARATUS AND METHOD FOR MANUFACTURING SUBSTRATE...

CARRIER FOR SECURING FABRICATED WAFERS

FRAME SYSTEM FOR HOLDING A SUBSTRATE

SHEET, HANDLING SHEET FOR THINNED WAFER, METHOD FOR HANDLING THIN W...

PROCESSING APPARATUS AND SUBSTRATE TRANSFER METHOD

WAFER HOLDER AND OPERATING METHOD OF THE SAME

Fluidic Assembly MicroLED Mass Transfer Method

WAFER BOAT AND PLATE FOR WAFER BOAT

SUBSTRATE TRANSFER MECHANISM TO REDUCE BACK-SIDE SUBSTRATE CONTACT

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

WAFER FILM FRAME CARRIER

HIGH DENSITY SEMICONDUCTOR STORAGE SYSTEM

STAGE APPARATUS, CHARGED PARTICLE BEAM APPARATUS, AND OPTICAL INSPE...

DYNAMIC INTERFACE FOR PROVIDING A SYMMETRIC RADIO FREQUENCY RETURN...

WAFER CARRIER WITH RETICLE TEMPLATE FOR MARKING RETICLE FIELDS ON A...

CARRIER WITH VERTICAL GRID FOR SUPPORTING SUBSTRATES IN COATER

ASSEMBLED GRID TRAY

SUBSTRATE TRANSFER DOOR ASSEMBLIES WITH RADIATING ELEMENTS FOR SUBS...

Fluidic Assembly Carrier Substrate for MicroLED Mass Transfer

Thin Material Handling Carrier

DUMMY PANEL TRANSPORT APPARATUS AND DUMMY PANEL TRANSPORT METHOD US...

ATOMIC-LAYER-DEPOSITION EQUIPMENT AND ATOMICLAYER-DEPOSITION METHOD...

WAFER SUPPORTING MECHANISM AND METHOD FOR WAFER DICING

PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF

LOAD PORT ADAPTER

Substrate Lifting Apparatus and Substrate Transferring Method

PACKAGE STRUCTURE