specially adapted for supporting large square shaped substrates

Industry

CPC
H01L21/6734

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/6734specially adapted for supporting large square shaped substrates

Industries

Patents Grantslast 30 patents

Information Patent Grant
Magazine supporting equipment and semiconductor manufacturing appar...
- Patent number 11,955,359
- Issue date Apr 9, 2024
- Samsung Electronics Co., Ltd.
- Jun Young Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluidic assembly enabled mass transfer for microLED displays
- Patent number 11,894,350
- Issue date Feb 6, 2024
- e Lux, Inc.
- Paul J. Schuele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated guided vehicle with multistage loading structure
- Patent number 11,891,254
- Issue date Feb 6, 2024
- Samsung Electronics Co., Ltd.
- Bosung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic-layer-deposition equipment and atomiclayer-deposition method...
- Patent number 11,891,694
- Issue date Feb 6, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Loading system
- Patent number 11,834,283
- Issue date Dec 5, 2023
- Daifuku Co., Ltd.
- Takafumi Fuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holding and rotation mechanism and substrate processing a...
- Patent number 11,837,482
- Issue date Dec 5, 2023
- Ebara Corporation
- Shuichi Suemasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking apparatus and stacking method
- Patent number 11,823,935
- Issue date Nov 21, 2023
- Nikon Corporation
- Hajime Mitsuishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frames stacked on substrate encircling devices and manufacturing me...
- Patent number 11,823,991
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tray module, tray assembly including the same, and method for manuf...
- Patent number 11,810,806
- Issue date Nov 7, 2023
- Samsung Display Co., Ltd.
- Jahuem Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming dice and structure of die
- Patent number 11,810,804
- Issue date Nov 7, 2023
- Vanguard International Semiconductor Corporation
- Hsiu-Mei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transport apparatus and control method
- Patent number 11,791,188
- Issue date Oct 17, 2023
- HIRATA CORPORATION
- Hirofumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch substrate support with warped substrate capability
- Patent number 11,784,075
- Issue date Oct 10, 2023
- Applied Materials, Inc.
- Shashidhara Patel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate transfer mechanism to reduce back-side substrate contact
- Patent number 11,784,076
- Issue date Oct 10, 2023
- Applied Materials, Inc.
- Masato Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier FOUP and a method of placing a carrier
- Patent number 11,756,816
- Issue date Sep 12, 2023
- Applied Materials, Inc.
- Steven Trey Tindel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate storage container
- Patent number 11,735,449
- Issue date Aug 22, 2023
- Shin-Etsu Polymer Co., Ltd.
- Kazumasa Onuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask arrangement for masking a substrate in a processing chamber, a...
- Patent number 11,718,904
- Issue date Aug 8, 2023
- Applied Materials, Inc.
- Stefan Bangert
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Carrier with vertical grid for supporting substrates in coater
- Patent number 11,688,589
- Issue date Jun 27, 2023
- View, Inc.
- Bo Garrett Neilan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dynamic interface for providing a symmetric radio frequency return...
- Patent number 11,664,247
- Issue date May 30, 2023
- Applied Materials, Inc.
- Ravikumar Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin material handling carrier
- Patent number 11,658,059
- Issue date May 23, 2023
- II-VI DELAWARE, INC.
- John W. Stayt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacture of at least two solar cell arrangements,...
- Patent number 11,600,741
- Issue date Mar 7, 2023
- Applied Materials Italia S.R.L.
- Daniele Gislon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier device
- Patent number 11,587,808
- Issue date Feb 21, 2023
- Powertech Technology Inc.
- Shih-Chun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer supporting mechanism and method for wafer dicing
- Patent number 11,587,809
- Issue date Feb 21, 2023
- Advanced Semiconductor Engineering, Inc.
- Bo Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-conductor wafers longer than industry standard square
- Patent number 11,562,920
- Issue date Jan 24, 2023
- CUBICPV INC.
- Robertus Antonius Steeman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer separating method
- Patent number 11,551,934
- Issue date Jan 10, 2023
- Kioxia Corporation
- Sho Kawadahara
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Tensioning device, base, clamp and method for clamping mask plate
- Patent number 11,535,925
- Issue date Dec 27, 2022
- BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
- Jianpeng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacture of at least two solar cell arrangements,...
- Patent number 11,527,672
- Issue date Dec 13, 2022
- APPLIED MATERIALS ITALIA S.R.L.
- Daniele Gislon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,518,578
- Issue date Dec 6, 2022
- HKC CORPORATION LIMITED
- Jia-He Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate storing container
- Patent number 11,501,990
- Issue date Nov 15, 2022
- Miraial Co., Ltd.
- Chiaki Matsutori
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Grant
Apparatus for manufacture of at least two solar cell arrangements,...
- Patent number 11,482,640
- Issue date Oct 25, 2022
- Applied Materials Italia S.R.L.
- Daniele Gislon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus for producing mixed processing liquid
- Patent number 11,437,251
- Issue date Sep 6, 2022
- TOKYO ELECTRON LIMI TED
- Hiroki Sakurai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Fluidic Assembly MicroLED Mass Transfer Method
- Publication number 20240145443
- Publication date May 2, 2024
- eLux Inc.
- Paul J. Schuele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BOAT AND PLATE FOR WAFER BOAT
- Publication number 20240038560
- Publication date Feb 1, 2024
- Hanwha Solutions Corporation
- Kyoungsup SHIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE TRANSFER MECHANISM TO REDUCE BACK-SIDE SUBSTRATE CONTACT
- Publication number 20230420279
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Masato ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230386991
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER FILM FRAME CARRIER
- Publication number 20230360940
- Publication date Nov 9, 2023
- Applied Materials, Inc.
- Jason A. Rye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SEMICONDUCTOR STORAGE SYSTEM
- Publication number 20230343621
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Rong Syuan FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGE APPARATUS, CHARGED PARTICLE BEAM APPARATUS, AND OPTICAL INSPE...
- Publication number 20230343622
- Publication date Oct 26, 2023
- HITACHI HIGH-TECH CORPORATION
- Takanori KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC INTERFACE FOR PROVIDING A SYMMETRIC RADIO FREQUENCY RETURN...
- Publication number 20230298911
- Publication date Sep 21, 2023
- Applied Materials, Inc.
- Ravikumar Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CARRIER WITH RETICLE TEMPLATE FOR MARKING RETICLE FIELDS ON A...
- Publication number 20230282502
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Gabe Glass
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CARRIER WITH VERTICAL GRID FOR SUPPORTING SUBSTRATES IN COATER
- Publication number 20230282458
- Publication date Sep 7, 2023
- VIEW, INC.
- Bo Garrett Neilan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ASSEMBLED GRID TRAY
- Publication number 20230260811
- Publication date Aug 17, 2023
- Applied Materials, Inc.
- Shinobu ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSFER DOOR ASSEMBLIES WITH RADIATING ELEMENTS FOR SUBS...
- Publication number 20230253217
- Publication date Aug 10, 2023
- LAM RESEARCH CORPORATION
- John DREWERY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluidic Assembly Carrier Substrate for MicroLED Mass Transfer
- Publication number 20230253377
- Publication date Aug 10, 2023
- eLux Inc.
- Paul J. Schuele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin Material Handling Carrier
- Publication number 20230253235
- Publication date Aug 10, 2023
- II-VI Delaware, Inc.
- John W. Stayt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY PANEL TRANSPORT APPARATUS AND DUMMY PANEL TRANSPORT METHOD US...
- Publication number 20230215748
- Publication date Jul 6, 2023
- SAMSUNG DISPLAY CO., LTD.
- KANG-HYUK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC-LAYER-DEPOSITION EQUIPMENT AND ATOMICLAYER-DEPOSITION METHOD...
- Publication number 20230203653
- Publication date Jun 29, 2023
- SKY TECH INC.
- JING-CHENG LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER SUPPORTING MECHANISM AND METHOD FOR WAFER DICING
- Publication number 20230197487
- Publication date Jun 22, 2023
- Advanced Semiconductor Engineering, Inc.
- Bo Hua CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230163004
- Publication date May 25, 2023
- BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Liangliang ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOAD PORT ADAPTER
- Publication number 20230163008
- Publication date May 25, 2023
- NIDEC-READ CORPORATION
- Toshihide MATSUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Lifting Apparatus and Substrate Transferring Method
- Publication number 20230163010
- Publication date May 25, 2023
- ULVAC TECHNO, LTD.
- Katsunori Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20230051695
- Publication date Feb 16, 2023
- HKC Corporation Limited
- Jia-He CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-JIG WAFER CARRIER DISC INSTALLATION/UNINSTALLATION DEVICE AND M...
- Publication number 20230016132
- Publication date Jan 19, 2023
- KINGTEK ELECTRONICS TECHNOLOGY CORP.
- MAO-YEN SUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATORS FOR HANDLING, TRANSPORTING, OR STORING SEMICONDUCTOR WAFERS
- Publication number 20230005771
- Publication date Jan 5, 2023
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20220375768
- Publication date Nov 24, 2022
- TOKYO ELECTRON LIMITED
- Hiroki SAKURAI
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Method for Producing an Optoelectronic Semiconductor Component and...
- Publication number 20220376133
- Publication date Nov 24, 2022
- Osram Opto Semiconductors GmbH
- Ivar Tangring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSFER MECHANISM TO REDUCE BACK-SIDE SUBSTRATE CONTACT
- Publication number 20220351999
- Publication date Nov 3, 2022
- Applied Materials, Inc.
- Masato ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER WITH VERTICAL GRID FOR SUPPORTING SUBSTRATES IN COATER
- Publication number 20220351950
- Publication date Nov 3, 2022
- VIEW, INC.
- Bo Garrett Neilan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Rotating Disk Reactor with Split Substrate Carrier
- Publication number 20220243325
- Publication date Aug 4, 2022
- VEECO INSTRUMENTS, INC.
- Sandeep Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20220230857
- Publication date Jul 21, 2022
- TOKYO ELECTRON LIMITED
- Eiichi SUGAWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STICKING AND BREAKAGE MITIGATION
- Publication number 20220220627
- Publication date Jul 14, 2022
- LAM RESEARCH CORPORATION
- Aaron Berke
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS

specially adapted for supporting large square shaped substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Magazine supporting equipment and semiconductor manufacturing appar...

Fluidic assembly enabled mass transfer for microLED displays

Automated guided vehicle with multistage loading structure

Atomic-layer-deposition equipment and atomiclayer-deposition method...

Loading system

Substrate holding and rotation mechanism and substrate processing a...

Stacking apparatus and stacking method

Frames stacked on substrate encircling devices and manufacturing me...

Tray module, tray assembly including the same, and method for manuf...

Method of forming dice and structure of die

Transport apparatus and control method

Batch substrate support with warped substrate capability

Substrate transfer mechanism to reduce back-side substrate contact

Carrier FOUP and a method of placing a carrier

Substrate storage container

Mask arrangement for masking a substrate in a processing chamber, a...

Carrier with vertical grid for supporting substrates in coater

Dynamic interface for providing a symmetric radio frequency return...

Thin material handling carrier

Apparatus for manufacture of at least two solar cell arrangements,...

Chip carrier device

Wafer supporting mechanism and method for wafer dicing

Semi-conductor wafers longer than industry standard square

Wafer separating method

Tensioning device, base, clamp and method for clamping mask plate

Apparatus for manufacture of at least two solar cell arrangements,...

Package structure

Substrate storing container

Apparatus for manufacture of at least two solar cell arrangements,...

Substrate processing apparatus for producing mixed processing liquid

Patents Applicationslast 30 patents

Fluidic Assembly MicroLED Mass Transfer Method

WAFER BOAT AND PLATE FOR WAFER BOAT

SUBSTRATE TRANSFER MECHANISM TO REDUCE BACK-SIDE SUBSTRATE CONTACT

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

WAFER FILM FRAME CARRIER

HIGH DENSITY SEMICONDUCTOR STORAGE SYSTEM

STAGE APPARATUS, CHARGED PARTICLE BEAM APPARATUS, AND OPTICAL INSPE...

DYNAMIC INTERFACE FOR PROVIDING A SYMMETRIC RADIO FREQUENCY RETURN...

WAFER CARRIER WITH RETICLE TEMPLATE FOR MARKING RETICLE FIELDS ON A...

CARRIER WITH VERTICAL GRID FOR SUPPORTING SUBSTRATES IN COATER

ASSEMBLED GRID TRAY

SUBSTRATE TRANSFER DOOR ASSEMBLIES WITH RADIATING ELEMENTS FOR SUBS...

Fluidic Assembly Carrier Substrate for MicroLED Mass Transfer

Thin Material Handling Carrier

DUMMY PANEL TRANSPORT APPARATUS AND DUMMY PANEL TRANSPORT METHOD US...

ATOMIC-LAYER-DEPOSITION EQUIPMENT AND ATOMICLAYER-DEPOSITION METHOD...

WAFER SUPPORTING MECHANISM AND METHOD FOR WAFER DICING

PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF

LOAD PORT ADAPTER

Substrate Lifting Apparatus and Substrate Transferring Method

PACKAGE STRUCTURE

PRE-JIG WAFER CARRIER DISC INSTALLATION/UNINSTALLATION DEVICE AND M...

SEPARATORS FOR HANDLING, TRANSPORTING, OR STORING SEMICONDUCTOR WAFERS

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Method for Producing an Optoelectronic Semiconductor Component and...

SUBSTRATE TRANSFER MECHANISM TO REDUCE BACK-SIDE SUBSTRATE CONTACT

CARRIER WITH VERTICAL GRID FOR SUPPORTING SUBSTRATES IN COATER

Rotating Disk Reactor with Split Substrate Carrier

SUBSTRATE PROCESSING APPARATUS

SUBSTRATE STICKING AND BREAKAGE MITIGATION