specifically adapted to facilitate heat dissipation

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H01L23/49568

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49568specifically adapted to facilitate heat dissipation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
High power module package structures
- Patent number 12,230,601
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged stackable electronic power device for surface mounting and...
- Patent number 12,230,555
- Issue date Feb 18, 2025
- STMicroelectronics S.r.l.
- Cristiano Gianluca Stella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with increased power handling
- Patent number 12,224,218
- Issue date Feb 11, 2025
- Wolfspeed, Inc.
- Geza Dezsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,211,764
- Issue date Jan 28, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Topside air cooling of electronic packages
- Patent number 12,212,087
- Issue date Jan 28, 2025
- Cobham Advanced Electronic Solutions, Inc.
- Chul Hong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-cooling semiconductor resistor and manufacturing method thereof
- Patent number 12,205,863
- Issue date Jan 21, 2025
- MONTAGE TECHNOLOGY CO., LTD.
- Xiong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package with improved performance
- Patent number 12,199,045
- Issue date Jan 14, 2025
- Wolfspeed, Inc.
- Guy Moxey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated power switching device heat sink
- Patent number 12,199,020
- Issue date Jan 14, 2025
- American Axle & Manufacturing, Inc.
- James P. Downs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,191,289
- Issue date Jan 7, 2025
- Rohm Co., Ltd.
- Yuji Ishimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package including multi-chip unit with bonded integrated heat sp...
- Patent number 12,183,649
- Issue date Dec 31, 2024
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with multiple heat channels
- Patent number 12,176,274
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 12,176,275
- Issue date Dec 24, 2024
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device and method for manufacturing th...
- Patent number 12,166,162
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Masahiko Kobayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,165,946
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 12,142,551
- Issue date Nov 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat slug attached to a die pad for semiconductor package
- Patent number 12,136,588
- Issue date Nov 5, 2024
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,131,972
- Issue date Oct 29, 2024
- Advanced Semiconductor Engineering, Inc.
- Po-Chih Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of transistors attached to a heat sink with a periphery n...
- Patent number 12,113,002
- Issue date Oct 8, 2024
- Mitsubishi Electric Corporation
- Hiroki Katsube
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 12,094,793
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overmolded microelectronic packages containing knurled flanges and...
- Patent number 12,087,671
- Issue date Sep 10, 2024
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded packaging for wide band gap semiconductor devices
- Patent number 12,087,677
- Issue date Sep 10, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Clemens Ypil Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and mounting structure thereof
- Patent number 12,087,675
- Issue date Sep 10, 2024
- Rohm Co., Ltd.
- Ippei Yasutake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 12,080,673
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Tatsuya Kitagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package assemblies and processes for making
- Patent number 12,074,099
- Issue date Aug 27, 2024
- Materion Corporation
- Ramesh Kothandapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 12,062,599
- Issue date Aug 13, 2024
- Mitsubishi Electric Corporation
- Tatsuro Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three level interconnect clip
- Patent number 12,057,376
- Issue date Aug 6, 2024
- Infineon Technologies AG
- Azlina Kassim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating wirebonded members on package surfaces
- Patent number 12,046,542
- Issue date Jul 23, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die-package and method
- Patent number 12,014,973
- Issue date Jun 18, 2024
- Infineon Technologies Austria AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with electrodes and heat sink and manufacturing method...
- Patent number 12,014,974
- Issue date Jun 18, 2024
- Mitsubishi Electric Corporation
- Masakazu Tani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION
- Publication number 20250079261
- Publication date Mar 6, 2025
- UTAC Headquarters Pte. Ltd.
- IL Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING SUBSTRATE WITH INTERCONNECT UNITS BOUNDED B...
- Publication number 20250079307
- Publication date Mar 6, 2025
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20250079267
- Publication date Mar 6, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YAN-WEI CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE MOLD COMPOUND FLASH SUPRESSION TRENCH FOR EXPOSED DIE PAC...
- Publication number 20250079273
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo C. Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR...
- Publication number 20250070070
- Publication date Feb 27, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Mirko BERNARDONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH EMBEDDED LEADFRAME AND METHOD THEREFOR
- Publication number 20250069903
- Publication date Feb 27, 2025
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING TH...
- Publication number 20250063876
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Masahiko KOBAYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062184
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250054829
- Publication date Feb 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Po-Chih PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250054927
- Publication date Feb 13, 2025
- Rohm Co., Ltd.
- Yuji ISHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF HEAT DISSIPATION DEVICE-INTEGRATED HEAT DIS...
- Publication number 20250046675
- Publication date Feb 6, 2025
- Jong Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND VEHICLE
- Publication number 20250029928
- Publication date Jan 23, 2025
- Fuji Electric Co., Ltd.
- Tomohiro ISONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250029902
- Publication date Jan 23, 2025
- Realtek Semiconductor Corp.
- Nai-Jen Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SLUG ATTACHED TO A DIE PAD FOR SEMICONDUCTOR PACKAGE
- Publication number 20250022782
- Publication date Jan 16, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH CLIP DIRECTLY CONNECTED TO OBLONG ELECTRIC CONNECTION...
- Publication number 20250014972
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Tomasz NAEVE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREFORMED UNIT OF FAN-OUT CHIP-EMBEDDED PACKAGING PROCESS AND APPLI...
- Publication number 20250015036
- Publication date Jan 9, 2025
- LINGSEN PRECISION INDUSTRIES, LTD.
- Yu-Chia CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD OF PRODUCING A POWER SEMICOND...
- Publication number 20250006601
- Publication date Jan 2, 2025
- INFINEON TECHNOLOGIES AG
- Achim Althaus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH PRE-FORMED DIE CLIP AND LEAD FRAME
- Publication number 20250006583
- Publication date Jan 2, 2025
- Tesla, Inc.
- William Thomas Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH DIRECTIONAL LOCKING STRUCTURE
- Publication number 20250006602
- Publication date Jan 2, 2025
- Tesla, Inc.
- William Thomas Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NESTED LEAD STRUCTURE
- Publication number 20250006600
- Publication date Jan 2, 2025
- Tesla, Inc.
- William Thomas Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID-COOLED POWER MODULE
- Publication number 20250006589
- Publication date Jan 2, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- John MOOKKEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES
- Publication number 20240429136
- Publication date Dec 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Clemens Ypil QUINONES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240404932
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20240395678
- Publication date Nov 28, 2024
- Mitsubishi Electric Corporation
- Yasunari HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-CERAMIC BONDED SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395679
- Publication date Nov 28, 2024
- DOWA METALTECH CO., LTD.
- Ayumu OZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
- Publication number 20240395643
- Publication date Nov 28, 2024
- Sony Semiconductor Solutions Corporation
- Yoshihiro MAKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20240395646
- Publication date Nov 28, 2024
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SWITCHING DEVICES, COMPOSITE SUBSTRATES THEREFOR, AND...
- Publication number 20240395913
- Publication date Nov 28, 2024
- THE TRUSTEES OF INDIANA UNIVERSITY
- Haitham Kanakri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE THEREOF
- Publication number 20240395675
- Publication date Nov 28, 2024
- Rohm Co., Ltd.
- Ippei YASUTAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Single Integral Body Carrying Two Transistor Chips wit...
- Publication number 20240395676
- Publication date Nov 28, 2024
- INFINEON TECHNOLOGIES AG
- Marcus Böhm
- H01 - BASIC ELECTRIC ELEMENTS

specifically adapted to facilitate heat dissipation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High power module package structures

Packaged stackable electronic power device for surface mounting and...

Semiconductor packages with increased power handling

Semiconductor device and method of manufacturing the same

Topside air cooling of electronic packages

Self-cooling semiconductor resistor and manufacturing method thereof

Power semiconductor package with improved performance

Integrated power switching device heat sink

Semiconductor device

IC package including multi-chip unit with bonded integrated heat sp...

Multi-die package with multiple heat channels

Semiconductor device and a method of manufacturing a semiconductor...

Semiconductor light emitting device and method for manufacturing th...

Semiconductor package and manufacturing method thereof

Package including multiple semiconductor devices

Heat slug attached to a die pad for semiconductor package

Electronic device

Plurality of transistors attached to a heat sink with a periphery n...

Package with electrically insulated carrier and at least one step o...

Overmolded microelectronic packages containing knurled flanges and...

Molded packaging for wide band gap semiconductor devices

Semiconductor device and mounting structure thereof

Package with different types of semiconductor dies attached to a fl...

Semiconductor device and manufacturing method therefor

Microelectronics package assemblies and processes for making

Power semiconductor module

Three level interconnect clip

Heat-dissipating wirebonded members on package surfaces

Multi-die-package and method

Power module with electrodes and heat sink and manufacturing method...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION

SEMICONDUCTOR PACKAGING SUBSTRATE WITH INTERCONNECT UNITS BOUNDED B...

CHIP PACKAGE STRUCTURE

BACK SIDE MOLD COMPOUND FLASH SUPRESSION TRENCH FOR EXPOSED DIE PAC...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR...

SEMICONDUCTOR DEVICE WITH EMBEDDED LEADFRAME AND METHOD THEREFOR

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING TH...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF HEAT DISSIPATION DEVICE-INTEGRATED HEAT DIS...

SEMICONDUCTOR DEVICE AND VEHICLE

LEAD FRAME AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

HEAT SLUG ATTACHED TO A DIE PAD FOR SEMICONDUCTOR PACKAGE

PACKAGE WITH CLIP DIRECTLY CONNECTED TO OBLONG ELECTRIC CONNECTION...

PREFORMED UNIT OF FAN-OUT CHIP-EMBEDDED PACKAGING PROCESS AND APPLI...

POWER SEMICONDUCTOR MODULE AND METHOD OF PRODUCING A POWER SEMICOND...

SEMICONDUCTOR PACKAGE WITH PRE-FORMED DIE CLIP AND LEAD FRAME

SEMICONDUCTOR PACKAGE WITH DIRECTIONAL LOCKING STRUCTURE

SEMICONDUCTOR PACKAGE WITH NESTED LEAD STRUCTURE

FLUID-COOLED POWER MODULE

MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

METAL-CERAMIC BONDED SUBSTRATE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

SEMICONDUCTOR SWITCHING DEVICES, COMPOSITE SUBSTRATES THEREFOR, AND...

SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE THEREOF

Package with Single Integral Body Carrying Two Transistor Chips wit...