specifically adapted to facilitate heat dissipation

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H01L23/49568

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/49568specifically adapted to facilitate heat dissipation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Low stress asymmetric dual side module
- Patent number 12,362,266
- Issue date Jul 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 12,347,755
- Issue date Jul 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with dual heat dissipation structures
- Patent number 12,334,414
- Issue date Jun 17, 2025
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding sem...
- Patent number 12,322,603
- Issue date Jun 3, 2025
- STMicroelectronics S.r.l.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder mask for thermal pad of a printed circuit board to provide r...
- Patent number 12,322,692
- Issue date Jun 3, 2025
- STMicroelectronics Pte Ltd
- Daniel Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having wire pieces in bonding member
- Patent number 12,315,825
- Issue date May 27, 2025
- Denso Corporation
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, and powe...
- Patent number 12,308,304
- Issue date May 20, 2025
- Mitsubishi Electric Corporation
- Kei Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including heat sink with exposed side from enc...
- Patent number 12,300,584
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture for a cascode semiconductor device
- Patent number 12,293,961
- Issue date May 6, 2025
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package having an embedded inlay
- Patent number 12,283,538
- Issue date Apr 22, 2025
- Infineon Technologies AG
- Marcus Boehm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC die and heat spreaders with solderable thermal interface structu...
- Patent number 12,283,535
- Issue date Apr 22, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 12,255,080
- Issue date Mar 18, 2025
- Mitsubishi Electric Corporation
- Takamasa Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power module package structures
- Patent number 12,230,601
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged stackable electronic power device for surface mounting and...
- Patent number 12,230,555
- Issue date Feb 18, 2025
- STMicroelectronics S.r.l.
- Cristiano Gianluca Stella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with increased power handling
- Patent number 12,224,218
- Issue date Feb 11, 2025
- Wolfspeed, Inc.
- Geza Dezsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,211,764
- Issue date Jan 28, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Topside air cooling of electronic packages
- Patent number 12,212,087
- Issue date Jan 28, 2025
- Cobham Advanced Electronic Solutions, Inc.
- Chul Hong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-cooling semiconductor resistor and manufacturing method thereof
- Patent number 12,205,863
- Issue date Jan 21, 2025
- MONTAGE TECHNOLOGY CO., LTD.
- Xiong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package with improved performance
- Patent number 12,199,045
- Issue date Jan 14, 2025
- Wolfspeed, Inc.
- Guy Moxey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated power switching device heat sink
- Patent number 12,199,020
- Issue date Jan 14, 2025
- American Axle & Manufacturing, Inc.
- James P. Downs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,191,289
- Issue date Jan 7, 2025
- Rohm Co., Ltd.
- Yuji Ishimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package including multi-chip unit with bonded integrated heat sp...
- Patent number 12,183,649
- Issue date Dec 31, 2024
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with multiple heat channels
- Patent number 12,176,274
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 12,176,275
- Issue date Dec 24, 2024
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device and method for manufacturing th...
- Patent number 12,166,162
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Masahiko Kobayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,165,946
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 12,142,551
- Issue date Nov 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat slug attached to a die pad for semiconductor package
- Patent number 12,136,588
- Issue date Nov 5, 2024
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,131,972
- Issue date Oct 29, 2024
- Advanced Semiconductor Engineering, Inc.
- Po-Chih Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of transistors attached to a heat sink with a periphery n...
- Patent number 12,113,002
- Issue date Oct 8, 2024
- Mitsubishi Electric Corporation
- Hiroki Katsube
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250239506
- Publication date Jul 24, 2025
- ROHM CO., LTD.
- Natsuya YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING STRUCTURE AND SEMICONDUCTOR DEVICE
- Publication number 20250233057
- Publication date Jul 17, 2025
- ROHM CO., LTD.
- Oji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250226281
- Publication date Jul 10, 2025
- ROHM CO., LTD.
- Natsuya YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMERIC DIE PAD FOR DIE ISOLATION IN CHIP ON LEAD PACKAGE
- Publication number 20250210470
- Publication date Jun 26, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20250210477
- Publication date Jun 26, 2025
- QUANZHOU SANAN INTEGRATED CIRCUIT CO., LTD.
- Kai CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING THERMAL INTERPOSER LAYER
- Publication number 20250201662
- Publication date Jun 19, 2025
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250201679
- Publication date Jun 19, 2025
- DENSO CORPORATION
- Mitsuki KAWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT POWER MODULE
- Publication number 20250201680
- Publication date Jun 19, 2025
- RICHTEK TECHNOLOGY CORPORATION
- Lung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER MODULE PACKAGE STRUCTURES
- Publication number 20250192097
- Publication date Jun 12, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...
- Publication number 20250192008
- Publication date Jun 12, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE
- Publication number 20250183134
- Publication date Jun 5, 2025
- BYD COMPANY LIMITED
- Chunjiang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-CONDUCTOR DEVICE
- Publication number 20250183118
- Publication date Jun 5, 2025
- NEXPERIA B.V.
- Wai Wai Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of packaging high voltage and high current power devices
- Publication number 20250174528
- Publication date May 29, 2025
- Board of Regents, The University of Texas System
- Alex Q. Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250174529
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Byungho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE SENSOR MODULE AND ELECTRONIC DEVICE
- Publication number 20250172434
- Publication date May 29, 2025
- DENSO CORPORATION
- Kazuaki FUJISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250167063
- Publication date May 22, 2025
- Mitsubishi Electric Corporation
- Takeshi TOKOROZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULES
- Publication number 20250167066
- Publication date May 22, 2025
- Hyundai Motor Company
- Nam Sik KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250157897
- Publication date May 15, 2025
- Fuji Electric Co., Ltd.
- Yuhei NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES
- Publication number 20250140659
- Publication date May 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat-Electricity Discrete Power Module Including Two-Way Heat-Dissi...
- Publication number 20250132233
- Publication date Apr 24, 2025
- ICP TECHNOLOGY CO., LTD.
- HO-CHIEH YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250125229
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Taejun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION SUBSTRATE FOR A POWER SEMICONDUCTOR MODULE, A POWE...
- Publication number 20250118636
- Publication date Apr 10, 2025
- LX Semicon Co., Ltd.
- Min Yup JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER WITH LARGE BACK SIDE AREA
- Publication number 20250118637
- Publication date Apr 10, 2025
- INFINEON TECHNOLOGIES AG
- Lee Shuang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250112134
- Publication date Apr 3, 2025
- Mitsubishi Electric Corporation
- Yoshihisa UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105109
- Publication date Mar 27, 2025
- ROHM CO., LTD.
- Kaito INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096083
- Publication date Mar 20, 2025
- INERGY TECHNOLOGY INC.
- Li-Zheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STACKED SUBSTRATE FOR ISOLATED POWER MODULE
- Publication number 20250096084
- Publication date Mar 20, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Vijaylaxmi Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT POWER MODULE COOLING
- Publication number 20250087558
- Publication date Mar 13, 2025
- PC Krause and Associates, Inc.
- Matthew Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE INCLUDING MULTI-CHIP UNIT WITH BONDED INTEGRATED HEAT SP...
- Publication number 20250087548
- Publication date Mar 13, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION
- Publication number 20250079261
- Publication date Mar 6, 2025
- UTAC Headquarters Pte. Ltd.
- IL Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS

specifically adapted to facilitate heat dissipation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low stress asymmetric dual side module

Low stress asymmetric dual side module

Power semiconductor device with dual heat dissipation structures

Method of manufacturing semiconductor devices and corresponding sem...

Solder mask for thermal pad of a printed circuit board to provide r...

Semiconductor device having wire pieces in bonding member

Semiconductor device and method of manufacturing the same, and powe...

Semiconductor device including heat sink with exposed side from enc...

Method of manufacture for a cascode semiconductor device

Molded semiconductor package having an embedded inlay

IC die and heat spreaders with solderable thermal interface structu...

Semiconductor manufacturing apparatus and method of manufacturing s...

High power module package structures

Packaged stackable electronic power device for surface mounting and...

Semiconductor packages with increased power handling

Semiconductor device and method of manufacturing the same

Topside air cooling of electronic packages

Self-cooling semiconductor resistor and manufacturing method thereof

Power semiconductor package with improved performance

Integrated power switching device heat sink

Semiconductor device

IC package including multi-chip unit with bonded integrated heat sp...

Multi-die package with multiple heat channels

Semiconductor device and a method of manufacturing a semiconductor...

Semiconductor light emitting device and method for manufacturing th...

Semiconductor package and manufacturing method thereof

Package including multiple semiconductor devices

Heat slug attached to a die pad for semiconductor package

Electronic device

Plurality of transistors attached to a heat sink with a periphery n...

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE

JOINING STRUCTURE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

POLYMERIC DIE PAD FOR DIE ISOLATION IN CHIP ON LEAD PACKAGE

SEMICONDUCTOR PACKAGING STRUCTURE

INTEGRATED CIRCUIT DEVICE INCLUDING THERMAL INTERPOSER LAYER

SEMICONDUCTOR DEVICE

INTELLIGENT POWER MODULE

HIGH POWER MODULE PACKAGE STRUCTURES

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...

SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE

SEMI-CONDUCTOR DEVICE

Methods of packaging high voltage and high current power devices

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

TEMPERATURE SENSOR MODULE AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

POWER MODULES

SEMICONDUCTOR MODULE

PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES

Heat-Electricity Discrete Power Module Including Two-Way Heat-Dissi...

SEMICONDUCTOR DEVICE

HEAT DISSIPATION SUBSTRATE FOR A POWER SEMICONDUCTOR MODULE, A POWE...

PACKAGE CARRIER WITH LARGE BACK SIDE AREA

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

INTEGRATED STACKED SUBSTRATE FOR ISOLATED POWER MODULE

DIRECT POWER MODULE COOLING

IC PACKAGE INCLUDING MULTI-CHIP UNIT WITH BONDED INTEGRATED HEAT SP...

SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION