Spherical bumps on the substrate for external connection

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H01L23/49816

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49816Spherical bumps on the substrate for external connection

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Fan-out wafer level package structure
- Patent number 12,170,242
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure
- Patent number 12,170,236
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,170,259
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Ju Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,170,260
- Issue date Dec 17, 2024
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,170,274
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with inspection terminals
- Patent number 12,171,061
- Issue date Dec 17, 2024
- Seiko Epson Corporation
- Kyosuke Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,165,941
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, semiconductor device package and method of manufacturing...
- Patent number 12,165,963
- Issue date Dec 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,165,978
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using cavity substrate and manufacturing methods
- Patent number 12,165,986
- Issue date Dec 10, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,166,025
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic sealing structures in microelectronic assemblies having di...
- Patent number 12,165,962
- Issue date Dec 10, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabricating method thereof
- Patent number 12,165,992
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded interconnect system
- Patent number 12,167,582
- Issue date Dec 10, 2024
- GITech, Inc.
- John Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 12,159,826
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info packages including thermal dissipation blocks
- Patent number 12,159,791
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density 3D interconnect configuration
- Patent number 12,159,835
- Issue date Dec 3, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,159,863
- Issue date Dec 3, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Hyun Goo Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with front side and back side redistribution...
- Patent number 12,159,823
- Issue date Dec 3, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having hollow cylinders and method of fabricating...
- Patent number 12,159,851
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof, and substrate...
- Patent number 12,154,848
- Issue date Nov 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Chia-Wen Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing same
- Patent number 12,154,859
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Woonchun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-tier IC package including processor and high bandwidth memory
- Patent number 12,154,890
- Issue date Nov 26, 2024
- Huawei Technologies Co., Ltd.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate structure, semiconductor structure and manu...
- Patent number 12,148,726
- Issue date Nov 19, 2024
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method for manufacturing the same
- Patent number 12,148,681
- Issue date Nov 19, 2024
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with interconnectors of different density
- Patent number 12,148,689
- Issue date Nov 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Liang-Pin Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having interposer substrate, and st...
- Patent number 12,148,729
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die ultrafine pitch patch architecture of interconnect bridge...
- Patent number 12,142,568
- Issue date Nov 12, 2024
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,142,560
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having an annular frame with trunca...
- Patent number 12,142,598
- Issue date Nov 12, 2024
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH ELECTRO-OPTICAL INTERCONNECT CIRCUITRY
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- Publication date Dec 19, 2024
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- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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- Publication date Dec 19, 2024
- Samsung Electronics Co., LTD
- Byungho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240421058
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Minkyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
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CHIP PACKAGE UNIT, CHIP PACKAGE STACK MODULE, AND METHOD OF MANUFAC...
- Publication number 20240421137
- Publication date Dec 19, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
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INKJET PRINTING DEDICATED TEST PINS
- Publication number 20240421105
- Publication date Dec 19, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE
- Publication number 20240421124
- Publication date Dec 19, 2024
- VIA TECHNOLOGIES, INC.
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421054
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Seongho Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421122
- Publication date Dec 19, 2024
- KIOXIA Corporation
- Masayuki MIURA
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
- Publication number 20240421136
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Enhanced FCBGA Package
- Publication number 20240421024
- Publication date Dec 19, 2024
- STATS ChipPAC Pte Ltd.
- KyungOe Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USIN...
- Publication number 20240421055
- Publication date Dec 19, 2024
- STMicroelectronics International N.V.
- Loic Pierre Louis RENARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE
- Publication number 20240421120
- Publication date Dec 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20240413042
- Publication date Dec 12, 2024
- JCET GROUP CO., LTD.
- Shuo LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SEMICONDUCT...
- Publication number 20240413068
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Jihyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...
- Publication number 20240413137
- Publication date Dec 12, 2024
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20240413065
- Publication date Dec 12, 2024
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVING SIZE AND EFFICIENCY OF DIES
- Publication number 20240413089
- Publication date Dec 12, 2024
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240413026
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Yeongbeom KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240413040
- Publication date Dec 12, 2024
- JCET GROUP CO., LTD.
- Danfeng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUSTOM LEADFRAME FROM STANDARD PLUS PRINTED LEADFRAME PORTION
- Publication number 20240413058
- Publication date Dec 12, 2024
- TEXAS INSTRUMENTS INCORPORATED
- JO BITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...
- Publication number 20240413069
- Publication date Dec 12, 2024
- SERIPHY TECHNOLOGY CORPORATION
- TZU-WEI CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Package Structures Including Redistribution Layers
- Publication number 20240404992
- Publication date Dec 5, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH IMPROVED BOARD LEVEL RELIABILITY
- Publication number 20240404937
- Publication date Dec 5, 2024
- Murata Manufacturing Co., Ltd.
- Sami NURMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240404899
- Publication date Dec 5, 2024
- Innolux Corporation
- Ching-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240404921
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
- Publication number 20240404931
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Hyejin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES, FABRICATING METHODS THEREOF, AND MEMORY SYSTEMS
- Publication number 20240404901
- Publication date Dec 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Qi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
- Publication number 20240404902
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP COMPLEX WITH EMBEDDED INTERPOSER
- Publication number 20240404897
- Publication date Dec 5, 2024
- ADVANCED MICRO DEVICES, INC.
- Deepak Vasant KULKARNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH VERTICA...
- Publication number 20240395673
- Publication date Nov 28, 2024
- Deca Technologies USA, Inc.
- Paul R. Hoffman
- H01 - BASIC ELECTRIC ELEMENTS

Spherical bumps on the substrate for external connection

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fan-out wafer level package structure

Method for forming package structure

Semiconductor package and method of fabricating the same

Semiconductor package and method of manufacturing the same

Semiconductor packages and methods of forming same

Semiconductor apparatus with inspection terminals

Semiconductor device and method of manufacture

Substrate, semiconductor device package and method of manufacturing...

Package structure and method of manufacturing the same

Semiconductor package using cavity substrate and manufacturing methods

Semiconductor devices and methods of manufacturing

Hermetic sealing structures in microelectronic assemblies having di...

Package structure and fabricating method thereof

Shielded interconnect system

Semiconductor package and method of manufacturing the semiconductor...

Info packages including thermal dissipation blocks

High density 3D interconnect configuration

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor package with front side and back side redistribution...

Package structure having hollow cylinders and method of fabricating...

Electronic package and manufacturing method thereof, and substrate...

Semiconductor package and method of manufacturing same

Multi-tier IC package including processor and high bandwidth memory

Semiconductor substrate structure, semiconductor structure and manu...

Fan-out package structure and method for manufacturing the same

Semiconductor device with interconnectors of different density

Semiconductor package structure having interposer substrate, and st...

Multi-die ultrafine pitch patch architecture of interconnect bridge...

Semiconductor packages and methods of forming same

Semiconductor package structure having an annular frame with trunca...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE WITH ELECTRO-OPTICAL INTERCONNECT CIRCUITRY

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

CHIP PACKAGE UNIT, CHIP PACKAGE STACK MODULE, AND METHOD OF MANUFAC...

INKJET PRINTING DEDICATED TEST PINS

MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

Thermally Enhanced FCBGA Package

SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USIN...

PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SEMICONDUCT...

INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...

PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

IMPROVING SIZE AND EFFICIENCY OF DIES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CUSTOM LEADFRAME FROM STANDARD PLUS PRINTED LEADFRAME PORTION

SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...

Multi-Die Package Structures Including Redistribution Layers

ELECTRONIC COMPONENT WITH IMPROVED BOARD LEVEL RELIABILITY

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES

PACKAGE STRUCTURES, FABRICATING METHODS THEREOF, AND MEMORY SYSTEMS

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...

CHIP COMPLEX WITH EMBEDDED INTERPOSER

STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH VERTICA...