Spherical bumps on the substrate for external connection

Industry

CPC
H01L23/49816

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49816Spherical bumps on the substrate for external connection

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Fan-out semiconductor package
- Patent number 12,283,577
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection using fanout interposer chiplet
- Patent number 12,283,549
- Issue date Apr 22, 2025
- Apple Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of forming the same
- Patent number 12,283,537
- Issue date Apr 22, 2025
- Advanced Semiconductor Engineering, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper wire bond on gold bump on semiconductor die bond pad
- Patent number 12,283,559
- Issue date Apr 22, 2025
- Texas Instruments Incorporated
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having wiring patterns
- Patent number 12,278,191
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package including sub-interpose...
- Patent number 12,278,222
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with annular package lid structure
- Patent number 12,278,150
- Issue date Apr 15, 2025
- Advanced Micro Devices, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with improved die pad and solder mask...
- Patent number 12,278,205
- Issue date Apr 15, 2025
- Texas Instruments Incorporated
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having interposer substrate
- Patent number 12,272,628
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with hollow interconnectors
- Patent number 12,272,672
- Issue date Apr 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 12,272,674
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitors embedded in package substrate
- Patent number 12,274,079
- Issue date Apr 8, 2025
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-step solder-mask-defined design
- Patent number 12,269,106
- Issue date Apr 8, 2025
- Koustav Sinha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having multiple substrates
- Patent number 12,272,631
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with substrate cavity for bridge-attach
- Patent number 12,272,650
- Issue date Apr 8, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and semiconductor package including same
- Patent number 12,272,630
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Ungcheon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device structure including substrate-embedded int...
- Patent number 12,272,724
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through-package debug features
- Patent number 12,272,609
- Issue date Apr 8, 2025
- SanDisk Technologies, Inc.
- Nir Amir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna apparatus and fabrication method
- Patent number 12,272,862
- Issue date Apr 8, 2025
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-output look-up table (LUT) for use in coarse-grained field-pr...
- Patent number 12,268,012
- Issue date Apr 1, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 12,266,633
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,266,618
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Jenchun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilevel package substrate with stair shaped substrate traces
- Patent number 12,266,597
- Issue date Apr 1, 2025
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device including forming a first...
- Patent number 12,266,612
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die architecture and method of making
- Patent number 12,261,124
- Issue date Mar 25, 2025
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,261,350
- Issue date Mar 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level packaging of semiconductor devices
- Patent number 12,261,084
- Issue date Mar 25, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- George Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,261,102
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,261,104
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH SURROUNDING BUMP METALLIZATION AND METHOD...
- Publication number 20250132235
- Publication date Apr 24, 2025
- NXP USA, Inc.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250132272
- Publication date Apr 24, 2025
- InnoLux Corporation
- Jui-Jen YUEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH SIDE-BY-SIDE INTEGRATED CIRCUIT DEVICES
- Publication number 20250132292
- Publication date Apr 24, 2025
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Dual-Sided Bridge Die P...
- Publication number 20250132291
- Publication date Apr 24, 2025
- STATS ChipPAC Pte Ltd.
- DanFeng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20250132260
- Publication date Apr 24, 2025
- Ping-Jung Yang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTI-ALLOY BALL GRID ARRAY
- Publication number 20250125235
- Publication date Apr 17, 2025
- Micron Technology, Inc.
- Steve D. ABRAHAMSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC CHIP
- Publication number 20250125312
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING A HIGH THERMAL CONDUCTIVITY ELE...
- Publication number 20250125215
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250125236
- Publication date Apr 17, 2025
- SAMUNG ELECTRONICS CO., LTD.
- Hyungmin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250125237
- Publication date Apr 17, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double Bump Design for Multiple Purpose IO Connections
- Publication number 20250125296
- Publication date Apr 17, 2025
- Krishna Bharath Kolluru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PERFORMANCE POWER SUPPLY MODULE
- Publication number 20250126735
- Publication date Apr 17, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Yahong Xiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH
- Publication number 20250125249
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
- Publication number 20250125280
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Taejun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
- Publication number 20250125248
- Publication date Apr 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES
- Publication number 20250125310
- Publication date Apr 17, 2025
- Yangtze Memory Technologies Co., Ltd.
- Daiyu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE ASSEMBLY AND A METHOD FOR FORMING THE SAME
- Publication number 20250118611
- Publication date Apr 10, 2025
- STATS ChipPAC Pte Ltd.
- NamGu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250118642
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming
- Publication number 20250118609
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Inhibiting Creep of Underfill Ma...
- Publication number 20250118643
- Publication date Apr 10, 2025
- STATS ChipPAC Pte Ltd.
- Yi Jing Eric Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Semiconductor Package and Semiconductor Package
- Publication number 20250118649
- Publication date Apr 10, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HONEYCOMB PATTERN FOR CONDUCTIVE FEATURES
- Publication number 20250118694
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSELY PACKED ELECTRONIC SYSTEMS
- Publication number 20250120018
- Publication date Apr 10, 2025
- Peter C. Salmon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250118707
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED AS...
- Publication number 20250112200
- Publication date Apr 3, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS THROUGH A DIE THAT ARE ELECTRICALLY ISOLATED FROM ACTIVE CIRCU...
- Publication number 20250112139
- Publication date Apr 3, 2025
- Intel Corporation
- Abdallah BACHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISAGGREGATED PROCESSOR ARCHITECTURES USING SELECTIVE TRANSFER TEC...
- Publication number 20250112204
- Publication date Apr 3, 2025
- Intel Corporation
- Adel Elsherbini
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE THERMAL INTERPOSER FOR BACKSIDE COOLING OF DOUBLE-SIDED PA...
- Publication number 20250112106
- Publication date Apr 3, 2025
- Intel Corporation
- Tarek Gebrael
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE VOLTAGE REGULATOR IN INTEGRATED CIRCUIT PACKAGE
- Publication number 20250113503
- Publication date Apr 3, 2025
- Intel Corporation
- Nicolas Butzen
- H01 - BASIC ELECTRIC ELEMENTS

Spherical bumps on the substrate for external connection

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fan-out semiconductor package

High density interconnection using fanout interposer chiplet

Electronic package and method of forming the same

Copper wire bond on gold bump on semiconductor die bond pad

Semiconductor packages having wiring patterns

Method of fabricating semiconductor package including sub-interpose...

Semiconductor package with annular package lid structure

Semiconductor device package with improved die pad and solder mask...

Semiconductor package having interposer substrate

Semiconductor device with hollow interconnectors

Stacking structure, package structure and method of fabricating the...

Deep trench capacitors embedded in package substrate

Two-step solder-mask-defined design

Semiconductor package having multiple substrates

Microelectronic package with substrate cavity for bridge-attach

Interposer and semiconductor package including same

Three-dimensional device structure including substrate-embedded int...

Semiconductor device including through-package debug features

Antenna apparatus and fabrication method

Multi-output look-up table (LUT) for use in coarse-grained field-pr...

Semiconductor structure and method of forming the same

Semiconductor device and method of manufacturing the same

Multilevel package substrate with stair shaped substrate traces

Method for forming a semiconductor device including forming a first...

Embedded die architecture and method of making

Semiconductor package having an encapulant comprising conductive fi...

Semiconductor device package and method of manufacturing the same

Fan-out wafer level packaging of semiconductor devices

Semiconductor package and method of forming the same

Semiconductor package and method of fabricating the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH SURROUNDING BUMP METALLIZATION AND METHOD...

ELECTRONIC DEVICE

DEVICE WITH SIDE-BY-SIDE INTEGRATED CIRCUIT DEVICES

Semiconductor Device and Method of Making a Dual-Sided Bridge Die P...

CHIP PACKAGE

SEMICONDUCTOR DEVICE WITH MULTI-ALLOY BALL GRID ARRAY

SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC CHIP

INTEGRATED CIRCUIT DEVICE INCLUDING A HIGH THERMAL CONDUCTIVITY ELE...

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Double Bump Design for Multiple Purpose IO Connections

HIGH-PERFORMANCE POWER SUPPLY MODULE

SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD

BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT

SEMICONDUCTOR PACKAGE STRUCTURES

ELECTRONIC PACKAGE ASSEMBLY AND A METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

Semiconductor Packages and Methods of Forming

Semiconductor Device and Method of Inhibiting Creep of Underfill Ma...

Method for Forming Semiconductor Package and Semiconductor Package

HONEYCOMB PATTERN FOR CONDUCTIVE FEATURES

DENSELY PACKED ELECTRONIC SYSTEMS

INTEGRATED CIRCUIT PACKAGES AND METHODS

HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED AS...

VIAS THROUGH A DIE THAT ARE ELECTRICALLY ISOLATED FROM ACTIVE CIRCU...

DISAGGREGATED PROCESSOR ARCHITECTURES USING SELECTIVE TRANSFER TEC...

FLEXIBLE THERMAL INTERPOSER FOR BACKSIDE COOLING OF DOUBLE-SIDED PA...

CAPACITIVE VOLTAGE REGULATOR IN INTEGRATED CIRCUIT PACKAGE