Spherical bumps on the substrate for external connection

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H01L23/49816

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49816Spherical bumps on the substrate for external connection

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device and multi-level interposer with RF sloped via and...
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Information Patent Grant
Package and printed circuit board attachment
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- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
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Information Patent Grant
Honeycomb pattern for conductive features
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- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
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Information Patent Grant
Die to die high-speed communication without discrete amplifiers bet...
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- Issue date Jan 21, 2025
- Intel Corporation
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Semiconductor device and manufacturing method thereof
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- Kioxia Corporation
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Information Patent Grant
Symmetrical substrate for semiconductor packaging
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- Taiwan Semiconductor Manufacturing Co., Ltd
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Ball grid array for a semiconductor integrated circuit device
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- Issue date Jan 14, 2025
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- Parabellum Strategic Opportunities Fund LLC
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Packaging structure and method for preparing same
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- Issue date Jan 14, 2025
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
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Information Patent Grant
Dielectric sidewall protection and sealing for semiconductor device...
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- Issue date Jan 14, 2025
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Information Patent Grant
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Information Patent Grant
Semiconductor package and manufacturing method thereof
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- Issue date Jan 7, 2025
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Information Patent Grant
Stacked via structure disposed on a conductive pillar of a semicond...
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Integrated circuit packages having stress-relieving features
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Semiconductor package
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Information Patent Grant
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- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
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- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
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Information Patent Grant
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Semiconductor module, method for manufacturing same, and semiconduc...
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Semiconductor structure having an anti-arcing pattern disposed on a...
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- Sheng-An Kuo
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Information Patent Grant
Interconnect substrate and method of making interconnect substrate
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Ball grid array current meter with a current sense wire
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Information Patent Grant
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Information Patent Grant
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- Issue date Dec 24, 2024
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- Chang-Lin Yeh
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Information Patent Grant
Fan-out wafer level package structure
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- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
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- Publication number 20250022842
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RADIO FREQUENCY MODULE AND MANUFACTURING METHOD OF RADIO FREQUENCY...
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WAFER-LEVEL STACKED DIE STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS
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- Chih Yuan Chang
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SEMICONDUCTOR PACKAGE
- Publication number 20250022866
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
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SEMICONDUCTOR PACKAGE COMPRISING STIFFENER AND SCREW
- Publication number 20250022772
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- Samsung Electronics Co., Ltd.
- Insik HAN
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ELECTRONIC DEVICE WITH HOMOMORPHIC ENCRYPTION
- Publication number 20250023708
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SEMICONDUCTOR PACKAGE
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Antenna-in-Package Devices and Methods of Making
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- HunTeak Lee
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SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE
- Publication number 20250015483
- Publication date Jan 9, 2025
- MEDIATEK INC.
- Wen-Chou Wu
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SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250015064
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- Samsung Electronics Co., Ltd.
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SEMICONDUCTOR PACKAGE HAVING INCREASED RELIABILITY
- Publication number 20250014957
- Publication date Jan 9, 2025
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- Jingu KIM
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ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
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EMBEDDED INTEGRATED STACK CAPACITOR (ISC) IN SUBSTRATE BUILD-UP LAYER
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- Publication date Jan 9, 2025
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- Rui ZHANG
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- Michael SU
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MICROELECTRONIC DEVICES INCLUDING RECESSES IN AN ENCAPSULANT MATERI...
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- Manish Nayini
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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- Samsung Electronics Co., Ltd.
- Yun-Seok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
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Multi-Die Fine Grain Integrated Voltage Regulation
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- Publication date Jan 9, 2025
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- Jared L. Zerbe
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SEMICONDUCTOR STRUCTURE WITH DAISY CHAIN AND A METHOD OF MANUFACTUR...
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- Chieh-En Chen
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- Jaeean LEE
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- Publication date Jan 9, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
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SEMICONDUCTOR PACKAGES
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- SK HYNIX INC.
- Won Duck JUNG
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Information Patent Application
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- Samsung Electronics Co., Ltd.
- CHULWOO KIM
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Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250006625
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006686
- Publication date Jan 2, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Hun Bae
- H01 - BASIC ELECTRIC ELEMENTS

Spherical bumps on the substrate for external connection

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device and multi-level interposer with RF sloped via and...

Package and printed circuit board attachment

Honeycomb pattern for conductive features

Die to die high-speed communication without discrete amplifiers bet...

Semiconductor device and manufacturing method thereof

Symmetrical substrate for semiconductor packaging

Ball grid array for a semiconductor integrated circuit device

Multi-die package structures including redistribution layers

Packaging structure and method for preparing same

Dielectric sidewall protection and sealing for semiconductor device...

Semiconductor package comprising first molding layer and second mol...

Semiconductor package

Semiconductor package and manufacturing method thereof

Stacked via structure disposed on a conductive pillar of a semicond...

Integrated circuit packages having stress-relieving features

Hybrid interposer of glass and silicon to reduce thermal crosstalk

Semiconductor package

Semiconductor package

Semiconductor device package and method of manufacture

Semiconductor package and manufacturing method thereof

Semiconductor device packaging methods

Semiconductor package and method for manufacturing the same

Semiconductor module, method for manufacturing same, and semiconduc...

Semiconductor package

Semiconductor structure having an anti-arcing pattern disposed on a...

Interconnect substrate and method of making interconnect substrate

Ball grid array current meter with a current sense wire

Semiconductor package

Semiconductor device package and method for manufacturing the same

Fan-out wafer level package structure

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

RADIO FREQUENCY MODULE AND MANUFACTURING METHOD OF RADIO FREQUENCY...

WAFER-LEVEL STACKED DIE STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE COMPRISING STIFFENER AND SCREW

ELECTRONIC DEVICE WITH HOMOMORPHIC ENCRYPTION

SEMICONDUCTOR PACKAGE

Antenna-in-Package Devices and Methods of Making

SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE HAVING INCREASED RELIABILITY

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

CHIP SYSTEM AND ELECTRONIC DEVICE

EMBEDDED INTEGRATED STACK CAPACITOR (ISC) IN SUBSTRATE BUILD-UP LAYER

Semiconductor Package with Integrated Capacitors

MICROELECTRONIC DEVICES INCLUDING RECESSES IN AN ENCAPSULANT MATERI...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Multi-Die Fine Grain Integrated Voltage Regulation

SEMICONDUCTOR STRUCTURE WITH DAISY CHAIN AND A METHOD OF MANUFACTUR...

SEMICONDUCTOR PACKAGE

INTEGRATED CHIP INCLUDING THROUGH-SUBSTRATE VIA (TSV) AND LANDING S...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

3D-INTERCONNECT

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF