Spherical bumps on the substrate for external connection

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H01L23/49816

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49816Spherical bumps on the substrate for external connection

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chiplet device
- Patent number 12,230,578
- Issue date Feb 18, 2025
- Global Unichip Corporation
- Sheng-Fan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies employing copper in multiple locations
- Patent number 12,230,596
- Issue date Feb 18, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit structures and methods of form...
- Patent number 12,230,549
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,230,557
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Sangwon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to enable 30 microns pitch EMIB or below
- Patent number 12,230,563
- Issue date Feb 18, 2025
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die on interposer packages
- Patent number 12,230,582
- Issue date Feb 18, 2025
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package device
- Patent number 12,230,558
- Issue date Feb 18, 2025
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional pad structure and interconnection structure for e...
- Patent number 12,230,562
- Issue date Feb 18, 2025
- Mediatek Inc.
- Chin-Chiang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and electronic component package including th...
- Patent number 12,230,586
- Issue date Feb 18, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Koo Woong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die architecture and method of making
- Patent number 12,224,245
- Issue date Feb 11, 2025
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,224,226
- Issue date Feb 11, 2025
- Innolux Corporation
- Chin-Lung Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,224,183
- Issue date Feb 11, 2025
- Chipbond Technology Corporation
- Shrane-Ning Jenq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and substrate
- Patent number 12,224,236
- Issue date Feb 11, 2025
- Kioxia Corporation
- Hideo Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a dualized signal wiring structure
- Patent number 12,224,260
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Heejung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with reinforced substrates
- Patent number 12,218,079
- Issue date Feb 4, 2025
- Micron Technology, Inc.
- Koustav Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,218,092
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Moonyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 12,218,098
- Issue date Feb 4, 2025
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic component device, and electroni...
- Patent number 12,218,019
- Issue date Feb 4, 2025
- Resonac Corporation
- Tomoaki Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structure with planar top surfaces
- Patent number 12,218,022
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,218,044
- Issue date Feb 4, 2025
- Renesas Electronics Corporation
- Nobuhiro Kinoshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure with molding layer
- Patent number 12,218,104
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a photonic semiconductor...
- Patent number 12,218,114
- Issue date Feb 4, 2025
- STATS ChipPAC Pte. Ltd.
- KyungOe Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for heat dissipation
- Patent number 12,218,026
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,218,039
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded silicon interconnects in bridges for integrated-circuit pack...
- Patent number 12,218,064
- Issue date Feb 4, 2025
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and semiconductor package including the same
- Patent number 12,218,099
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Jungsoo Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a dummy pattern
- Patent number 12,211,777
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Minjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strip substrate having protection pattern on sidewall of conductive...
- Patent number 12,211,783
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Sunnyeong Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dummy pattern not electrically connected...
- Patent number 12,211,806
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Jin-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method and Stiffeners for Package Level Warpage Modulation
- Publication number 20250062168
- Publication date Feb 20, 2025
- Intel Corporation
- Justin WHETTEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Gradually Changed Dummy Pattern Distribution Around TSVs
- Publication number 20250062227
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Yen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND WIRING SUBSTRATE INCLUDED IN THE SAME
- Publication number 20250062244
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- KANG JOON LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR DELAMINATION MITIGATION IN A SEMICONDUCTOR DEVICE
- Publication number 20250062246
- Publication date Feb 20, 2025
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package With Thermal Conductive Structure and the Met...
- Publication number 20250062181
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING TH...
- Publication number 20250062202
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yi Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20250062249
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20250062173
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TREATMENT IN INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250062201
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND ELECTRONIC DEVICES INCLUDING THE SAME
- Publication number 20250062212
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Ki Won BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250062221
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND INTEGRATED CIRCUIT DEVICE
- Publication number 20250062238
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Bong Wee YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062252
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Jaeean LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062281
- Publication date Feb 20, 2025
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- Yueh-Ming Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT DEVICES
- Publication number 20250062285
- Publication date Feb 20, 2025
- QUALCOMM Incorporated
- Yue LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250054853
- Publication date Feb 13, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyun Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE CARRIER, METHOD OF MAKING AND METHOD OF USING THE COMPOSI...
- Publication number 20250054821
- Publication date Feb 13, 2025
- Yibu Semiconductor Co., Ltd.
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS
- Publication number 20250054775
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20250054849
- Publication date Feb 13, 2025
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A CORE MODULE
- Publication number 20250054850
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Bongsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250054891
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Ju Bin SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACAKGE AND METHOD FOR FORMING THE SAME
- Publication number 20250054925
- Publication date Feb 13, 2025
- STATS ChipPAC Pte Ltd.
- YongHyuk JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250056911
- Publication date Feb 13, 2025
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20250054870
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- WOONCHUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY
- Publication number 20250054876
- Publication date Feb 13, 2025
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250054896
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Jooyoung OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING DIES ARRANGED FACE-TO-FACE
- Publication number 20250054912
- Publication date Feb 13, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Julius Kovats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF
- Publication number 20250046670
- Publication date Feb 6, 2025
- Siliconware Precision Industries Co., Ltd.
- Wei-Jhen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046698
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Sojeong HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Density 3D Interconnect Configuration
- Publication number 20250046715
- Publication date Feb 6, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS

Spherical bumps on the substrate for external connection

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor chiplet device

Electronics assemblies employing copper in multiple locations

Three-dimensional integrated circuit structures and methods of form...

Semiconductor package

Method to enable 30 microns pitch EMIB or below

Embedded die on interposer packages

Semiconductor device and method of forming micro interconnect struc...

Package device

Three-dimensional pad structure and interconnection structure for e...

Printed circuit board and electronic component package including th...

Embedded die architecture and method of making

Electronic device

Method of manufacturing semiconductor device

Semiconductor device and substrate

Semiconductor package including a dualized signal wiring structure

Semiconductor devices with reinforced substrates

Semiconductor package and method of manufacturing semiconductor pac...

Chip assembling on adhesion layer or dielectric layer, extending be...

Method for manufacturing electronic component device, and electroni...

Passivation structure with planar top surfaces

Semiconductor device

Method for forming chip package structure with molding layer

Semiconductor device and method of making a photonic semiconductor...

Package structure for heat dissipation

Semiconductor package

Molded silicon interconnects in bridges for integrated-circuit pack...

Interposer and semiconductor package including the same

Semiconductor package including a dummy pattern

Strip substrate having protection pattern on sidewall of conductive...

Semiconductor package with dummy pattern not electrically connected...

Patents Applicationslast 30 patents

Method and Stiffeners for Package Level Warpage Modulation

Gradually Changed Dummy Pattern Distribution Around TSVs

SEMICONDUCTOR PACKAGE AND WIRING SUBSTRATE INCLUDED IN THE SAME

STRUCTURE FOR DELAMINATION MITIGATION IN A SEMICONDUCTOR DEVICE

Semiconductor Package With Thermal Conductive Structure and the Met...

PACKAGE STRUCTURE, SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING TH...

PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SURFACE TREATMENT IN INTEGRATED CIRCUIT PACKAGE AND METHOD

SEMICONDUCTOR PACKAGES AND ELECTRONIC DEVICES INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

STACKED INTEGRATED CIRCUIT DEVICES

SEMICONDUCTOR DEVICES METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

COMPOSITE CARRIER, METHOD OF MAKING AND METHOD OF USING THE COMPOSI...

INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE HAVING A CORE MODULE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACAKGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT DEVICE INCLUDING DIES ARRANGED FACE-TO-FACE

ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF

SEMICONDUCTOR PACKAGE

High Density 3D Interconnect Configuration