Spherical bumps on the substrate for external connection

Industry

CPC
H01L23/49816

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49816Spherical bumps on the substrate for external connection

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure
- Patent number 12,300,679
- Issue date May 13, 2025
- Mediatek Inc.
- Yi-Jyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Densely packed electronic systems
- Patent number 12,302,497
- Issue date May 13, 2025
- Peter C. Salmon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 12,300,509
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Junyong Chung
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor package
- Patent number 12,300,589
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Gwangjae Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses including ball grid arrays and associated systems
- Patent number 12,300,597
- Issue date May 13, 2025
- Micron Technology, Inc.
- David K. Ovard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with lid
- Patent number 12,300,632
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive and thermal interface material on a plurality of dies cove...
- Patent number 12,300,574
- Issue date May 13, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package and electronic device including the same
- Patent number 12,300,594
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Sun Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,668
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Raehyung Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency heat dissipation using discrete thermal interface m...
- Patent number 12,300,568
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming same
- Patent number 12,300,590
- Issue date May 13, 2025
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,675
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Jiyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics integrated circuit package
- Patent number 12,293,974
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,293,989
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Minjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,293,991
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure and method for forming the same
- Patent number 12,295,149
- Issue date May 6, 2025
- ANHUI CAMBRICON INFORMATION TECHNOLOGY CO., LTD.
- Shuai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor EMI shielding component, semiconductor package struct...
- Patent number 12,293,976
- Issue date May 6, 2025
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- E-Tung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pitch ball grid array
- Patent number 12,288,741
- Issue date Apr 29, 2025
- Juniper Networks, Inc.
- Granthana Kattehalli Rangaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated capacitors
- Patent number 12,288,756
- Issue date Apr 29, 2025
- Chipletz, Inc.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,288,745
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Donguk Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement comprising an integrated circuit package and a heatsink...
- Patent number 12,288,757
- Issue date Apr 29, 2025
- SIVERS WIRELESS AB
- Erik Öjefors
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,288,751
- Issue date Apr 29, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with open cavity and method therefor
- Patent number 12,288,766
- Issue date Apr 29, 2025
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with embedded wiring on re-distributed bumps
- Patent number 12,288,770
- Issue date Apr 29, 2025
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 12,283,577
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection using fanout interposer chiplet
- Patent number 12,283,549
- Issue date Apr 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of forming the same
- Patent number 12,283,537
- Issue date Apr 22, 2025
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper wire bond on gold bump on semiconductor die bond pad
- Patent number 12,283,559
- Issue date Apr 22, 2025
- Texas Instruments Incorporated
- Lin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having wiring patterns
- Patent number 12,278,191
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Youngchan Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package including sub-interpose...
- Patent number 12,278,222
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE
- Publication number 20250149404
- Publication date May 8, 2025
- Shinko Electric Industries Co., Ltd.
- Shinichiro Sekijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE ON INTERPOSER PACKAGES
- Publication number 20250149462
- Publication date May 8, 2025
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON CHIP SCALE PACKAGE COMPRISING STANDARDIZED COM...
- Publication number 20250149505
- Publication date May 8, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149518
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Yejin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH AT LEAST ONE PRE-MADE CONDUCTIVE UNIT AN...
- Publication number 20250149420
- Publication date May 8, 2025
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149422
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Sangwon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON CHIP SCALE PACKAGE COMPRISING STANDARDIZED COM...
- Publication number 20250149504
- Publication date May 8, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW
- Publication number 20250149433
- Publication date May 8, 2025
- Intel Corporation
- Hongxia FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250149486
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250149489
- Publication date May 8, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250149396
- Publication date May 8, 2025
- Advanced Semiconductor Engineering, Inc.
- Po-Jen CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250149503
- Publication date May 8, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149516
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140746
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140635
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Chung-Yu Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250140645
- Publication date May 1, 2025
- InnoLux Corporation
- Chin-Lung TING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140671
- Publication date May 1, 2025
- Innolux Corporation
- Cheng-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND SEMICONDUCTOR MODULE INCLUDING THE SAME
- Publication number 20250140678
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Jihyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140731
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Sung-Hua Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEGATIVE-TONE ORGANIC DIELECTRIC WITH FINE METAL PILLAR RESOLUTION
- Publication number 20250140609
- Publication date May 1, 2025
- International Business Machines Corporation
- Nicholas Latham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH SELF-ALIGNED VIA-TO-JUMPER CONNECTIONS
- Publication number 20250142948
- Publication date May 1, 2025
- Intel Corporation
- Robin Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250140755
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Jungsoo BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH MULTIPLE CHIP STRUCTURES
- Publication number 20250140757
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION STRUCTURE WITH PLANAR TOP SURFACES
- Publication number 20250140627
- Publication date May 1, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250140643
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20250140667
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20250140666
- Publication date May 1, 2025
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SURROUNDING BUMP METALLIZATION AND METHOD...
- Publication number 20250132235
- Publication date Apr 24, 2025
- NXP USA, Inc.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS

Spherical bumps on the substrate for external connection

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package structure

Densely packed electronic systems

Method of manufacturing semiconductor package

Semiconductor package

Apparatuses including ball grid arrays and associated systems

Chip package with lid

Adhesive and thermal interface material on a plurality of dies cove...

Fan-out semiconductor package and electronic device including the same

Semiconductor package

High efficiency heat dissipation using discrete thermal interface m...

Package structure and method for forming same

Semiconductor package

Photonics integrated circuit package

Semiconductor package

Semiconductor packages and methods of forming same

Capacitor structure and method for forming the same

Semiconductor EMI shielding component, semiconductor package struct...

Multi-pitch ball grid array

Semiconductor package with integrated capacitors

Semiconductor package

Arrangement comprising an integrated circuit package and a heatsink...

Microelectronic assemblies

Semiconductor device with open cavity and method therefor

Semiconductor packages with embedded wiring on re-distributed bumps

Fan-out semiconductor package

High density interconnection using fanout interposer chiplet

Electronic package and method of forming the same

Copper wire bond on gold bump on semiconductor die bond pad

Semiconductor packages having wiring patterns

Method of fabricating semiconductor package including sub-interpose...

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE

EMBEDDED DIE ON INTERPOSER PACKAGES

LOGIC DRIVE BASED ON CHIP SCALE PACKAGE COMPRISING STANDARDIZED COM...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE WITH AT LEAST ONE PRE-MADE CONDUCTIVE UNIT AN...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

SEMICONDUCTOR PACKAGE

LOGIC DRIVE BASED ON CHIP SCALE PACKAGE COMPRISING STANDARDIZED COM...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

Multi-Die Fine Grain Integrated Voltage Regulation

PACKAGE STRUCTURE

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SUBSTRATE AND SEMICONDUCTOR MODULE INCLUDING THE SAME

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

NEGATIVE-TONE ORGANIC DIELECTRIC WITH FINE METAL PILLAR RESOLUTION

INTEGRATED CIRCUIT DEVICES WITH SELF-ALIGNED VIA-TO-JUMPER CONNECTIONS

INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

CHIP PACKAGE STRUCTURE WITH MULTIPLE CHIP STRUCTURES

PASSIVATION STRUCTURE WITH PLANAR TOP SURFACES

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE WITH SURROUNDING BUMP METALLIZATION AND METHOD...