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H01L2224/1713

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1713Square or rectangular array

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,142,544
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including test bumps
- Patent number 12,125,753
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Taehyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,113,048
- Issue date Oct 8, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,990,441
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method
- Patent number 11,990,442
- Issue date May 21, 2024
- STMicroelectron S.r.l.
- Cristina Somma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure design in fan-out package
- Patent number 11,984,405
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,955,453
- Issue date Apr 9, 2024
- Ultra Display Technology Corp.
- Hsien-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Infrared sensor and imaging apparatus
- Patent number 11,901,389
- Issue date Feb 13, 2024
- NEC Corporation
- Tomo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative surfaces for conductive pad layers of silicon bridges f...
- Patent number 11,848,259
- Issue date Dec 19, 2023
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including power connection lines
- Patent number 11,830,813
- Issue date Nov 28, 2023
- Samsung Electronics Co., Ltd.
- Jisoo Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,830,845
- Issue date Nov 28, 2023
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module
- Patent number 11,825,603
- Issue date Nov 21, 2023
- Murata Manufacturing Co., Ltd.
- Tomomi Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of direct bonding semiconductor components
- Patent number 11,810,892
- Issue date Nov 7, 2023
- Imec VZW
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit and electronic device comprising a plurality of...
- Patent number 11,742,311
- Issue date Aug 29, 2023
- STMicroelectronics S.r.l.
- Angelo Scuderi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with solder array thermal interface materia...
- Patent number 11,735,552
- Issue date Aug 22, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-conductor package structure
- Patent number 11,710,713
- Issue date Jul 25, 2023
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 11,616,047
- Issue date Mar 28, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate and interconnect device configured f...
- Patent number 11,562,962
- Issue date Jan 24, 2023
- QUALCOMM Incorporated
- Joan Rey Villarba Buot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising interconnects embedded in a solder resist layer
- Patent number 11,551,939
- Issue date Jan 10, 2023
- QUALCOMM Incorporated
- Kun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for cooling three-dimensional integrated circuits
- Patent number 11,532,613
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 11,469,206
- Issue date Oct 11, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,456,268
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,424,211
- Issue date Aug 23, 2022
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure design in fan-out package
- Patent number 11,424,189
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an inductor
- Patent number 11,393,782
- Issue date Jul 19, 2022
- Renesas Electronics Corporation
- Yasutaka Nakashiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package assembly with enhanced solder resist crack resistance
- Patent number 11,315,858
- Issue date Apr 26, 2022
- Xilinx, Inc.
- Yu Hsiang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-conductor package structure
- Patent number 11,257,778
- Issue date Feb 22, 2022
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump layout for coplanarity improvement
- Patent number 11,211,318
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ling-Wei Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 11,063,009
- Issue date Jul 13, 2021
- Renesas Electronics Corporation
- Kenji Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module
- Patent number 11,057,997
- Issue date Jul 6, 2021
- Murata Manufacturing Co., Ltd.
- Tomomi Yasuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240297139
- Publication date Sep 5, 2024
- Samsung Electronics Co., Ltd.
- Namhoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240222330
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Youngjun YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE BUMPS OF A PACKAGE SUBSTRATE
- Publication number 20240203860
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Ashish RAJ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20240203930
- Publication date Jun 20, 2024
- Adeia Semiconductor Solutions LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT
- Publication number 20240162192
- Publication date May 16, 2024
- International Business Machines Corporation
- Arvind Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE HAVING BALL GRID ARRAY SUBSTRATE WITH SIGNAL AND PO...
- Publication number 20240145363
- Publication date May 2, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Vivek SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240088082
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Sang Ho Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240057349
- Publication date Feb 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND BUMP ARRANGEMENT METHOD
- Publication number 20240021557
- Publication date Jan 18, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuo SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE, SEMICONDUCTOR PACKAGE, AND FABRICATING METHOD THEREOF
- Publication number 20240021558
- Publication date Jan 18, 2024
- Powertech Technology Inc.
- Shang-Yu CHANG-CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SUBSTRATE FOR ELECTRICAL CONNECTION
- Publication number 20230369280
- Publication date Nov 16, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...
- Publication number 20230343738
- Publication date Oct 26, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND ELECTRONIC DEVICE COMPRISING A PLURALITY OF...
- Publication number 20230335524
- Publication date Oct 19, 2023
- STMicroelectronics S.r.l.
- Angelo SCUDERI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH SENSOR FACE STRESS PROTECTION
- Publication number 20230317662
- Publication date Oct 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER
- Publication number 20230317545
- Publication date Oct 5, 2023
- Intel Corporation
- Pilin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT FLIP CHIP SEMICONDUCTOR PACKAGE
- Publication number 20230317673
- Publication date Oct 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230230946
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Seongyo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND METHOD FOR PREPARING THE SAME, AND MET...
- Publication number 20230197666
- Publication date Jun 22, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20230133235
- Publication date May 4, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD...
- Publication number 20230065429
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230069511
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- HYUNSOO CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20230057061
- Publication date Feb 23, 2023
- Samsung Electronics Co., Ltd.
- Seyeong SEOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230034654
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Structure Design in Fan-Out Package
- Publication number 20220352080
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER SHEET FOR MOLD UNDERFILL ENCAPSULATION, METHOD FOR MOLD...
- Publication number 20220310546
- Publication date Sep 29, 2022
- NAGASE CHEMTEX CORPORATION
- Daisuke MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE UNDERFILL FORMATION FOR AN INTEGRATED CIRCUIT ASS...
- Publication number 20220181289
- Publication date Jun 9, 2022
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VOID FILLING FOR AN INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20220181294
- Publication date Jun 9, 2022
- Intel Corporation
- Tyler Leuten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD
- Publication number 20220173064
- Publication date Jun 2, 2022
- STMicroelectronics S.r.l
- Cristina SOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-CONDUCTOR PACKAGE STRUCTURE
- Publication number 20220173065
- Publication date Jun 2, 2022
- Intel Corporation
- Xinhua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220165696
- Publication date May 26, 2022
- Samsung Electronics Co., Ltd.
- NAMHOON KIM
- H01 - BASIC ELECTRIC ELEMENTS

Square or rectangular array

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Semiconductor package including test bumps

Microelectronic assemblies

Semiconductor package

Semiconductor device and corresponding method

Pad structure design in fan-out package

Electronic device

Infrared sensor and imaging apparatus

Alternative surfaces for conductive pad layers of silicon bridges f...

Semiconductor devices including power connection lines

Package-on-package assembly with wire bonds to encapsulation surface

High-frequency module

Method of direct bonding semiconductor components

Integrated circuit and electronic device comprising a plurality of...

Microelectronic package with solder array thermal interface materia...

Semi-conductor package structure

Microelectronic assemblies

Package comprising a substrate and interconnect device configured f...

Substrate comprising interconnects embedded in a solder resist layer

Structure and method for cooling three-dimensional integrated circuits

Microelectronic assemblies

Semiconductor package and manufacturing method thereof

Package-on-package assembly with wire bonds to encapsulation surface

Pad structure design in fan-out package

Semiconductor device having an inductor

Chip package assembly with enhanced solder resist crack resistance

Semi-conductor package structure

Bump layout for coplanarity improvement

Semiconductor device

High-frequency module

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

PACKAGE BUMPS OF A PACKAGE SUBSTRATE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT

FAN-OUT PACKAGE HAVING BALL GRID ARRAY SUBSTRATE WITH SIGNAL AND PO...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND BUMP ARRANGEMENT METHOD

CHIP STRUCTURE, SEMICONDUCTOR PACKAGE, AND FABRICATING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH SUBSTRATE FOR ELECTRICAL CONNECTION

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...

INTEGRATED CIRCUIT AND ELECTRONIC DEVICE COMPRISING A PLURALITY OF...

ELECTRONIC DEVICE WITH SENSOR FACE STRESS PROTECTION

PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER

FAN OUT FLIP CHIP SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

CHIP PACKAGING STRUCTURE AND METHOD FOR PREPARING THE SAME, AND MET...

MICROELECTRONIC ASSEMBLIES

INTEGRATED CIRCUIT, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP

SEMICONDUCTOR PACKAGE

Pad Structure Design in Fan-Out Package

MULTI-LAYER SHEET FOR MOLD UNDERFILL ENCAPSULATION, METHOD FOR MOLD...

THROUGH-SUBSTRATE UNDERFILL FORMATION FOR AN INTEGRATED CIRCUIT ASS...

THROUGH-SUBSTRATE VOID FILLING FOR AN INTEGRATED CIRCUIT ASSEMBLY

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD

SEMI-CONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE