Stackable modules

Industry

CPC
H05K7/023

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/023Stackable modules

Industries

Patents Grantslast 30 patents

Information Patent Grant
Modular surgical energy system with module positional awareness wit...
- Patent number 12,144,136
- Issue date Nov 12, 2024
- Cilag GmbH International
- Jeffrey L. Aldridge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for maintaining cooling of modular electronic...
- Patent number 12,137,530
- Issue date Nov 5, 2024
- Cisco Technology, Inc.
- Rohit Dev Gupta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board assembly and electronic device
- Patent number 12,058,803
- Issue date Aug 6, 2024
- Huawei Technologies Co., Ltd.
- Chaojun Deng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for communicating between modules and devices in a modular s...
- Patent number 12,042,201
- Issue date Jul 23, 2024
- Cilag GmbH International
- Joshua Henderson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power conversion apparatus
- Patent number 12,003,187
- Issue date Jun 4, 2024
- TMEIC Corporation
- Shigeyuki Nakabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy module for driving multiple energy modalities
- Patent number 11,998,258
- Issue date Jun 4, 2024
- Cilag GmbH International
- Joshua Henderson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Angled faceplates for a network element
- Patent number 11,985,454
- Issue date May 14, 2024
- Ciena Corporation
- Simon J. E. Shearman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Modular data center cooling
- Patent number 11,985,790
- Issue date May 14, 2024
- Zonit Structured Solutions, LLC
- Steve Chapel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Regional location tracking of components of a modular energy system
- Patent number 11,950,823
- Issue date Apr 9, 2024
- Cilag GmbH International
- Ryan M. Asher
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Modular surgical energy system with module positional awareness sen...
- Patent number 11,931,089
- Issue date Mar 19, 2024
- Cilag GmbH International
- Joshua Henderson
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Smart return pad sensing through modulation of near field communica...
- Patent number 11,918,269
- Issue date Mar 5, 2024
- Cilag GmbH International
- Joshua Henderson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Surgical modular energy system with footer module
- Patent number 11,896,279
- Issue date Feb 13, 2024
- Cilag GmbH International
- Ryan M. Asher
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stack-PCB design and midplane architecture
- Patent number 11,839,054
- Issue date Dec 5, 2023
- Meta Platforms Technologies, LLC
- Brian Toleno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surgical modular energy system with a segmented backplane
- Patent number 11,806,062
- Issue date Nov 7, 2023
- Cilag GmbH International
- Joshua Henderson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board assembly and electronic device
- Patent number 11,805,592
- Issue date Oct 31, 2023
- Huawei Technologies Co., Ltd.
- Chaojun Deng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit structures in package substrates
- Patent number 11,804,426
- Issue date Oct 31, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive header module for a modular energy system
- Patent number 11,712,280
- Issue date Aug 1, 2023
- Cilag GmbH International
- Joshua Henderson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Adaptably connectable and reassignable system accessories for modul...
- Patent number 11,696,790
- Issue date Jul 11, 2023
- Cilag GmbH International
- Brendan J. Oberkircher
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Surgical instrument utilizing drive signal to power secondary function
- Patent number 11,696,791
- Issue date Jul 11, 2023
- Cilag GmbH International
- Joshua Henderson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Grounding arrangement of energy modules
- Patent number 11,684,400
- Issue date Jun 27, 2023
- Cilag GmbH International
- Madeleine C. Jayme
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Component carrier with low shrinkage dielectric material
- Patent number 11,688,668
- Issue date Jun 27, 2023
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plug-in pod for electronic control unit
- Patent number 11,689,906
- Issue date Jun 27, 2023
- Cummins Inc.
- Daniel R. Harshbarger
- F02 - COMBUSTION ENGINES HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
Information Patent Grant
Backplane connector design to connect stacked energy modules
- Patent number 11,684,401
- Issue date Jun 27, 2023
- Cilag GmbH International
- Brendan J. Oberkircher
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method for controlling an energy module output
- Patent number 11,678,925
- Issue date Jun 20, 2023
- Cilag GmbH International
- Joshua Henderson
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method for constructing and using a modular surgical energy system...
- Patent number 11,666,368
- Issue date Jun 6, 2023
- Cilag GmbH International
- Joshua Henderson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Coordinated stackable multi-module surgical system
- Patent number 11,638,602
- Issue date May 2, 2023
- Cilag GmbH International
- Joshua Henderson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for energy distribution in a surgical modular energy system
- Patent number 11,628,006
- Issue date Apr 18, 2023
- Cilag GmbH International
- Joshua Henderson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stackable housing block
- Patent number 11,622,462
- Issue date Apr 4, 2023
- E-Blox Inc.
- Arthur F. Seymour
- F21 - LIGHTING
Information Patent Grant
Stackable RF filter for a receiver or transmitter
- Patent number 11,616,279
- Issue date Mar 28, 2023
- THINKRF CORPORATION
- Gilbert Brunette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance modular die-cast enclosure system
- Patent number 11,589,475
- Issue date Feb 21, 2023
- Redline Communications Inc.
- Mark Douglas Bassett
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Novel 3D Artificial Intelligence Computer System
- Publication number 20240422941
- Publication date Dec 19, 2024
- Banqiu Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREFABRICATED MODULAR UNIT ASSEMBLY
- Publication number 20240410158
- Publication date Dec 12, 2024
- Seok Kyu JANG
- E04 - BUILDING
Information Patent Application
METHOD FOR COMMUNICATING BETWEEN MODULES AND DEVICES IN A MODULAR S...
- Publication number 20240358425
- Publication date Oct 31, 2024
- Cilag GMBH International
- Joshua Henderson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PARALLEL MODULE DRIVER
- Publication number 20240334634
- Publication date Oct 3, 2024
- Delta Electronics, Inc.
- Ching-Chi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY WITH INTEGRATED DATA AND BACKUP ENERGY CONNECTIONS
- Publication number 20240305026
- Publication date Sep 12, 2024
- Micron Technology, Inc.
- Mark A. Tverdy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SANDWICH STRUCTURE POWER MODULE
- Publication number 20240224477
- Publication date Jul 4, 2024
- Monolithic Power Systems, Inc.
- Daocheng Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SCALABLE, ADAPTABLE AND MODULAR INTEGRATED UNITS FOR ASSEMBLING A P...
- Publication number 20240107698
- Publication date Mar 28, 2024
- QOGNO DIGITAL INFRASTRUCTURE PVT LTD
- Gururaj NAYAK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20240107656
- Publication date Mar 28, 2024
- Huawei Technologies Co., Ltd
- Chaojun DENG
- G02 - OPTICS
Information Patent Application
A MODULAR ELECTRONICS ASSEMBLY
- Publication number 20230413465
- Publication date Dec 21, 2023
- Tritium Holdings Pty Ltd
- Bernard Brian WALSH
- B60 - VEHICLES IN GENERAL
Information Patent Application
MOUNTING ASSEMBLY FOR MOUNTING AT LEAST TWO ELECTRICAL MODULES ARRA...
- Publication number 20230389210
- Publication date Nov 30, 2023
- Phoenix Contact GmbH & Co. KG
- Mathias Schoppe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH PERFORMANCE MODULAR DIE-CAST ENCLOSURE SYSTEM
- Publication number 20230130888
- Publication date Apr 27, 2023
- Redline Communications Inc.
- Mark Douglas BASSETT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Angled Faceplates for a network element
- Publication number 20230088207
- Publication date Mar 23, 2023
- CIENA CORPORATION
- Simon J. E. Shearman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
STACKABLE POWER STORAGE SYSTEM
- Publication number 20230087598
- Publication date Mar 23, 2023
- DISANKO INC.
- Jonathan LAMER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE MODULAR DIE-CAST ENCLOSURE SYSTEM
- Publication number 20230022850
- Publication date Jan 26, 2023
- Redline Communications Inc.
- Mark Douglas BASSETT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Field Termination Assembly (FTA) With Quick Mount
- Publication number 20220394866
- Publication date Dec 8, 2022
- Honeywell International Inc.
- Dawa Pakimo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER CONVERSION APPARATUS
- Publication number 20220376630
- Publication date Nov 24, 2022
- TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
- Shigeyuki NAKABAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE HOUSING BLOCK
- Publication number 20220104378
- Publication date Mar 31, 2022
- Arthur F. Seymour
- F21 - LIGHTING
Information Patent Application
METHOD AND APPARATUS FOR MAINTAINING COOLING OF MODULAR ELECTRONIC...
- Publication number 20210410312
- Publication date Dec 30, 2021
- Cisco Technology, Inc.
- Rohit Dev Gupta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES IN PACKAGE SUBSTRATES
- Publication number 20210351116
- Publication date Nov 11, 2021
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE MANUFACTURING OF DEVICES FROM ASSEMBLIES OF DISCRETIZED CO...
- Publication number 20210229091
- Publication date Jul 29, 2021
- RN Technologies, LLC
- Richard Neill
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20210212193
- Publication date Jul 8, 2021
- Huawei Technologies Co., Ltd
- Chaojun DENG
- G02 - OPTICS
Information Patent Application
MODULAR DATA CENTER COOLING
- Publication number 20210204440
- Publication date Jul 1, 2021
- Zonit Structured Solutions, LLC
- Steve Chapel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Component Carrier With Low Shrinkage Dielectric Material
- Publication number 20210202355
- Publication date Jul 1, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID STATE CIRCUIT BREAKER ASSEMBLY
- Publication number 20210029828
- Publication date Jan 28, 2021
- Eaton Intelligent Power Limited
- Armen Baronian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADAPTER FOR INSTALLING ELECTROTECHNICAL COMPONENTS
- Publication number 20210014993
- Publication date Jan 14, 2021
- Eaton Intelligent Power Limited
- Karsten Gerving
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200367361
- Publication date Nov 19, 2020
- Shinko Electric Industries Co., Ltd.
- Tomoharu FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL POWER DELIVERY SYSTEM
- Publication number 20200337168
- Publication date Oct 22, 2020
- GE Global Sourcing LLC
- Jason Kuttenkuler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMUNICATION DEVICE BOARD AND COMMUNICATION DEVICE
- Publication number 20200275575
- Publication date Aug 27, 2020
- New H3C Technologies Co., Ltd.
- Chenfei XIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Field Termination Assembly (FTA) with Quick Mount
- Publication number 20200253067
- Publication date Aug 6, 2020
- HONEYWELL INTERNATIONAL INC.
- Dawa Pakimo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES IN PACKAGE SUBSTRATES
- Publication number 20200251411
- Publication date Aug 6, 2020
- Intel Corporation
- Sanka Ganesan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Stackable modules

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Modular surgical energy system with module positional awareness wit...

Method and apparatus for maintaining cooling of modular electronic...

Circuit board assembly and electronic device

Method for communicating between modules and devices in a modular s...

Power conversion apparatus

Energy module for driving multiple energy modalities

Angled faceplates for a network element

Modular data center cooling

Regional location tracking of components of a modular energy system

Modular surgical energy system with module positional awareness sen...

Smart return pad sensing through modulation of near field communica...

Surgical modular energy system with footer module

Stack-PCB design and midplane architecture

Surgical modular energy system with a segmented backplane

Circuit board assembly and electronic device

Integrated circuit structures in package substrates

Passive header module for a modular energy system

Adaptably connectable and reassignable system accessories for modul...

Surgical instrument utilizing drive signal to power secondary function

Grounding arrangement of energy modules

Component carrier with low shrinkage dielectric material

Plug-in pod for electronic control unit

Backplane connector design to connect stacked energy modules

Method for controlling an energy module output

Method for constructing and using a modular surgical energy system...

Coordinated stackable multi-module surgical system

Method for energy distribution in a surgical modular energy system

Stackable housing block

Stackable RF filter for a receiver or transmitter

High performance modular die-cast enclosure system

Patents Applicationslast 30 patents

Novel 3D Artificial Intelligence Computer System

PREFABRICATED MODULAR UNIT ASSEMBLY

METHOD FOR COMMUNICATING BETWEEN MODULES AND DEVICES IN A MODULAR S...

PARALLEL MODULE DRIVER

CONNECTOR ASSEMBLY WITH INTEGRATED DATA AND BACKUP ENERGY CONNECTIONS

SANDWICH STRUCTURE POWER MODULE

SCALABLE, ADAPTABLE AND MODULAR INTEGRATED UNITS FOR ASSEMBLING A P...

CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

A MODULAR ELECTRONICS ASSEMBLY

MOUNTING ASSEMBLY FOR MOUNTING AT LEAST TWO ELECTRICAL MODULES ARRA...

HIGH PERFORMANCE MODULAR DIE-CAST ENCLOSURE SYSTEM

Angled Faceplates for a network element

STACKABLE POWER STORAGE SYSTEM

HIGH PERFORMANCE MODULAR DIE-CAST ENCLOSURE SYSTEM

Field Termination Assembly (FTA) With Quick Mount

POWER CONVERSION APPARATUS

STACKABLE HOUSING BLOCK

METHOD AND APPARATUS FOR MAINTAINING COOLING OF MODULAR ELECTRONIC...

INTEGRATED CIRCUIT STRUCTURES IN PACKAGE SUBSTRATES

ADDITIVE MANUFACTURING OF DEVICES FROM ASSEMBLIES OF DISCRETIZED CO...

CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

MODULAR DATA CENTER COOLING

Component Carrier With Low Shrinkage Dielectric Material

SOLID STATE CIRCUIT BREAKER ASSEMBLY

ADAPTER FOR INSTALLING ELECTROTECHNICAL COMPONENTS

SEMICONDUCTOR DEVICE

ELECTRICAL POWER DELIVERY SYSTEM

COMMUNICATION DEVICE BOARD AND COMMUNICATION DEVICE

Field Termination Assembly (FTA) with Quick Mount

INTEGRATED CIRCUIT STRUCTURES IN PACKAGE SUBSTRATES