Stacked arrangements of devices

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H01L25/043

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/043Stacked arrangements of devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device with micro-photoelectric units
- Patent number 12,218,174
- Issue date Feb 4, 2025
- LG Display Co., Ltd.
- Hsien-Te Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,159,821
- Issue date Dec 3, 2024
- Siliconware Precision Industries Co., Ltd.
- Ting-Yang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable quantum processor design
- Patent number 12,086,689
- Issue date Sep 10, 2024
- Google LLC
- Julian Shaw Kelly
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,040,312
- Issue date Jul 16, 2024
- Advanced Semiconductor Engineering, Inc.
- Chien-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided integrated circuit module having an exposed semiconduc...
- Patent number 12,021,065
- Issue date Jun 25, 2024
- Qorvo US, Inc.
- John Robert Siomkos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion apparatus, photoelectric conversion system...
- Patent number 12,021,108
- Issue date Jun 25, 2024
- Canon Kabushiki Kaisha
- Junji Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copackaging photodetector and readout circuit for improved LiDAR de...
- Patent number 11,965,989
- Issue date Apr 23, 2024
- BEIJING VOYAGER TECHNOLOGY CO., LTD.
- Yue Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photovoltaic cell form ultra-small IOT device with multi-level volt...
- Patent number 11,955,574
- Issue date Apr 9, 2024
- International Business Machines Corporation
- Ning Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device with micro-photoelectric units
- Patent number 11,935,909
- Issue date Mar 19, 2024
- LG Display Co., Ltd.
- Hsien-Te Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having a carrier, semiconductor chip packages...
- Patent number 11,915,999
- Issue date Feb 27, 2024
- Infineon Technologies AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,908,759
- Issue date Feb 20, 2024
- Mediatek Inc.
- Nan-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, manufacturing method thereof, and elect...
- Patent number 11,830,906
- Issue date Nov 28, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Shinya Yamakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,830,845
- Issue date Nov 28, 2023
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional circuit implementing machine trained network
- Patent number 11,790,219
- Issue date Oct 17, 2023
- Adeia Semiconductor Inc.
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor apparatus and fabrication method thereof
- Patent number 11,776,934
- Issue date Oct 3, 2023
- INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- Han-Chin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Band-pass filter for stacked sensor
- Patent number 11,764,248
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion apparatus, photoelectric conversion system...
- Patent number 11,658,197
- Issue date May 23, 2023
- Canon Kabushiki Kaisha
- Junji Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi stack optical elements using temporary and permanent bonding
- Patent number 11,626,321
- Issue date Apr 11, 2023
- Applied Materials, Inc.
- Ludovic Godet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (POP) type semiconductor packages
- Patent number 11,610,871
- Issue date Mar 21, 2023
- Samsung Electronics Co., Ltd.
- Minho Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Power on die discovery in 3D stacked die architectures with varying...
- Patent number 11,610,879
- Issue date Mar 21, 2023
- Advanced Micro Devices, Inc.
- Russell J. Schreiber
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor component having through-silicon vias
- Patent number 11,545,392
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated photonic device manufacturing method
- Patent number 11,515,164
- Issue date Nov 29, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Karim Hassan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having stacked die structure
- Patent number 11,476,200
- Issue date Oct 18, 2022
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frameless PV-module
- Patent number 11,430,902
- Issue date Aug 30, 2022
- PRISM SOLAR TECHNOLOGIES, INC.
- Jose E. Castillo-Aguilella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,424,211
- Issue date Aug 23, 2022
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, manufacturing method thereof, and elect...
- Patent number 11,398,522
- Issue date Jul 26, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Shinya Yamakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and fabrication method thereof
- Patent number 11,367,706
- Issue date Jun 21, 2022
- INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- Han-Chin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the semiconductor device
- Patent number 11,355,357
- Issue date Jun 7, 2022
- Denso Corporation
- Kazuaki Mawatari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film resistors of semiconductor devices
- Patent number 11,335,635
- Issue date May 17, 2022
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Benfu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation covered light emitting unit stack
- Patent number 11,282,981
- Issue date Mar 22, 2022
- SEOUL VIOSYS CO., LTD.
- Chang Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038088
- Publication date Jan 30, 2025
- Siliconware Precision Industries Co., Ltd.
- Ting-Yang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION APPARATUS AND PHOTOELECTRIC CONVERSION SYSTEM
- Publication number 20240387453
- Publication date Nov 21, 2024
- Canon Kabushiki Kaisha
- TATSUYA MURAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT MODULE HAVING AN EXPOSED SEMICONDUC...
- Publication number 20240387464
- Publication date Nov 21, 2024
- Qorvo US, Inc.
- John Robert Siomkos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM...
- Publication number 20240379723
- Publication date Nov 14, 2024
- Canon Kabushiki Kaisha
- Junji Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR STRUCTURE
- Publication number 20240363668
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20240203930
- Publication date Jun 20, 2024
- Adeia Semiconductor Solutions LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MICRO-PHOTOELECTRIC UNITS
- Publication number 20240194721
- Publication date Jun 13, 2024
- LG Display Co., Ltd.
- Hsien-Te CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEVICE FOR ACQUIRING A 2D IMAGE AND A DEPTH IMAGE OF A SCENE
- Publication number 20240186286
- Publication date Jun 6, 2024
- Commissariat a I'Energie Atomique et aux Energies Alternatives
- Jérôme Vaillant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECT...
- Publication number 20240145522
- Publication date May 2, 2024
- Sony Semiconductor Solutions Corporation
- SHINYA YAMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE FIELD PROGRAMMABLE MULTICHIP PACKAGE
- Publication number 20240056082
- Publication date Feb 15, 2024
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF SOLAR CELL AND IMAGE SENSOR
- Publication number 20230402482
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BAND-PASS FILTER FOR STACKED SENSOR
- Publication number 20230361147
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM...
- Publication number 20230261027
- Publication date Aug 17, 2023
- Canon Kabushiki Kaisha
- Junji Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE (POP) TYPE SEMICONDUCTOR PACKAGES
- Publication number 20230223387
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Minho Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECT...
- Publication number 20220399396
- Publication date Dec 15, 2022
- Sony Semiconductor Solutions Corporation
- SHINYA YAMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20220375891
- Publication date Nov 24, 2022
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI STACK OPTICAL ELEMENTS USING TEMPORARY AND PERMANENT BONDING
- Publication number 20220336270
- Publication date Oct 20, 2022
- Applied Materials, Inc.
- Ludovic GODET
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20220310449
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF
- Publication number 20220285314
- Publication date Sep 8, 2022
- INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- HAN-CHIN CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20220208607
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPACKGING PHOTODETECTOR AND READOUT CIRCUIT FOR IMPROVED LIDAR DET...
- Publication number 20220137191
- Publication date May 5, 2022
- Beijing Voyager Technology Co., Ltd.
- Yue Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three Dimensional Circuit Implementing Machine Trained Network
- Publication number 20220108161
- Publication date Apr 7, 2022
- Xcelsis Corporation
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Stacked Oximeter and Operation Method
- Publication number 20220061715
- Publication date Mar 3, 2022
- Senbiosys
- Assim Boukhayma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BAND-PASS FILTER FOR STACKED SENSOR
- Publication number 20220045117
- Publication date Feb 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF
- Publication number 20210327850
- Publication date Oct 21, 2021
- INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- HAN-CHIN CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM RESISTORS OF SEMICONDUCTOR DEVICES
- Publication number 20210320063
- Publication date Oct 14, 2021
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- BENFU LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND IMAGING DEVICE
- Publication number 20210320141
- Publication date Oct 14, 2021
- SONY GROUP CORPORATION
- Kengo KOTOO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEVICE OF ACQUISITION OF A 2D IMAGE AND OF A DEPTH IMAGE OF A SCENE
- Publication number 20210305206
- Publication date Sep 30, 2021
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- François Deneuville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT RECEIVING ELEMENT UNIT
- Publication number 20210249547
- Publication date Aug 12, 2021
- KYOTO SEMICONDUCTOR CO., LTD.
- Yu ITAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICE
- Publication number 20210225905
- Publication date Jul 22, 2021
- ULTRA DISPLAY TECHNOLOGY CORP.
- Hsien-Te CHEN
- G06 - COMPUTING CALCULATING COUNTING

Stacked arrangements of devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device with micro-photoelectric units

Electronic package and manufacturing method thereof

Scalable quantum processor design

Semiconductor package structure and method for manufacturing the same

Double-sided integrated circuit module having an exposed semiconduc...

Photoelectric conversion apparatus, photoelectric conversion system...

Copackaging photodetector and readout circuit for improved LiDAR de...

Photovoltaic cell form ultra-small IOT device with multi-level volt...

Electrical device with micro-photoelectric units

Semiconductor device having a carrier, semiconductor chip packages...

Semiconductor device

Solid-state imaging device, manufacturing method thereof, and elect...

Package-on-package assembly with wire bonds to encapsulation surface

Three dimensional circuit implementing machine trained network

Semiconductor apparatus and fabrication method thereof

Band-pass filter for stacked sensor

Photoelectric conversion apparatus, photoelectric conversion system...

Multi stack optical elements using temporary and permanent bonding

Package-on-package (POP) type semiconductor packages

Power on die discovery in 3D stacked die architectures with varying...

Semiconductor component having through-silicon vias

Integrated photonic device manufacturing method

Semiconductor package structure having stacked die structure

Frameless PV-module

Package-on-package assembly with wire bonds to encapsulation surface

Solid-state imaging device, manufacturing method thereof, and elect...

Semiconductor apparatus and fabrication method thereof

Semiconductor device and method for producing the semiconductor device

Thin film resistors of semiconductor devices

Passivation covered light emitting unit stack

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PHOTOELECTRIC CONVERSION APPARATUS AND PHOTOELECTRIC CONVERSION SYSTEM

DOUBLE-SIDED INTEGRATED CIRCUIT MODULE HAVING AN EXPOSED SEMICONDUC...

PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM...

STACKED SEMICONDUCTOR STRUCTURE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

ELECTRONIC DEVICE WITH MICRO-PHOTOELECTRIC UNITS

DEVICE FOR ACQUIRING A 2D IMAGE AND A DEPTH IMAGE OF A SCENE

SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECT...

NON-VOLATILE FIELD PROGRAMMABLE MULTICHIP PACKAGE

INTEGRATION OF SOLAR CELL AND IMAGE SENSOR

BAND-PASS FILTER FOR STACKED SENSOR

PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM...

PACKAGE-ON-PACKAGE (POP) TYPE SEMICONDUCTOR PACKAGES

SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECT...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

MULTI STACK OPTICAL ELEMENTS USING TEMPORARY AND PERMANENT BONDING

3D Integrated Circuit and Methods of Forming the Same

SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF

3D Integrated Circuit and Methods of Forming the Same

COPACKGING PHOTODETECTOR AND READOUT CIRCUIT FOR IMPROVED LIDAR DET...

Three Dimensional Circuit Implementing Machine Trained Network

Stacked Oximeter and Operation Method

BAND-PASS FILTER FOR STACKED SENSOR

SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF

THIN FILM RESISTORS OF SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND IMAGING DEVICE

DEVICE OF ACQUISITION OF A 2D IMAGE AND OF A DEPTH IMAGE OF A SCENE

LIGHT RECEIVING ELEMENT UNIT

ELECTRICAL DEVICE