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H01L2224/3703

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/3703Stacked arrangements

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and production method for semiconductor device
- Patent number 12,062,634
- Issue date Aug 13, 2024
- Rohm Co., Ltd.
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a composite material clip
- Patent number 10,971,457
- Issue date Apr 6, 2021
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and method of manufacturing power module
- Patent number 9,673,118
- Issue date Jun 6, 2017
- Mitsubishi Electric Corporation
- Masaki Taya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic power converter package
- Patent number 9,041,175
- Issue date May 26, 2015
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic Power Converter Package with Through Substrate vias
- Patent number 8,901,742
- Issue date Dec 2, 2014
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric device package and method of making an electric device pac...
- Patent number 8,824,145
- Issue date Sep 2, 2014
- Infineon Technologies AG
- Khalil Hosseini
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20230187404
- Publication date Jun 15, 2023
- WUXI LEAPERS SEMICONDUCTOR CO., LTD.
- Xiaoguang LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20220302071
- Publication date Sep 22, 2022
- Rohm Co., Ltd.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A COMPOSITE MATERIAL CLIP
- Publication number 20190333874
- Publication date Oct 31, 2019
- INFINEON TECHNOLOGIES AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electric Device Package and Method of Making an Electric Device Pac...
- Publication number 20130329365
- Publication date Dec 12, 2013
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Monolithic Power Converter Package with Through Substrate Vias
- Publication number 20130256905
- Publication date Oct 3, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Monolithic Power Converter Package
- Publication number 20130257524
- Publication date Oct 3, 2013
- INTERNATIONAL RECTIFIER CORPORATION (EL SEGUNDO, CA)
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS