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Static random-access memory [SRAM]
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H01L2924/1437
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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H01L2924/1437
Static random-access memory [SRAM]
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Patents Grants
last 30 patents
Information
Patent Grant
Info structure with copper pillar having reversed profile
Patent number
12,261,074
Issue date
Mar 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsi-Kuei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having package on package structure and method...
Patent number
12,261,157
Issue date
Mar 25, 2025
Samsung Electronics Co., Ltd.
Jeonghyun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit structure
Patent number
12,238,865
Issue date
Feb 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposers for microelectronic devices
Patent number
12,230,583
Issue date
Feb 18, 2025
Micron Technology, Inc.
Owen Fay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out packages providing enhanced mechanical strength and methods...
Patent number
12,224,268
Issue date
Feb 11, 2025
Taiwan Semiconductor Manufacturing Company Limited
Jen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit structure and method
Patent number
12,199,051
Issue date
Jan 14, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing optically accessible co-packaged optics
Patent number
12,197,023
Issue date
Jan 14, 2025
Celestial AI Inc.
Ankur Aggarwal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method of forming same
Patent number
12,191,270
Issue date
Jan 7, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chuei-Tang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having a high reliability
Patent number
12,183,718
Issue date
Dec 31, 2024
Samsung Electronics Co., Ltd.
Ji-Hwan Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D chip package based on vertical-through-via connector
Patent number
12,176,278
Issue date
Dec 24, 2024
iCometrue Company Ltd.
Ping-Jung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Logic drive with brain-like elasticity and integrality based on sta...
Patent number
12,176,902
Issue date
Dec 24, 2024
iCometrue Company Ltd.
Jin-Yuan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit assemblies with direct chip attach to circuit bo...
Patent number
12,170,273
Issue date
Dec 17, 2024
Intel Corporation
Wilfred Gomes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Homogeneous chiplets configurable as a two-dimensional system or a...
Patent number
12,148,707
Issue date
Nov 19, 2024
Microsoft Technology Licensing, LLC
Haohua Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
12,142,544
Issue date
Nov 12, 2024
Samsung Electronics Co., Ltd.
Taehwan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated fan-out package and the methods of manufacturing
Patent number
12,142,597
Issue date
Nov 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device assemblies with molded support substrates
Patent number
12,119,325
Issue date
Oct 15, 2024
Micron Technology, Inc.
Mitsuhisa Watanabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming semiconductor packages having through package vias
Patent number
12,107,051
Issue date
Oct 1, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Offset interposers for large-bottom packages and large-die package-...
Patent number
12,107,082
Issue date
Oct 1, 2024
Intel Corporation
Russell K. Mortensen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
12,094,847
Issue date
Sep 17, 2024
Samsung Electronics Co., Ltd.
Seyeong Seok
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Nanoscale-aligned three-dimensional stacked integrated circuit
Patent number
12,094,775
Issue date
Sep 17, 2024
Board of Regents, The University of Texas System
Sidlgata V. Sreenivasan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming package structure
Patent number
12,094,819
Issue date
Sep 17, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Hao Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked-substrate FPGA semiconductor devices
Patent number
12,087,750
Issue date
Sep 10, 2024
Intel Corporation
Abhishek A. Sharma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of forming the same
Patent number
12,058,101
Issue date
Aug 6, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Logic drive using standard commodity programmable logic IC chips co...
Patent number
12,057,837
Issue date
Aug 6, 2024
iCometrue Company Ltd.
Jin-Yuan Lee
G11 - INFORMATION STORAGE
Information
Patent Grant
Semiconductor package having a through intervia through the molding...
Patent number
12,033,976
Issue date
Jul 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-on-package semiconductor assemblies and methods of manufact...
Patent number
12,033,929
Issue date
Jul 9, 2024
Owen R. Fay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optimized static random access memory
Patent number
12,016,169
Issue date
Jun 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ping-Wei Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
SRAM bit cells with three-dimensional integration
Patent number
12,009,326
Issue date
Jun 11, 2024
GLOBALFOUNDRIES Singapore Pte. Ltd.
Hari Balan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded semiconductor devices having programmable logic device and d...
Patent number
11,996,389
Issue date
May 28, 2024
Yangtze Memory Technologies Co., Ltd.
Jun Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid bonding with uniform pattern density
Patent number
11,996,399
Issue date
May 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Szu-Ying Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
STACKED MEMORY LAYERS WITH UNIFORM ACCESS
Publication number
20250107107
Publication date
Mar 27, 2025
Intel Corporation
Abhishek A. Sharma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY LAYERS BONDED TO LOGIC LAYERS WITH INCLINATION
Publication number
20250107108
Publication date
Mar 27, 2025
Intel Corporation
Abhishek A. Sharma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR POWER DELIVERY FOR SEMICONDUCTOR DEVICES
Publication number
20250105096
Publication date
Mar 27, 2025
Avago Technologies International Sales Pte. Limited
AJ Tufano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250096175
Publication date
Mar 20, 2025
Samsung Electronics Co., Ltd.
YISEUL HAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY LAYERS AT OPPOSING SIDES OF A COMPLEMENTARY METAL-OXIDE SEMI...
Publication number
20250098179
Publication date
Mar 20, 2025
Abhishek A. Sharma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURE AND METHOD
Publication number
20250096163
Publication date
Mar 20, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D MEMORY DEVICES AND STRUCTURES WITH MEMORY ARRAYS AND METAL LAYERS
Publication number
20250098182
Publication date
Mar 20, 2025
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
Publication number
20250087543
Publication date
Mar 13, 2025
Taiwan Semiconductor Manufacturing Co., Ltd. Hsinchu
Yi-Hsiu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20250087608
Publication date
Mar 13, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chuei-Tang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND SEMICONDUCTOR STRUCTURE
Publication number
20250079375
Publication date
Mar 6, 2025
CXMT Corporation
Hengrong SHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250062177
Publication date
Feb 20, 2025
Samsung Electronics Co., Ltd.
Han Min LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250062208
Publication date
Feb 20, 2025
Samsung Electronics Co., Ltd.
Kyoung Lim SUK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR THREE-DIMENSIONAL MEMORY STACKING
Publication number
20250054911
Publication date
Feb 13, 2025
Meta Platforms Technologies, LLC
Huichu Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR NON-UNIFORM MEMORY ACCESS ON THREE-DIMENSIO...
Publication number
20250056815
Publication date
Feb 13, 2025
Meta Platforms Technologies, LLC
Lita Yang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250038149
Publication date
Jan 30, 2025
Samsung Electronics Co., Ltd.
HYUNGJUN JEON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HOMOGENEOUS CHIPLETS CONFIGURABLE AS A TWO-DIMENSIONAL SYSTEM OR A...
Publication number
20250038120
Publication date
Jan 30, 2025
Microsoft Technology Licensing, LLC
Haohua ZHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODULAR CHIPLET SYSTEM
Publication number
20250029971
Publication date
Jan 23, 2025
Zero ASIC Corporation
Andreas Olofsson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Reducing warpage in a package of stacked integrated circuit dies
Publication number
20250029948
Publication date
Jan 23, 2025
Marvell Asia Pte Ltd.
Runzi Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250022844
Publication date
Jan 16, 2025
Samsung Electronics Co., Ltd.
Choongbin Yim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES
Publication number
20250006697
Publication date
Jan 2, 2025
Micron Technology, Inc.
Mitsuhisa Watanabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH-BANDWIDTH THREE-DIMENSIONAL (3D) DIE STACK
Publication number
20250006694
Publication date
Jan 2, 2025
Xilinx, Inc.
Martin L. VOOGEL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240429192
Publication date
Dec 26, 2024
Samsung Electronics Co., Ltd.
CHAJEA JO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NANOSCALE-ALIGNED THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT
Publication number
20240429099
Publication date
Dec 26, 2024
Board of Regents, The University of Texas System
Sidlgata V. Sreenivasan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240429222
Publication date
Dec 26, 2024
Samsung Electronics Co., Ltd.
Jing Cheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MIM Capacitor in IC Heterogenous Integration
Publication number
20240421063
Publication date
Dec 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Chieh Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240421011
Publication date
Dec 19, 2024
Samsung Electronics Co., Ltd.
WanSun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20240413104
Publication date
Dec 12, 2024
Samsung Electronics Co., Ltd.
Sang Cheon PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240404972
Publication date
Dec 5, 2024
Samsung Electronics Co., Ltd.
Seyeong Seok
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPUTING DEVICE AND COMPUTING SYSTEM INCLUDING THE SAME
Publication number
20240389364
Publication date
Nov 21, 2024
Samsung Electronics Co., Ltd.
Sangkil Lee
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...
Publication number
20240380401
Publication date
Nov 14, 2024
iCometrue Company Ltd.
Jin-Yuan Lee
G11 - INFORMATION STORAGE