Static random access memory structures and multistep manufacturing processes therefor

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/11Static random access memory structures and multistep manufacturing processes therefor

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power rail and signal conducting line arrangement
- Patent number 11,967,596
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guo-Huei Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 11,963,374
- Issue date Apr 16, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Super CMOS devices on a microelectronics system
- Patent number 11,955,476
- Issue date Apr 9, 2024
- SCHOTTKY LSI, INC.
- Augustine Wei-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits having cross-couple constructs and semiconducto...
- Patent number 11,955,471
- Issue date Apr 9, 2024
- Samsung Electronics Co., Ltd.
- Jung-Ho Do
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Backside conducting lines in integrated circuits
- Patent number 11,942,469
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-An Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device including standard cells
- Patent number 11,935,893
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ta-Pen Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with improved layout
- Patent number 11,935,894
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit, system and method of forming the same
- Patent number 11,923,369
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Hsin Chiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,923,230
- Issue date Mar 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for routing local interconnect structure at same level as re...
- Patent number 11,916,077
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,917,838
- Issue date Feb 27, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device disaggregation for improved performance
- Patent number 11,916,076
- Issue date Feb 27, 2024
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 11,916,056
- Issue date Feb 27, 2024
- SOCIONEXT INC.
- Junji Iwahori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,908,868
- Issue date Feb 20, 2024
- Rohm Co., Ltd.
- Katsuhisa Nagao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of generating integrated circuit layout
- Patent number 11,908,853
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D semiconductor device and structure with memory
- Patent number 11,901,210
- Issue date Feb 13, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit
- Patent number RE49821
- Issue date Jan 30, 2024
- Sony Group Corporation
- Yoshinori Tanaka
Information Patent Grant
Integrated circuit having contact jumper
- Patent number 11,887,914
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Jung-Ho Do
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 11,881,484
- Issue date Jan 23, 2024
- SOCIONEXT INC.
- Toshio Hino
- B82 - NANO-TECHNOLOGY
Information Patent Grant
3D semiconductor device and structure with metal layers and a conne...
- Patent number 11,881,443
- Issue date Jan 23, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive using standard commodity programmable logic IC chips co...
- Patent number 11,881,483
- Issue date Jan 23, 2024
- iCometrue Company Ltd.
- Mou-Shiung Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 11,876,011
- Issue date Jan 16, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Schottky-CMOS asynchronous logic cells
- Patent number 11,870,438
- Issue date Jan 9, 2024
- SCHOTTKY LSI, INC.
- Augustine Wei-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,871,596
- Issue date Jan 9, 2024
- Samsung Display Co., Ltd.
- Jaybum Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor devices, methods of designing layouts of semiconducto...
- Patent number 11,869,884
- Issue date Jan 9, 2024
- Samsung Electronics Co., Ltd.
- Jong-Kyu Ryu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of designing a layout of a semiconductor device including f...
- Patent number RE49780
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Taejoong Song
Information Patent Grant
Low power non-linear polar material based threshold logic gate mult...
- Patent number 11,863,183
- Issue date Jan 2, 2024
- Kepler Computing Inc.
- Sasikanth Manipatruni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for producing a 3D semiconductor device and structure with m...
- Patent number 11,862,503
- Issue date Jan 2, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standard cell layout for better routability
- Patent number 11,862,568
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tigran Zohrabyan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Comparison of biometric identifiers in memory
- Patent number 11,854,311
- Issue date Dec 26, 2023
- Micron Technology, Inc.
- Honglin Sun
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
3D MEMORY DEVICE AND METHOD OF FORMING SEAL STRUCTURE
- Publication number 20240136305
- Publication date Apr 25, 2024
- Macronix International Co., Ltd.
- Cheng-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240136419
- Publication date Apr 25, 2024
- RENESAS ELECTRONICS CORPORATION
- Hitoshi MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLASH MEMORY AND MANUFACTURING METHOD THEREOF
- Publication number 20240138144
- Publication date Apr 25, 2024
- United Microelectronics Corp.
- Yu-Jen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL NAND MEMORY DEVICE AND FABRICATION METHOD
- Publication number 20240138148
- Publication date Apr 25, 2024
- Yangtze Memory Technologies Co., Ltd.
- Longxiang YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEIVCE, MANUFACTURING METHOD THEREOF, AND...
- Publication number 20240130129
- Publication date Apr 18, 2024
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Jiayi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING A DOPED DIELECTRIC MATERIAL, METH...
- Publication number 20240130121
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE, MANUFACTURING METHOD THEREOF, AND...
- Publication number 20240130130
- Publication date Apr 18, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jiayi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE CRYSTAL SILICON CORES FOR STACKED MEMORY CELLS
- Publication number 20240130128
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Yongjun Hu
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
- Publication number 20240128116
- Publication date Apr 18, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...
- Publication number 20240128165
- Publication date Apr 18, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTIFUSE DEVICE HAVING INTERCONNECT JUMPER
- Publication number 20240128189
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Christopher G. Wieduwilt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Schottky-CMOS Static Random-Access Memory
- Publication number 20240120922
- Publication date Apr 11, 2024
- Schottky LSI, Inc.
- Augustine Wei-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUITS HAVING ENHANCED ELECTRICAL ISOLATION
- Publication number 20240120371
- Publication date Apr 11, 2024
- ALLEGRO MICROSYSTEMS, LLC
- James McClay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single Bitline SRAM Pixel And Method For Driving The Same
- Publication number 20240119917
- Publication date Apr 11, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Qing Qin
- G11 - INFORMATION STORAGE
Information Patent Application
STACKED-FET SRAM CELL WITH BOTTOM pFET
- Publication number 20240121933
- Publication date Apr 11, 2024
- International Business Machines Corporation
- Gen Tsutsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE WITH STACKED TRANSISTORS
- Publication number 20240121934
- Publication date Apr 11, 2024
- International Business Machines Corporation
- Jens Künzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STATE FERROELECTRIC-RAM WITH STACKED CAPACITORS
- Publication number 20240121966
- Publication date Apr 11, 2024
- International Business Machines Corporation
- Julien Frougier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240121954
- Publication date Apr 11, 2024
- Macronix International Co., Ltd.
- Chih-Wei Hu
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20240120332
- Publication date Apr 11, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED PATTERNING OF PLATE LINES IN THREE-DIMENSIONAL FERROEL...
- Publication number 20240114693
- Publication date Apr 4, 2024
- Intel Corporation
- Christopher M. Neumann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF RECONFIGURABLE ARCHITECTURES USING FERROELECTRICS
- Publication number 20240113123
- Publication date Apr 4, 2024
- Intel Corporation
- Elijah V. Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER VIA WITH REDUCED RESISTANCE
- Publication number 20240113022
- Publication date Apr 4, 2024
- ADVANCED MICRO DEVICES, INC.
- Richard T. Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE FERROELECTRIC DEPLOYMENT FOR SINGLE-TRANSISTOR, MULTIPLE-...
- Publication number 20240112714
- Publication date Apr 4, 2024
- Intel Corporation
- Nazila Haratipour
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240114683
- Publication date Apr 4, 2024
- WINBOND ELECTRONICS CORP.
- Tsung-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE CAPACITORS WITH 3D NON-VOLATILE ARRAY
- Publication number 20240114685
- Publication date Apr 4, 2024
- Western Digital Technologies, Inc.
- Liang Li
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240114688
- Publication date Apr 4, 2024
- United Microelectronics Corp.
- Chia-Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ENDURANCE SUPER-LATTICE ANTI-FERROELECTRIC CAPACITORS
- Publication number 20240114695
- Publication date Apr 4, 2024
- Intel Corporation
- Sou-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAIN CELL USING PLANAR AND TRENCH FERROELECTRIC AND ANTI-FERROELECT...
- Publication number 20240114697
- Publication date Apr 4, 2024
- Intel Corporation
- Shriram SHIVARAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Standard Cell Structure
- Publication number 20240113097
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
- Publication number 20240112942
- Publication date Apr 4, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE

Static random access memory structures and multistep manufacturing processes therefor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power rail and signal conducting line arrangement

Semiconductor device

Super CMOS devices on a microelectronics system

Integrated circuits having cross-couple constructs and semiconducto...

Backside conducting lines in integrated circuits

Semiconductor device including standard cells

Integrated circuit device with improved layout

Integrated circuit, system and method of forming the same

3D semiconductor device and structure with bonding

Method for routing local interconnect structure at same level as re...

Semiconductor device

Device disaggregation for improved performance

Semiconductor integrated circuit device

Semiconductor device

Integrated circuit and method of generating integrated circuit layout

3D semiconductor device and structure with memory

Semiconductor integrated circuit

Integrated circuit having contact jumper

Semiconductor integrated circuit device

3D semiconductor device and structure with metal layers and a conne...

Logic drive using standard commodity programmable logic IC chips co...

3D semiconductor device and structure with single-crystal layers

Schottky-CMOS asynchronous logic cells

Display device and method of manufacturing the same

Semiconductor devices, methods of designing layouts of semiconducto...

Methods of designing a layout of a semiconductor device including f...

Low power non-linear polar material based threshold logic gate mult...

Method for producing a 3D semiconductor device and structure with m...

Standard cell layout for better routability

Comparison of biometric identifiers in memory

Patents Applicationslast 30 patents

3D MEMORY DEVICE AND METHOD OF FORMING SEAL STRUCTURE

SEMICONDUCTOR DEVICE

FLASH MEMORY AND MANUFACTURING METHOD THEREOF

THREE-DIMENSIONAL NAND MEMORY DEVICE AND FABRICATION METHOD

THREE-DIMENSIONAL MEMORY DEIVCE, MANUFACTURING METHOD THEREOF, AND...

MICROELECTRONIC DEVICES INCLUDING A DOPED DIELECTRIC MATERIAL, METH...

THREE-DIMENSIONAL MEMORY DEVICE, MANUFACTURING METHOD THEREOF, AND...

SINGLE CRYSTAL SILICON CORES FOR STACKED MEMORY CELLS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...

ANTIFUSE DEVICE HAVING INTERCONNECT JUMPER

Schottky-CMOS Static Random-Access Memory

CIRCUITS HAVING ENHANCED ELECTRICAL ISOLATION

Single Bitline SRAM Pixel And Method For Driving The Same

STACKED-FET SRAM CELL WITH BOTTOM pFET

MICROELECTRONIC DEVICE WITH STACKED TRANSISTORS

MULTI-STATE FERROELECTRIC-RAM WITH STACKED CAPACITORS

MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

SELF-ALIGNED PATTERNING OF PLATE LINES IN THREE-DIMENSIONAL FERROEL...

FABRICATION OF RECONFIGURABLE ARCHITECTURES USING FERROELECTRICS

POWER VIA WITH REDUCED RESISTANCE

SELECTIVE FERROELECTRIC DEPLOYMENT FOR SINGLE-TRANSISTOR, MULTIPLE-...

MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

CONFIGURABLE CAPACITORS WITH 3D NON-VOLATILE ARRAY

MEMORY STRUCTURE AND MANUFACTURING METHOD THEREOF

HIGH ENDURANCE SUPER-LATTICE ANTI-FERROELECTRIC CAPACITORS

GAIN CELL USING PLANAR AND TRENCH FERROELECTRIC AND ANTI-FERROELECT...

Integrated Standard Cell Structure

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS