Static random access memory structures and multistep manufacturing processes therefor

Industry

CPC
H01L27/11

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/11Static random access memory structures and multistep manufacturing processes therefor

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit
- Patent number 12,300,699
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Guo-Huei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device, method and system
- Patent number 12,283,586
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ling Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
IC logic device, layout, system, and method
- Patent number 12,278,240
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- I-Wen Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor integrated circuit
- Patent number 12,278,239
- Issue date Apr 15, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yoshinori Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,277,378
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Zhong Zhuang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 12,272,606
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Sangmin Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,272,694
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Dae Seong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stacked integrated circuits having functional blocks configured...
- Patent number 12,266,647
- Issue date Apr 1, 2025
- Micron Technology, Inc.
- Tony M. Brewer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 12,266,659
- Issue date Apr 1, 2025
- Samsung Electronics Co., Ltd.
- Keunhwi Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on standardized commodity programmable logic semi...
- Patent number 12,255,195
- Issue date Mar 18, 2025
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filler cell region with centrally uncut gate segments, semiconducto...
- Patent number 12,237,321
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shun Li Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,237,334
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of manufacturing the same
- Patent number 12,236,180
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Jung Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit and method of forming the same
- Patent number 12,224,285
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal structure
- Patent number 12,218,139
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including integrated standard cell structure
- Patent number 12,218,140
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- In Hak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standard-cell layout structure with horn power and smart metal cut
- Patent number 12,211,793
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ni-Wan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC including standard cells and SRAM cells
- Patent number 12,213,296
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhon-Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cell architecture with extended transistor geometry
- Patent number 12,211,850
- Issue date Jan 28, 2025
- Texas Instruments Incorporated
- Rakesh Dimri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,211,534
- Issue date Jan 28, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device including standard cells
- Patent number 12,211,851
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ta-Pen Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,205,622
- Issue date Jan 21, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 12,205,953
- Issue date Jan 21, 2025
- SOCIONEXT INC.
- Toshio Hino
- B82 - NANO-TECHNOLOGY
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 12,199,093
- Issue date Jan 14, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standard and engineering change order (ECO) cell regions and semico...
- Patent number 12,199,037
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chun Tien
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Logic cell with small cell delay
- Patent number 12,191,310
- Issue date Jan 7, 2025
- Mediatek Inc.
- Kin-Hooi Dia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including frontside power mesh and backside po...
- Patent number 12,176,288
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yu Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC including standard cells and SRAM cells
- Patent number 12,159,872
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhon-Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrayed switch circuit, switching element and system chip package s...
- Patent number 12,154,905
- Issue date Nov 26, 2024
- Industrial Technology Research Institute
- Jie Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having non-integral multiple pitch
- Patent number 12,153,868
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shang-Chih Hsieh
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
DOMAIN MERGER CELL TO ABUT POWER DOMAINS FOR CHIP AREA REDUCTION
- Publication number 20250072110
- Publication date Feb 27, 2025
- QUALCOMM Incorporated
- Kamesh MEDISETTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING NON-INTEGRAL MULTIPLE PITCH
- Publication number 20250061260
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Chih HSIEH
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250063814
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Eui Bok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT
- Publication number 20250063815
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhon-Jhy LIAW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250056879
- Publication date Feb 13, 2025
- SOCIONEXT INC.
- Atsushi OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20250040245
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Suk YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TRANSISTOR LOCAL INTERCONNECTS
- Publication number 20250038111
- Publication date Jan 30, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Mahbub Rashed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20250006735
- Publication date Jan 2, 2025
- SOCIONEXT INC.
- Hideyuki KOMURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250006544
- Publication date Jan 2, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250006844
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Jeeeun YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
- Publication number 20240429086
- Publication date Dec 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240413161
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Ho-Jun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CELL ARCHITECTURE WITH IMPROVED BACKSIDE POWER RAIL THROUGH ENGINEE...
- Publication number 20240413160
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Jintae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ZERO DIFFUSION BREAK BETWEEN STANDARD CELLS USING THREE-DIMENSIONAL...
- Publication number 20240403529
- Publication date Dec 5, 2024
- ADVANCED MICRO DEVICES, INC.
- Richard Schultz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...
- Publication number 20240404866
- Publication date Dec 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
DUAL POWER STRUCTURE WITH EFFICIENT LAYOUT
- Publication number 20240395715
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Shih-Wei Peng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20240395944
- Publication date Nov 28, 2024
- SOCIONEXT INC.
- Hiroyuki SHIMBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF GENERATING LAYOUT DIAGRAM INCLUDING MERGED PILLAR STRUCTURES
- Publication number 20240394458
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hiranmay BISWAS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF FORMING SAME
- Publication number 20240395821
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE
- Publication number 20240395592
- Publication date Nov 28, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTOR BASED TEMPERATURE SENSOR
- Publication number 20240385056
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Lien Linus LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD
- Publication number 20240387554
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Yao HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD
- Publication number 20240387505
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ling CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE SEMICONDUCTOR DEVICES USING MULTI-BRIDGE-CHANNEL F...
- Publication number 20240387552
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Kyenhee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240387553
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASING DEVICE DENSITY AND REDUCING CROSS-TALK SPACER STRUCTURES
- Publication number 20240379745
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH THREE LEVELS AND ISOLATI...
- Publication number 20240379502
- Publication date Nov 14, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT STRUCTURE WITH UNDERGROUND INTERCONNECT (UGI)...
- Publication number 20240363638
- Publication date Oct 31, 2024
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20240363385
- Publication date Oct 31, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20240363686
- Publication date Oct 31, 2024
- SOCIONEXT INC.
- Junji IWAHORI
- G11 - INFORMATION STORAGE

Static random access memory structures and multistep manufacturing processes therefor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit

Integrated circuit device, method and system

IC logic device, layout, system, and method

Semiconductor integrated circuit

Integrated circuit structure

Semiconductor device

Semiconductor device

3D stacked integrated circuits having functional blocks configured...

Semiconductor device

Logic drive based on standardized commodity programmable logic semi...

Filler cell region with centrally uncut gate segments, semiconducto...

Semiconductor structure

Integrated circuit and method of manufacturing the same

Integrated circuit and method of forming the same

Semiconductor device with metal structure

Integrated circuit including integrated standard cell structure

Standard-cell layout structure with horn power and smart metal cut

IC including standard cells and SRAM cells

Cell architecture with extended transistor geometry

Semiconductor device

Semiconductor device including standard cells

Semiconductor device

Semiconductor integrated circuit device

3D semiconductor devices and structures with metal layers

Standard and engineering change order (ECO) cell regions and semico...

Logic cell with small cell delay

Semiconductor device including frontside power mesh and backside po...

IC including standard cells and SRAM cells

Arrayed switch circuit, switching element and system chip package s...

Integrated circuit having non-integral multiple pitch

Patents Applicationslast 30 patents

DOMAIN MERGER CELL TO ABUT POWER DOMAINS FOR CHIP AREA REDUCTION

INTEGRATED CIRCUIT HAVING NON-INTEGRAL MULTIPLE PITCH

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH TRANSISTOR LOCAL INTERCONNECTS

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

SEMICONDUCTOR DEVICE

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS

SEMICONDUCTOR DEVICE

CELL ARCHITECTURE WITH IMPROVED BACKSIDE POWER RAIL THROUGH ENGINEE...

ZERO DIFFUSION BREAK BETWEEN STANDARD CELLS USING THREE-DIMENSIONAL...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...

DUAL POWER STRUCTURE WITH EFFICIENT LAYOUT

SEMICONDUCTOR CHIP

METHOD OF GENERATING LAYOUT DIAGRAM INCLUDING MERGED PILLAR STRUCTURES

INTEGRATED CIRCUIT AND METHOD OF FORMING SAME

METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE

THIN FILM TRANSISTOR BASED TEMPERATURE SENSOR

INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD

INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD

HIGH PERFORMANCE SEMICONDUCTOR DEVICES USING MULTI-BRIDGE-CHANNEL F...

SEMICONDUCTOR STRUCTURE

INCREASING DEVICE DENSITY AND REDUCING CROSS-TALK SPACER STRUCTURES

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH THREE LEVELS AND ISOLATI...

SEMICONDUCTOR CIRCUIT STRUCTURE WITH UNDERGROUND INTERCONNECT (UGI)...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE