Static random access memory structures and multistep manufacturing processes therefor

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H01L27/11

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/11Static random access memory structures and multistep manufacturing processes therefor

Industries

Patents Grantslast 30 patents

Information Patent Grant
Thin film transistor based temperature sensor
- Patent number 12,146,798
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Lien Linus Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with transistor local interconnects
- Patent number 12,148,702
- Issue date Nov 19, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Mahbub Rashed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increasing device density and reducing cross-talk spacer structures
- Patent number 12,148,795
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual power structure with efficient layout
- Patent number 12,142,563
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Shih-Wei Peng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 12,136,562
- Issue date Nov 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including multiple height cell
- Patent number 12,136,626
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Jung-ho Do
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Standard cell and an integrated circuit including the same
- Patent number 12,125,787
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Jae-boong Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,125,737
- Issue date Oct 22, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 12,119,349
- Issue date Oct 15, 2024
- SOCIONEXT INC.
- Hideyuki Komuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device including PG-aligned...
- Patent number 12,112,117
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hiranmay Biswas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of forming merged pillar structures and method of generating...
- Patent number 12,106,030
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hiranmay Biswas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,100,611
- Issue date Sep 24, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor integrated circuit device having a standard cell whic...
- Patent number 12,094,878
- Issue date Sep 17, 2024
- SOCIONEXT INC.
- Hiroyuki Shimbo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 12,094,882
- Issue date Sep 17, 2024
- SOCIONEXT INC.
- Hideyuki Komuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 12,080,804
- Issue date Sep 3, 2024
- SOCIONEXT INC.
- Hiroyuki Shimbo
- B82 - NANO-TECHNOLOGY
Information Patent Grant
3D semiconductor device and structure with metal layers and a conne...
- Patent number 12,080,630
- Issue date Sep 3, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 12,080,805
- Issue date Sep 3, 2024
- SOCIONEXT INC.
- Hiroyuki Shimbo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi version library cell handling and integrated circuit structur...
- Patent number 12,067,338
- Issue date Aug 20, 2024
- Intel Corporation
- Ranjith Kumar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optimization of semiconductor cell of vertical field effect transis...
- Patent number 12,068,325
- Issue date Aug 20, 2024
- Samsung Electronics Co., Ltd.
- Jung Ho Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,068,326
- Issue date Aug 20, 2024
- Samsung Electronics Co., Ltd.
- Young-Hun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding and DRAM memory...
- Patent number 12,068,187
- Issue date Aug 20, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 12,062,694
- Issue date Aug 13, 2024
- SOCIONEXT INC.
- Junji Iwahori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin modification for standard cells
- Patent number 12,056,432
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatuses, methods, and systems for an array of devices
- Patent number 12,046,601
- Issue date Jul 23, 2024
- ZetaGig Inc.
- Sandeep Kumar Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including back side power supply circuit
- Patent number 12,040,270
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gerben Doornbos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,033,884
- Issue date Jul 9, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device having active fin pattern at cell boundary
- Patent number 12,034,008
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Sanghoon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 12,027,518
- Issue date Jul 2, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device, method, and system
- Patent number 12,027,525
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Yao Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit device and method
- Patent number 12,014,982
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Yu Lin
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
THIN FILM TRANSISTOR BASED TEMPERATURE SENSOR
- Publication number 20240385056
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Lien Linus LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD
- Publication number 20240387554
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Yao HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD
- Publication number 20240387505
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ling CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PERFORMANCE SEMICONDUCTOR DEVICES USING MULTI-BRIDGE-CHANNEL F...
- Publication number 20240387552
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Kyenhee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240387553
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASING DEVICE DENSITY AND REDUCING CROSS-TALK SPACER STRUCTURES
- Publication number 20240379745
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH THREE LEVELS AND ISOLATI...
- Publication number 20240379502
- Publication date Nov 14, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT STRUCTURE WITH UNDERGROUND INTERCONNECT (UGI)...
- Publication number 20240363638
- Publication date Oct 31, 2024
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20240363385
- Publication date Oct 31, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20240363686
- Publication date Oct 31, 2024
- SOCIONEXT INC.
- Junji IWAHORI
- G11 - INFORMATION STORAGE
Information Patent Application
MULTI VERSION LIBRARY CELL HANDLING AND INTEGRATED CIRCUIT STRUCTUR...
- Publication number 20240362391
- Publication date Oct 31, 2024
- Intel Corporation
- Ranjith KUMAR
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PIN MODIFICATION FOR STANDARD CELLS
- Publication number 20240354487
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fong-yuan CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ROUTABILITY IMPROVEMENT FOR AN ULTRA-HIGH DENSE STANDARD CELL ARCHI...
- Publication number 20240332278
- Publication date Oct 3, 2024
- QUALCOMM Incorporated
- Raheel AZMAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD
- Publication number 20240332174
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yu LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ACTIVE FIN PATTERN AT CELL BOUNDARY
- Publication number 20240332305
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Sanghoon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20240332304
- Publication date Oct 3, 2024
- SOCIONEXT INC.
- Hideyuki KOMURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BACK SIDE POWER SUPPLY CIRCUIT
- Publication number 20240332188
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gerben DOORNBOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI REQUEST ASYNCHRONOUS DELEGATION FOR ENHANCED PERFORMANCE
- Publication number 20240332292
- Publication date Oct 3, 2024
- eBay Inc.
- Vineet BINDAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC CIRCUITS INCLUDING CIRCUITS OF DIFFERENT HEIGHTS AND RELATED...
- Publication number 20240321861
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Haining Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF FORMING SAME
- Publication number 20240311543
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Sheng WANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20240304617
- Publication date Sep 12, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, SYSTEM FOR AND METHOD OF FORMING AN INTEGRATED...
- Publication number 20240296273
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Chan YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SELF-ALIGNED BACKSIDE INTERCONNECT STRUCTURES
- Publication number 20240297167
- Publication date Sep 5, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240290790
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Sunki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER RAIL AND SIGNAL CONDUCTING LINE ARRANGEMENT
- Publication number 20240274607
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guo-Huei WU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BACKSIDE CONDUCTING LINES IN INTEGRATED CIRCUITS
- Publication number 20240266345
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-An LAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240243133
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhon-Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING INTEGRATED STANDARD CELL STRUCTURE
- Publication number 20240243134
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Hyeon Gyu YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20240234322
- Publication date Jul 11, 2024
- SOCIONEXT INC.
- Hayato SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Disaggregation For Improved Performance
- Publication number 20240234424
- Publication date Jul 11, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS

Static random access memory structures and multistep manufacturing processes therefor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thin film transistor based temperature sensor

Semiconductor device with transistor local interconnects

Increasing device density and reducing cross-talk spacer structures

Dual power structure with efficient layout

3D semiconductor device and structure with single-crystal layers

Integrated circuit including multiple height cell

Standard cell and an integrated circuit including the same

3D semiconductor device and structure with metal layers and memory...

Semiconductor integrated circuit device

Method of manufacturing a semiconductor device including PG-aligned...

Method of forming merged pillar structures and method of generating...

Methods for producing a 3D semiconductor device and structure with...

Semiconductor integrated circuit device having a standard cell whic...

Semiconductor integrated circuit device

Semiconductor integrated circuit device

3D semiconductor device and structure with metal layers and a conne...

Semiconductor chip

Multi version library cell handling and integrated circuit structur...

Optimization of semiconductor cell of vertical field effect transis...

Semiconductor device and method of manufacturing the same

3D semiconductor device and structure with bonding and DRAM memory...

Semiconductor integrated circuit device

Pin modification for standard cells

Apparatuses, methods, and systems for an array of devices

Semiconductor device including back side power supply circuit

Methods for producing a 3D semiconductor device and structure with...

Semiconductor device having active fin pattern at cell boundary

3D semiconductor devices and structures with metal layers

Integrated circuit device, method, and system

Integrated circuit device and method

Patents Applicationslast 30 patents

THIN FILM TRANSISTOR BASED TEMPERATURE SENSOR

INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD

INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD

HIGH PERFORMANCE SEMICONDUCTOR DEVICES USING MULTI-BRIDGE-CHANNEL F...

SEMICONDUCTOR STRUCTURE

INCREASING DEVICE DENSITY AND REDUCING CROSS-TALK SPACER STRUCTURES

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH THREE LEVELS AND ISOLATI...

SEMICONDUCTOR CIRCUIT STRUCTURE WITH UNDERGROUND INTERCONNECT (UGI)...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

MULTI VERSION LIBRARY CELL HANDLING AND INTEGRATED CIRCUIT STRUCTUR...

PIN MODIFICATION FOR STANDARD CELLS

ROUTABILITY IMPROVEMENT FOR AN ULTRA-HIGH DENSE STANDARD CELL ARCHI...

INTEGRATED CIRCUIT DEVICE AND METHOD

SEMICONDUCTOR DEVICE HAVING ACTIVE FIN PATTERN AT CELL BOUNDARY

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE INCLUDING BACK SIDE POWER SUPPLY CIRCUIT

MULTI REQUEST ASYNCHRONOUS DELEGATION FOR ENHANCED PERFORMANCE

LOGIC CIRCUITS INCLUDING CIRCUITS OF DIFFERENT HEIGHTS AND RELATED...

INTEGRATED CIRCUIT AND METHOD OF FORMING SAME

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

INTEGRATED CIRCUIT, SYSTEM FOR AND METHOD OF FORMING AN INTEGRATED...

SELF-ALIGNED BACKSIDE INTERCONNECT STRUCTURES

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

POWER RAIL AND SIGNAL CONDUCTING LINE ARRANGEMENT

BACKSIDE CONDUCTING LINES IN INTEGRATED CIRCUITS

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

INTEGRATED CIRCUIT INCLUDING INTEGRATED STANDARD CELL STRUCTURE

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Device Disaggregation For Improved Performance