Stereolithography

Industry

CPC
H01L2224/27554

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/27554Stereolithography

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Underfill and encapsulation of semiconductor assemblies with materi...
- Patent number 7,547,978
- Issue date Jun 16, 2009
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices at least partially covered by a composite coa...
- Patent number 7,282,806
- Issue date Oct 16, 2007
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having stereolithographically fabricated prot...
- Patent number 7,166,925
- Issue date Jan 23, 2007
- Micron Technology, Inc.
- Salman Akram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stereolithographic methods of fabricating semiconductor devices hav...
- Patent number 6,893,904
- Issue date May 17, 2005
- Micron Technology, Inc.
- Salman Akram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices having stereolithographically fabricated prot...
- Patent number 6,861,763
- Issue date Mar 1, 2005
- Micron Technology, Inc.
- Salman Akram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stereolithographic methods of fabricating semiconductor devices hav...
- Patent number 6,544,821
- Issue date Apr 8, 2003
- Micron Technology, Inc.
- Salman Akram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices having protective layers thereon through whic...
- Patent number 6,326,698
- Issue date Dec 4, 2001
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods of underfilling and encapsulating semiconductor assemblies...
- Publication number 20070020814
- Publication date Jan 25, 2007
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices at least partially covered by a composite coa...
- Publication number 20070001321
- Publication date Jan 4, 2007
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill and encapsulation of semicondcutor assemblies with materi...
- Publication number 20050277231
- Publication date Dec 15, 2005
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices having stereolithographically fabricated prot...
- Publication number 20050156331
- Publication date Jul 21, 2005
- SALMAN AKRAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor devices having stereolithographically fabricated prot...
- Publication number 20030089999
- Publication date May 15, 2003
- SALMAN AKRAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stereolithographic methods of fabricating semiconductor devices hav...
- Publication number 20030092220
- Publication date May 15, 2003
- SALMAN AKRAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor devices having protective layers thereon through whic...
- Publication number 20010051392
- Publication date Dec 13, 2001
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS

Stereolithography

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Underfill and encapsulation of semiconductor assemblies with materi...

Semiconductor devices at least partially covered by a composite coa...

Semiconductor devices having stereolithographically fabricated prot...

Stereolithographic methods of fabricating semiconductor devices hav...

Semiconductor devices having stereolithographically fabricated prot...

Stereolithographic methods of fabricating semiconductor devices hav...

Semiconductor devices having protective layers thereon through whic...

Patents Applicationslast 30 patents

Methods of underfilling and encapsulating semiconductor assemblies...

Semiconductor devices at least partially covered by a composite coa...

Underfill and encapsulation of semicondcutor assemblies with materi...

Semiconductor devices having stereolithographically fabricated prot...

Semiconductor devices having stereolithographically fabricated prot...

Stereolithographic methods of fabricating semiconductor devices hav...

Semiconductor devices having protective layers thereon through whic...