Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

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H01L22/30

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements

Current Industry

H01L22/30Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Array substrate, display panel and display device
- Patent number 12,218,146
- Issue date Feb 4, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Tiaomei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level testing of optical components
- Patent number 12,211,755
- Issue date Jan 28, 2025
- II-VI DELAWARE, INC.
- Shiyun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit filler and method thereof
- Patent number 12,183,729
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tseng Chin Lo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and device for predicting inclination angle, and method and...
- Patent number 12,176,252
- Issue date Dec 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Bo Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate processing apparatus and semiconductor subs...
- Patent number 12,165,933
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Inkeun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System with substrate carrier deterioration detection and repair
- Patent number 12,162,134
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jen-Ti Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for determining characteristics of semiconducto...
- Patent number 12,158,492
- Issue date Dec 3, 2024
- FemtoMetrix, Inc.
- Ming Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defect measurement method
- Patent number 12,142,537
- Issue date Nov 12, 2024
- National Tsing Hua University
- Burn-Jeng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch stop detection structure and etch stop detection method
- Patent number 12,142,519
- Issue date Nov 12, 2024
- United Microelectronics Corp.
- Runshun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of manufacturing semiconductor appar...
- Patent number 12,131,966
- Issue date Oct 29, 2024
- Kabushiki Kaisha Toshiba
- Fuyuma Ito
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for grinding wafer and wafer failure analysis method
- Patent number 12,125,752
- Issue date Oct 22, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jiabao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Latch-up test structure
- Patent number 12,119,274
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Qian Xu
- G01 - MEASURING TESTING
Information Patent Grant
Metrology target design for tilted device designs
- Patent number 12,117,347
- Issue date Oct 15, 2024
- KLA Corporation
- Myungjun Lee
- G01 - MEASURING TESTING
Information Patent Grant
Non-conductive film sheet and semiconductor package including the same
- Patent number 12,062,633
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and trimming method of the same
- Patent number 12,061,123
- Issue date Aug 13, 2024
- Renesas Electronics Corporation
- Shin Tamura
- G01 - MEASURING TESTING
Information Patent Grant
Metrology slot plates
- Patent number 12,057,333
- Issue date Aug 6, 2024
- Applied Materials, Inc.
- Kenneth Brian Doering
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data processing method and system for detection of deterioration of...
- Patent number 12,055,498
- Issue date Aug 6, 2024
- Top Technology Platform Co., Ltd.
- Chyuan-Ruey Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing process control method and apparatus, d...
- Patent number 12,040,240
- Issue date Jul 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yu-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mid-manufacturing semiconductor wafer layer testing
- Patent number 12,033,902
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat exchanger for thermal control of heat producing devices
- Patent number 12,019,095
- Issue date Jun 25, 2024
- Mikros Manufacturing, Inc.
- Jesse D. McGowan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for wafer-level photonic testing
- Patent number 12,014,962
- Issue date Jun 18, 2024
- Ayar Labs, Inc.
- Roy Edward Meade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of integrated substrate
- Patent number 12,009,329
- Issue date Jun 11, 2024
- Dyi-Chung Hu
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor test apparatus and semiconductor test method
- Patent number 12,007,414
- Issue date Jun 11, 2024
- Mitsubishi Electric Corporation
- Yoshiyuki Ueda
- G01 - MEASURING TESTING
Information Patent Grant
Display device including an adhesive layer
- Patent number 11,984,367
- Issue date May 14, 2024
- Samsung Display Co., Ltd.
- Eunhye Park
- G02 - OPTICS
Information Patent Grant
Resonator for testing, method for manufacturing resonator for testi...
- Patent number 11,973,488
- Issue date Apr 30, 2024
- SUZHOU HUNTERSUN ELECTRONICS CO., LTD.
- Zhiguo Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell and photovoltaic module
- Patent number 11,972,988
- Issue date Apr 30, 2024
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Andreas Beinert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-product overlay targets
- Patent number 11,967,535
- Issue date Apr 23, 2024
- KLA Corporation
- Amnon Manassen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and semiconductor apparatus leak inspection...
- Patent number 11,967,537
- Issue date Apr 23, 2024
- Mitsubishi Electric Corporation
- Takayuki Hisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating reticle
- Patent number 11,940,737
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsueh-Yi Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor ele...
- Patent number 11,942,382
- Issue date Mar 26, 2024
- Mitsubishi Electric Corporation
- Noritsugu Nomura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METROLOGY TARGET DESIGN FOR TILTED DEVICE DESIGNS
- Publication number 20250035489
- Publication date Jan 30, 2025
- KLA Corporation
- Myungjun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METROLOGY SLOT PLATES
- Publication number 20250014922
- Publication date Jan 9, 2025
- Applied Materials Inc.
- Kenneth Brian Doering
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINI ENVIRONMENT INSTRUMENTED WAFER
- Publication number 20250014950
- Publication date Jan 9, 2025
- KLA Corporation
- Giampietro Bieli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Array Substrate, Array Motherboard, Light-Emitting Substrate, Backl...
- Publication number 20240421163
- Publication date Dec 19, 2024
- Jie Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR ALIGNING A WAFER TO A CHUCK
- Publication number 20240412992
- Publication date Dec 12, 2024
- KLA Corporation
- Jaime Poris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOM PROBE TOMOGRAPHY SPECIMEN PREPARATION
- Publication number 20240395636
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MID-MANUFACTURING SEMICONDUCTOR WAFER LAYER TESTING
- Publication number 20240395638
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20240371837
- Publication date Nov 7, 2024
- AUO Corporation
- Peng-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESILIENT CONDUCTIVE BUMP FOR MICROELECTRONIC TESTING
- Publication number 20240339365
- Publication date Oct 10, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Nathaniel P. Wyckoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF OVERLAY MEASUREMENT OF SEMICO...
- Publication number 20240266234
- Publication date Aug 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chan Hen YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CRACK DETECTION CIRCUIT
- Publication number 20240258180
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Taehong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TEST APPARATUS AND SEMICONDUCTOR TEST METHOD
- Publication number 20240219426
- Publication date Jul 4, 2024
- Mitsubishi Electric Corporation
- Yoshiyuki Ueda
- G01 - MEASURING TESTING
Information Patent Application
IDENTIFICATION INFORMATION ACQUISITION METHOD, PATTERN FORMING METH...
- Publication number 20240213176
- Publication date Jun 27, 2024
- Canon Kabushiki Kaisha
- YOSHIHITO TADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Detection Film and Manufacturing Method Therefor, Detection Method...
- Publication number 20240213418
- Publication date Jun 27, 2024
- CHONGQING KONKA PHOTOELECTRIC TECHNOLLOGY RESEARCH INSTITUTE CO., LTD.
- Feng ZHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE RESISTANT CONTACT UNIT HOLDER RECEPTACLE ASSEMBLY AND R...
- Publication number 20240201224
- Publication date Jun 20, 2024
- Semiconductor Components Industries, LLC
- Novellie Pangilinan VICTORIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240203800
- Publication date Jun 20, 2024
- KIOXIA Corporation
- Naoki YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESONATOR FOR TESTING, METHOD FOR MANUFACTURING RESONATOR FOR TESTI...
- Publication number 20240120899
- Publication date Apr 11, 2024
- Suzhou HunterSun Electronics Co., Ltd.
- Zhiguo Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING DEVICE CAPABLE OF DETECTING RISK OF IMPACT OF ELECTROSTAT...
- Publication number 20240120241
- Publication date Apr 11, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ASSEMBLY AND METHOD FOR PRODUCING A PLURALITY OF SEMICONDUCTO...
- Publication number 20240096681
- Publication date Mar 21, 2024
- ams-OSRAM International GmbH
- Teresa Baur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT-OVERLAY MARK AND METHOD USING THE SAME
- Publication number 20240096813
- Publication date Mar 21, 2024
- Micron Technology, Inc.
- KAZUKO YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEFECT MONITORING STRUCTURE
- Publication number 20240087966
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chu Fu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH OVERLAY MARK, METHOD OF MANUFACTURING...
- Publication number 20240071842
- Publication date Feb 29, 2024
- NANYA TECHNOLOGY CORPORATION
- Tsai-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH OVERLAY MARK AND SYSTEM FOR MANUFACTUR...
- Publication number 20240071843
- Publication date Feb 29, 2024
- NANYA TECHNOLOGY CORPORATION
- Tsai-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR EVALUATING WORK-AFFECTED LAYER
- Publication number 20240068958
- Publication date Feb 29, 2024
- KWANSEI GAKUIN EDUCATIONAL FOUNDATION
- Tadaaki KANEKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240063059
- Publication date Feb 22, 2024
- RENESAS ELECTRONICS CORPORATION
- Koichi ANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240030072
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Mingi HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240021485
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230422553
- Publication date Dec 28, 2023
- SHARP KABUSHIKI KAISHA
- YUSUKE SAKAKIBARA
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
DISPLAY PANEL, PREPARATION METHOD FOR DISPLAY PANEL, AND DISPLAY DE...
- Publication number 20230420311
- Publication date Dec 28, 2023
- Mianyang HKC Optoelectronics Technology Co., Ltd.
- Jianying ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT EXCHANGER FOR THERMAL CONTROL OF HEAT PRODUCING DEVICES
- Publication number 20230408545
- Publication date Dec 21, 2023
- Mikros Manufacturing, Inc.
- Jesse D. McGowan
- H01 - BASIC ELECTRIC ELEMENTS

Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Array substrate, display panel and display device

Wafer level testing of optical components

Integrated circuit filler and method thereof

Method and device for predicting inclination angle, and method and...

Semiconductor substrate processing apparatus and semiconductor subs...

System with substrate carrier deterioration detection and repair

Systems and methods for determining characteristics of semiconducto...

Defect measurement method

Etch stop detection structure and etch stop detection method

Semiconductor wafer and method of manufacturing semiconductor appar...

Method for grinding wafer and wafer failure analysis method

Latch-up test structure

Metrology target design for tilted device designs

Non-conductive film sheet and semiconductor package including the same

Semiconductor device and trimming method of the same

Metrology slot plates

Data processing method and system for detection of deterioration of...

Semiconductor manufacturing process control method and apparatus, d...

Mid-manufacturing semiconductor wafer layer testing

Heat exchanger for thermal control of heat producing devices

Systems and methods for wafer-level photonic testing

Manufacturing method of integrated substrate

Semiconductor test apparatus and semiconductor test method

Display device including an adhesive layer

Resonator for testing, method for manufacturing resonator for testi...

Solar cell and photovoltaic module

On-product overlay targets

Semiconductor apparatus and semiconductor apparatus leak inspection...

Method of fabricating reticle

Semiconductor device and method for manufacturing semiconductor ele...

Patents Applicationslast 30 patents

METROLOGY TARGET DESIGN FOR TILTED DEVICE DESIGNS

METROLOGY SLOT PLATES

MINI ENVIRONMENT INSTRUMENTED WAFER

Array Substrate, Array Motherboard, Light-Emitting Substrate, Backl...

SYSTEM AND METHOD FOR ALIGNING A WAFER TO A CHUCK

ATOM PROBE TOMOGRAPHY SPECIMEN PREPARATION

MID-MANUFACTURING SEMICONDUCTOR WAFER LAYER TESTING

DISPLAY DEVICE AND FABRICATION METHOD THEREOF

RESILIENT CONDUCTIVE BUMP FOR MICROELECTRONIC TESTING

SEMICONDUCTOR STRUCTURE AND METHOD OF OVERLAY MEASUREMENT OF SEMICO...

SEMICONDUCTOR DEVICE INCLUDING CRACK DETECTION CIRCUIT

SEMICONDUCTOR TEST APPARATUS AND SEMICONDUCTOR TEST METHOD

IDENTIFICATION INFORMATION ACQUISITION METHOD, PATTERN FORMING METH...

Detection Film and Manufacturing Method Therefor, Detection Method...

TEMPERATURE RESISTANT CONTACT UNIT HOLDER RECEPTACLE ASSEMBLY AND R...

SEMICONDUCTOR MEMORY AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

RESONATOR FOR TESTING, METHOD FOR MANUFACTURING RESONATOR FOR TESTI...

PACKAGING DEVICE CAPABLE OF DETECTING RISK OF IMPACT OF ELECTROSTAT...

WAFER ASSEMBLY AND METHOD FOR PRODUCING A PLURALITY OF SEMICONDUCTO...

ALIGNMENT-OVERLAY MARK AND METHOD USING THE SAME

DISPLAY DEFECT MONITORING STRUCTURE

SEMICONDUCTOR STRUCTURE WITH OVERLAY MARK, METHOD OF MANUFACTURING...

SEMICONDUCTOR STRUCTURE WITH OVERLAY MARK AND SYSTEM FOR MANUFACTUR...

METHOD AND SYSTEM FOR EVALUATING WORK-AFFECTED LAYER

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

DISPLAY DEVICE

DISPLAY PANEL, PREPARATION METHOD FOR DISPLAY PANEL, AND DISPLAY DE...

HEAT EXCHANGER FOR THERMAL CONTROL OF HEAT PRODUCING DEVICES