Structure of the auxiliary member

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CPC
H01L2224/0225

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0225Structure of the auxiliary member

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of soldering a semiconductor chip to a chip carrier
- Patent number 12,132,017
- Issue date Oct 29, 2024
- Infineon Technologies AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 12,074,127
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having a through electrode and semiconductor pac...
- Patent number 12,027,482
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly including an airgap containing bonding-level dielec...
- Patent number 11,948,902
- Issue date Apr 2, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and method of manufacturing bump structure
- Patent number 11,923,326
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,862,586
- Issue date Jan 2, 2024
- Kioxia Corporation
- Mizuki Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and method for forming the same
- Patent number 11,848,270
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hong-Seng Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip with chip pad and associated solder flux outgassing trench
- Patent number 11,830,835
- Issue date Nov 28, 2023
- Infineon Technologies AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,830,832
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with stress relief stru...
- Patent number 11,791,294
- Issue date Oct 17, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro LED display having multi-color pixel array and method of fabr...
- Patent number 11,721,681
- Issue date Aug 8, 2023
- Korea Advanced Institute of Science and Technology
- Sanghyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 11,515,272
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 11,488,882
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and method of manufacturing bump structure
- Patent number 11,456,266
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling of integrated circuits (ICS) through a passivation-defined...
- Patent number 11,450,630
- Issue date Sep 20, 2022
- Cirrus Logic, Inc.
- Christopher Healy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-passivation interconnect structure
- Patent number 11,417,610
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with air gap and method for forming...
- Patent number 11,309,266
- Issue date Apr 19, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-connection structure and manufacturing method thereof
- Patent number 11,152,319
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging thereof
- Patent number 11,094,622
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,069,591
- Issue date Jul 20, 2021
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,957,664
- Issue date Mar 23, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack structure and method of fabricating the same
- Patent number 10,879,214
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 10,847,459
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,847,476
- Issue date Nov 24, 2020
- Samsung Electronics Co., Ltd.
- Jun Woo Myung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 10,741,467
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a composite barrier layer
- Patent number 10,665,556
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-connection structure and manufacturing method thereof
- Patent number 10,651,142
- Issue date May 12, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 10,629,554
- Issue date Apr 21, 2020
- Powertech Technology Inc.
- Nan-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device containing and method of providing carbon covered copper layer
- Patent number 10,546,826
- Issue date Jan 28, 2020
- Intel IP Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240387421
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Hyungsun JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321792
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Duckgyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING A THROUGH ELECTRODE AND SEMICONDUCTOR PAC...
- Publication number 20240321794
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
- Publication number 20240258252
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE OR DEVICE WITH BARRIER LAYER
- Publication number 20240162175
- Publication date May 16, 2024
- STMicroelectronics S.r.l.
- Lucrezia GUARINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE
- Publication number 20240120277
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Seng SHUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SOLDERING A SEMICONDUCTOR CHIP TO A CHIP CARRIER
- Publication number 20240055376
- Publication date Feb 15, 2024
- INFINEON TECHNOLOGIES AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING DISPLAY SUBSTRATE AND DISPLAY SUBSTRATE
- Publication number 20240006421
- Publication date Jan 4, 2024
- HKC Corporation Limited
- ZHONGXIE XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Step Seal Ring and Methods Forming...
- Publication number 20230386908
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDE AND CARBON LAYERS AT A SURFACE OF A SUBSTRATE FOR HYBRID BONDING
- Publication number 20230187395
- Publication date Jun 15, 2023
- Intel Corporation
- Nafees A. KABIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH SOLDER RESTRAINING WALL
- Publication number 20230106976
- Publication date Apr 6, 2023
- Texas Instruments Incorporated
- John Carlo Cruz Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Contact Structure and Method
- Publication number 20230085696
- Publication date Mar 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...
- Publication number 20230036317
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Heng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230010936
- Publication date Jan 12, 2023
- Samsung Electronics Co., Ltd.
- JEONGGI JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230010383
- Publication date Jan 12, 2023
- RENESAS ELECTRONICS CORPORATION
- Takayuki IGARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY INCLUDING AN AIRGAP CONTAINING BONDING-LEVEL DIELEC...
- Publication number 20230008286
- Publication date Jan 12, 2023
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
- Publication number 20220406741
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220406739
- Publication date Dec 22, 2022
- KIOXIA Corporation
- Mizuki TAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLING OF INTEGRATED CIRCUITS (ICS) THROUGH A PASSIVATION-DEFINED...
- Publication number 20220130778
- Publication date Apr 28, 2022
- Cirrus Logic International Semiconductor Ltd.
- Christopher Healy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH STRESS RELIEF STRU...
- Publication number 20220102303
- Publication date Mar 31, 2022
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip with Chip Pad and Associated Solder Flux Outgassing Trench
- Publication number 20220068851
- Publication date Mar 3, 2022
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH AIR GAP AND METHOD FOR FORMING...
- Publication number 20210375803
- Publication date Dec 2, 2021
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210313245
- Publication date Oct 7, 2021
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210210447
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- TUNG-JIUN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
- Publication number 20210134746
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210125948
- Publication date Apr 29, 2021
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Contact Structure and Method
- Publication number 20210074627
- Publication date Mar 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED DISPLAY HAVING MULTI-COLOR PIXEL ARRAY AND METHOD OF FABR...
- Publication number 20210005589
- Publication date Jan 7, 2021
- Korea Advanced Institute of Science and Technology
- Sanghyeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200381378
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- TUNG-JIUN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200273827
- Publication date Aug 27, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS

Structure of the auxiliary member

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of soldering a semiconductor chip to a chip carrier

Semiconductor die contact structure and method

Semiconductor device and method for manufacturing semiconductor device

Semiconductor chip having a through electrode and semiconductor pac...

Bonded assembly including an airgap containing bonding-level dielec...

Bump structure and method of manufacturing bump structure

Semiconductor device and method of manufacturing the same

Chip structure and method for forming the same

Chip with chip pad and associated solder flux outgassing trench

Semiconductor structure and manufacturing method thereof

Method for fabricating semiconductor device with stress relief stru...

Micro LED display having multi-color pixel array and method of fabr...

Semiconductor die contact structure and method

Die-on-interposer assembly with dam structure and method of manufac...

Bump structure and method of manufacturing bump structure

Coupling of integrated circuits (ICS) through a passivation-defined...

Post-passivation interconnect structure

Semiconductor device structure with air gap and method for forming...

Micro-connection structure and manufacturing method thereof

Packaged semiconductor devices and methods of packaging thereof

Semiconductor device and method for manufacturing semiconductor device

Semiconductor structure and manufacturing method thereof

Die stack structure and method of fabricating the same

Semiconductor die contact structure and method

Semiconductor package

Die-on-interposer assembly with dam structure and method of manufac...

Semiconductor structure having a composite barrier layer

Micro-connection structure and manufacturing method thereof

Package structure and manufacturing method thereof

Device containing and method of providing carbon covered copper layer

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP HAVING A THROUGH ELECTRODE AND SEMICONDUCTOR PAC...

BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE

SEMICONDUCTOR PACKAGE OR DEVICE WITH BARRIER LAYER

CHIP STRUCTURE

METHOD OF SOLDERING A SEMICONDUCTOR CHIP TO A CHIP CARRIER

METHOD FOR PREPARING DISPLAY SUBSTRATE AND DISPLAY SUBSTRATE

Semiconductor Package Including Step Seal Ring and Methods Forming...

OXIDE AND CARBON LAYERS AT A SURFACE OF A SUBSTRATE FOR HYBRID BONDING

SEMICONDUCTOR DIE WITH SOLDER RESTRAINING WALL

Semiconductor Die Contact Structure and Method

WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE

BONDED ASSEMBLY INCLUDING AN AIRGAP CONTAINING BONDING-LEVEL DIELEC...

BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

COUPLING OF INTEGRATED CIRCUITS (ICS) THROUGH A PASSIVATION-DEFINED...

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH STRESS RELIEF STRU...

Chip with Chip Pad and Associated Solder Flux Outgassing Trench

SEMICONDUCTOR DEVICE STRUCTURE WITH AIR GAP AND METHOD FOR FORMING...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor Die Contact Structure and Method

MICRO LED DISPLAY HAVING MULTI-COLOR PIXEL ARRAY AND METHOD OF FABR...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF