Structure of the protective coating

Industry

CPC
H01L2224/02205

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/02205Structure of the protective coating

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a wire bonding pad structure connected...
- Patent number 12,068,268
- Issue date Aug 20, 2024
- Fuji Electric Co., Ltd.
- Morio Iwamizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package structures with recesses in molding comp...
- Patent number 12,057,432
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having a die, an encapsulant, and a redistri...
- Patent number 12,021,047
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive film
- Patent number 11,594,502
- Issue date Feb 28, 2023
- Fuji Electric Co., Ltd.
- Morio Iwamizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a semiconductor device with spacer over sidewa...
- Patent number 11,552,032
- Issue date Jan 10, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and manufacturing method thereof
- Patent number 11,424,204
- Issue date Aug 23, 2022
- Mediatek Inc.
- Po-Chao Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,380,636
- Issue date Jul 5, 2022
- Samsung Electronics Co., Ltd.
- Seung Min Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages having a die with an enca...
- Patent number 11,315,891
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing of flip-chip electronic device with carrier having he...
- Patent number 11,251,160
- Issue date Feb 15, 2022
- International Business Machines Corporation
- Stefano Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spacer over sidewall of bonding pad and m...
- Patent number 11,024,592
- Issue date Jun 1, 2021
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary post-assisted embedding of semiconductor dies
- Patent number 11,004,700
- Issue date May 11, 2021
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hetero-integrated structure
- Patent number 11,004,816
- Issue date May 11, 2021
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip electronic device with carrier having heat dissipation el...
- Patent number 10,886,254
- Issue date Jan 5, 2021
- International Business Machines Corporation
- Stefano Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,825,792
- Issue date Nov 3, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package structures with recesses in molding comp...
- Patent number 10,720,403
- Issue date Jul 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor copper metallization structure and related methods
- Patent number 10,700,027
- Issue date Jun 30, 2020
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,381,323
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 10,262,959
- Issue date Apr 16, 2019
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure
- Patent number 10,199,341
- Issue date Feb 5, 2019
- Siliconware Precision Industries Co., Ltd.
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor copper metallization structure and related methods
- Patent number 10,186,493
- Issue date Jan 22, 2019
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package structures with recesses in molding comp...
- Patent number 10,062,662
- Issue date Aug 28, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,020,281
- Issue date Jul 10, 2018
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for thermo-mechanical stress reduction in semiconductor devi...
- Patent number 9,960,131
- Issue date May 1, 2018
- STMicroelectronics S.r.l.
- Paolo Colpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package structures with recesses in molding comp...
- Patent number 9,953,955
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor copper metallization structure and related methods
- Patent number 9,905,522
- Issue date Feb 27, 2018
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with solder-based connection terminals and me...
- Patent number 9,831,202
- Issue date Nov 28, 2017
- Samsung Electronics Co., Ltd.
- Sun-kyoung Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structure for three-dimensional circuit integration
- Patent number 9,214,435
- Issue date Dec 15, 2015
- GLOBALFOUNDRIES Inc.
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,563,397
- Issue date Oct 22, 2013
- Semiconductor Energy Laboratory Co., Ltd.
- Akihiro Chida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A WIRE BONDING PAD STRUCTURE CONNECTED...
- Publication number 20240413107
- Publication date Dec 12, 2024
- Fuji Electric Co., Ltd.
- Morio IWAMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCA...
- Publication number 20240297131
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230326893
- Publication date Oct 12, 2023
- Samsung Electronics Co., Ltd.
- Sangho CHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230197650
- Publication date Jun 22, 2023
- Fuji Electric Co., Ltd.
- Morio IWAMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Semiconductor Packages Having a Die with an Enca...
- Publication number 20220246559
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR DIE EMBEDDED IN A MOLDI...
- Publication number 20210217633
- Publication date Jul 15, 2021
- INFINEON TECHNOLOGIES AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING A SEMICONDUCTOR DEVICE WITH SPACER OVER SIDEWA...
- Publication number 20210202416
- Publication date Jul 1, 2021
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SPACER OVER SIDEWALL OF BONDING PAD AND M...
- Publication number 20210118830
- Publication date Apr 22, 2021
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Temporary Post-Assisted Embedding of Semiconductor Dies
- Publication number 20210057234
- Publication date Feb 25, 2021
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20210050315
- Publication date Feb 18, 2021
- MEDIATEK INC.
- Po-Chao TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan-Out Package Structures with Recesses in Molding Comp...
- Publication number 20200350279
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20200083184
- Publication date Mar 12, 2020
- Samsung Electronics Co., Ltd.
- Seung Min Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETERO-INTEGRATED STRUCTURE AND MEHOD OF FABRICATING THE SAME
- Publication number 20200075519
- Publication date Mar 5, 2020
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190326237
- Publication date Oct 24, 2019
- Fuji Electric Co., Ltd.
- Morio IWAMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
- Publication number 20190304948
- Publication date Oct 3, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20190295972
- Publication date Sep 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COPPER METALLIZATION STRUCTURE AND RELATED METHODS
- Publication number 20190109106
- Publication date Apr 11, 2019
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan-Out Package Structures with Recesses in Molding Comp...
- Publication number 20180350770
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
- Publication number 20180269177
- Publication date Sep 20, 2018
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COPPER METALLIZATION STRUCTURE AND RELATED METHODS
- Publication number 20180166407
- Publication date Jun 14, 2018
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COPPER METALLIZATION STRUCTURE AND RELATED METHODS
- Publication number 20180061791
- Publication date Mar 1, 2018
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
- Publication number 20180061804
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE
- Publication number 20170317040
- Publication date Nov 2, 2017
- Siliconware Precision Industries Co., Ltd.
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR THERMO-MECHANICAL STRESS REDUCTION IN SEMICONDUCTOR DEVI...
- Publication number 20170221841
- Publication date Aug 3, 2017
- STMicroelectronics S.r.l.
- Paolo Colpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH SOLDER-BASED CONNECTION TERMINALS AND ME...
- Publication number 20170084561
- Publication date Mar 23, 2017
- Samsung Electronics Co., Ltd.
- Sun-kyoung Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20170053883
- Publication date Feb 23, 2017
- TEXAS INSTRUMENTS INCORPORATED
- You Chye How
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan-Out Package Structures with Recesses in Molding Comp...
- Publication number 20170040288
- Publication date Feb 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Forming Thereof
- Publication number 20170033066
- Publication date Feb 2, 2017
- INFINEON TECHNOLOGIES AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20170005048
- Publication date Jan 5, 2017
- RENESAS ELECTRONICS CORPORATION
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE FOR THREE-DIMENSIONAL CIRCUIT INTEGRATION
- Publication number 20150035169
- Publication date Feb 5, 2015
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS

Structure of the protective coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having a wire bonding pad structure connected...

Integrated fan-out package structures with recesses in molding comp...

Semiconductor packages having a die, an encapsulant, and a redistri...

Semiconductor device having conductive film

Method for preparing a semiconductor device with spacer over sidewa...

Semiconductor component and manufacturing method thereof

Semiconductor package

Methods of forming semiconductor packages having a die with an enca...

Manufacturing of flip-chip electronic device with carrier having he...

Semiconductor device with spacer over sidewall of bonding pad and m...

Temporary post-assisted embedding of semiconductor dies

Hetero-integrated structure

Flip-chip electronic device with carrier having heat dissipation el...

Metal bonding pads for packaging applications

Semiconductor integrated circuit device

Integrated fan-out package structures with recesses in molding comp...

Semiconductor copper metallization structure and related methods

Metal bonding pads for packaging applications

Semiconductor devices and methods of forming thereof

Substrate structure

Semiconductor copper metallization structure and related methods

Integrated fan-out package structures with recesses in molding comp...

Metal bonding pads for packaging applications

Method for thermo-mechanical stress reduction in semiconductor devi...

Integrated fan-out package structures with recesses in molding comp...

Semiconductor copper metallization structure and related methods

Semiconductor devices with solder-based connection terminals and me...

Via structure for three-dimensional circuit integration

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING A WIRE BONDING PAD STRUCTURE CONNECTED...

METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCA...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

Methods of Forming Semiconductor Packages Having a Die with an Enca...

SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR DIE EMBEDDED IN A MOLDI...

METHOD FOR PREPARING A SEMICONDUCTOR DEVICE WITH SPACER OVER SIDEWA...

SEMICONDUCTOR DEVICE WITH SPACER OVER SIDEWALL OF BONDING PAD AND M...

Temporary Post-Assisted Embedding of Semiconductor Dies

SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREOF

Integrated Fan-Out Package Structures with Recesses in Molding Comp...

Semiconductor Package

HETERO-INTEGRATED STRUCTURE AND MEHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

METAL BONDING PADS FOR PACKAGING APPLICATIONS

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

SEMICONDUCTOR COPPER METALLIZATION STRUCTURE AND RELATED METHODS

Integrated Fan-Out Package Structures with Recesses in Molding Comp...

METAL BONDING PADS FOR PACKAGING APPLICATIONS

SEMICONDUCTOR COPPER METALLIZATION STRUCTURE AND RELATED METHODS

SEMICONDUCTOR COPPER METALLIZATION STRUCTURE AND RELATED METHODS

METAL BONDING PADS FOR PACKAGING APPLICATIONS

SUBSTRATE STRUCTURE

METHOD FOR THERMO-MECHANICAL STRESS REDUCTION IN SEMICONDUCTOR DEVI...

SEMICONDUCTOR DEVICES WITH SOLDER-BASED CONNECTION TERMINALS AND ME...

INTEGRATED CIRCUIT PACKAGE

Integrated Fan-Out Package Structures with Recesses in Molding Comp...

Semiconductor Devices and Methods of Forming Thereof

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

VIA STRUCTURE FOR THREE-DIMENSIONAL CIRCUIT INTEGRATION