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Semiconductor device having conductive film
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11,594,502
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Feb 28, 2023
Fuji Electric Co., Ltd.
Morio Iwamizu
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Method for preparing a semiconductor device with spacer over sidewa...
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11,552,032
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Jan 10, 2023
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
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Semiconductor component and manufacturing method thereof
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11,424,204
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Aug 23, 2022
Mediatek Inc.
Po-Chao Tsao
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Semiconductor package
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11,380,636
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Jul 5, 2022
Samsung Electronics Co., Ltd.
Seung Min Baek
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Methods of forming semiconductor packages having a die with an enca...
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11,315,891
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Apr 26, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chung-Hao Tsai
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Manufacturing of flip-chip electronic device with carrier having he...
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11,251,160
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Feb 15, 2022
International Business Machines Corporation
Stefano Oggioni
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Semiconductor device with spacer over sidewall of bonding pad and m...
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11,024,592
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Jun 1, 2021
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
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Temporary post-assisted embedding of semiconductor dies
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11,004,700
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May 11, 2021
Infineon Technologies AG
Richard Knipper
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Hetero-integrated structure
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11,004,816
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May 11, 2021
Industrial Technology Research Institute
Yu-Min Lin
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Flip-chip electronic device with carrier having heat dissipation el...
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10,886,254
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Jan 5, 2021
International Business Machines Corporation
Stefano Oggioni
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Metal bonding pads for packaging applications
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10,825,792
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Nov 3, 2020
International Business Machines Corporation
Chih-Chao Yang
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Semiconductor integrated circuit device
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10,818,620
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Oct 27, 2020
Renesas Electronics Corporation
Hiromi Shigihara
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Integrated fan-out package structures with recesses in molding comp...
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10,720,403
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Jul 21, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Hao Tsai
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Semiconductor copper metallization structure and related methods
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10,700,027
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Jun 30, 2020
Semiconductor Components Industries, LLC
Yusheng Lin
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Metal bonding pads for packaging applications
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10,381,323
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Aug 13, 2019
International Business Machines Corporation
Chih-Chao Yang
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Semiconductor devices and methods of forming thereof
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10,262,959
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Apr 16, 2019
Infineon Technologies AG
Evelyn Napetschnig
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Substrate structure
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10,199,341
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Feb 5, 2019
Siliconware Precision Industries Co., Ltd.
Fang-Yu Liang
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Semiconductor copper metallization structure and related methods
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10,186,493
Issue date
Jan 22, 2019
Semiconductor Components Industries, LLC
Yusheng Lin
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Integrated fan-out package structures with recesses in molding comp...
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10,062,662
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Aug 28, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Hao Tsai
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Metal bonding pads for packaging applications
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10,020,281
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Jul 10, 2018
International Business Machines Corporation
Chih-Chao Yang
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Method for thermo-mechanical stress reduction in semiconductor devi...
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9,960,131
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May 1, 2018
STMicroelectronics S.r.l.
Paolo Colpani
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Integrated fan-out package structures with recesses in molding comp...
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9,953,955
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Apr 24, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Hao Tsai
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Semiconductor copper metallization structure and related methods
Patent number
9,905,522
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Feb 27, 2018
Semiconductor Components Industries, LLC
Yusheng Lin
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Semiconductor devices with solder-based connection terminals and me...
Patent number
9,831,202
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Nov 28, 2017
Samsung Electronics Co., Ltd.
Sun-kyoung Seo
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Via structure for three-dimensional circuit integration
Patent number
9,214,435
Issue date
Dec 15, 2015
GLOBALFOUNDRIES Inc.
Mukta G. Farooq
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Semiconductor device and manufacturing method thereof
Patent number
8,563,397
Issue date
Oct 22, 2013
Semiconductor Energy Laboratory Co., Ltd.
Akihiro Chida
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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last 30 patents
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SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Publication number
20230326893
Publication date
Oct 12, 2023
Samsung Electronics Co., Ltd.
Sangho CHA
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
Publication number
20230197650
Publication date
Jun 22, 2023
Fuji Electric Co., Ltd.
Morio IWAMIZU
H01 - BASIC ELECTRIC ELEMENTS
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Methods of Forming Semiconductor Packages Having a Die with an Enca...
Publication number
20220246559
Publication date
Aug 4, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Chung-Hao Tsai
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR DIE EMBEDDED IN A MOLDI...
Publication number
20210217633
Publication date
Jul 15, 2021
INFINEON TECHNOLOGIES AG
Richard Knipper
H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR PREPARING A SEMICONDUCTOR DEVICE WITH SPACER OVER SIDEWA...
Publication number
20210202416
Publication date
Jul 1, 2021
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE WITH SPACER OVER SIDEWALL OF BONDING PAD AND M...
Publication number
20210118830
Publication date
Apr 22, 2021
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS
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Temporary Post-Assisted Embedding of Semiconductor Dies
Publication number
20210057234
Publication date
Feb 25, 2021
Richard Knipper
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREOF
Publication number
20210050315
Publication date
Feb 18, 2021
MEDIATEK INC.
Po-Chao TSAO
H01 - BASIC ELECTRIC ELEMENTS
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Integrated Fan-Out Package Structures with Recesses in Molding Comp...
Publication number
20200350279
Publication date
Nov 5, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Po-Hao Tsai
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor Package
Publication number
20200083184
Publication date
Mar 12, 2020
Samsung Electronics Co., Ltd.
Seung Min Baek
H01 - BASIC ELECTRIC ELEMENTS
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HETERO-INTEGRATED STRUCTURE AND MEHOD OF FABRICATING THE SAME
Publication number
20200075519
Publication date
Mar 5, 2020
Industrial Technology Research Institute
Yu-Min Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE
Publication number
20190326237
Publication date
Oct 24, 2019
Fuji Electric Co., Ltd.
Morio IWAMIZU
H01 - BASIC ELECTRIC ELEMENTS
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METAL BONDING PADS FOR PACKAGING APPLICATIONS
Publication number
20190304948
Publication date
Oct 3, 2019
International Business Machines Corporation
Chih-Chao Yang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
Publication number
20190295972
Publication date
Sep 26, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Hao Tsai
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR COPPER METALLIZATION STRUCTURE AND RELATED METHODS
Publication number
20190109106
Publication date
Apr 11, 2019
Semiconductor Components Industries, LLC
Yusheng LIN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Integrated Fan-Out Package Structures with Recesses in Molding Comp...
Publication number
20180350770
Publication date
Dec 6, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Hao Tsai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
Publication number
20180269177
Publication date
Sep 20, 2018
International Business Machines Corporation
Chih-Chao Yang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR COPPER METALLIZATION STRUCTURE AND RELATED METHODS
Publication number
20180166407
Publication date
Jun 14, 2018
Semiconductor Components Industries, LLC
Yusheng LIN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR COPPER METALLIZATION STRUCTURE AND RELATED METHODS
Publication number
20180061791
Publication date
Mar 1, 2018
Semiconductor Components Industries, LLC
Yusheng LIN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
Publication number
20180061804
Publication date
Mar 1, 2018
International Business Machines Corporation
Chih-Chao Yang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SUBSTRATE STRUCTURE
Publication number
20170317040
Publication date
Nov 2, 2017
Siliconware Precision Industries Co., Ltd.
Fang-Yu Liang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD FOR THERMO-MECHANICAL STRESS REDUCTION IN SEMICONDUCTOR DEVI...
Publication number
20170221841
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Aug 3, 2017
STMicroelectronics S.r.l.
Paolo Colpani
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICES WITH SOLDER-BASED CONNECTION TERMINALS AND ME...
Publication number
20170084561
Publication date
Mar 23, 2017
Samsung Electronics Co., Ltd.
Sun-kyoung Seo
H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED CIRCUIT PACKAGE
Publication number
20170053883
Publication date
Feb 23, 2017
TEXAS INSTRUMENTS INCORPORATED
You Chye How
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Patent Application
Integrated Fan-Out Package Structures with Recesses in Molding Comp...
Publication number
20170040288
Publication date
Feb 9, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Hao Tsai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Semiconductor Devices and Methods of Forming Thereof
Publication number
20170033066
Publication date
Feb 2, 2017
INFINEON TECHNOLOGIES AG
Evelyn Napetschnig
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Publication number
20170005048
Publication date
Jan 5, 2017
RENESAS ELECTRONICS CORPORATION
HIROMI SHIGIHARA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
VIA STRUCTURE FOR THREE-DIMENSIONAL CIRCUIT INTEGRATION
Publication number
20150035169
Publication date
Feb 5, 2015
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Via Structure For Three-Dimensional Circuit Integration
Publication number
20130307160
Publication date
Nov 21, 2013
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20100171221
Publication date
Jul 8, 2010
Akihiro CHIDA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR