Structure, shape, material or disposition of high density interconnect preforms

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/20Structure, shape, material or disposition of high density interconnect preforms

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming RDLs and structure formed thereof
- Patent number 12,315,819
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,315,831
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,315,854
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a fan-out panel level semiconductor package
- Patent number 12,315,822
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Jeongho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-packaged chip, method of manufacturing a pre-packaged chip, sem...
- Patent number 12,315,835
- Issue date May 27, 2025
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplet first architecture for die tiling applications
- Patent number 12,308,329
- Issue date May 20, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 12,308,296
- Issue date May 20, 2025
- Innolux Corporation
- Cheng-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating and accessing passive components in wafer-level packages
- Patent number 12,308,335
- Issue date May 20, 2025
- Intel Corporation
- Gianni Signorini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aligning bumps in fan-out packaging process
- Patent number 12,300,659
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,300,598
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package and electronic device including the same
- Patent number 12,300,594
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Sun Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets 3D SoIC system integration and fabrication methods
- Patent number 12,300,646
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,300,563
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power module package structures
- Patent number 12,293,955
- Issue date May 6, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,288,752
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement comprising an integrated circuit package and a heatsink...
- Patent number 12,288,757
- Issue date Apr 29, 2025
- SIVERS WIRELESS AB
- Erik Öjefors
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking devices using support f...
- Patent number 12,288,754
- Issue date Apr 29, 2025
- STATS ChipPAC Pte. Ltd.
- GunHyuck Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with open cavity and method therefor
- Patent number 12,288,766
- Issue date Apr 29, 2025
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic structure
- Patent number 12,283,561
- Issue date Apr 22, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,283,556
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device package and method of manufacturing the same
- Patent number 12,283,585
- Issue date Apr 22, 2025
- Advanced Semiconductor Engineering, Inc.
- Chi-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of forming the same
- Patent number 12,283,537
- Issue date Apr 22, 2025
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device, and electronic apparatus
- Patent number 12,283,792
- Issue date Apr 22, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kiyohisa Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package
- Patent number 12,278,171
- Issue date Apr 15, 2025
- Infineon Technologies AG
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on multichip package comprising standard commodit...
- Patent number 12,278,192
- Issue date Apr 15, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package with 3D magnetic core inductor
- Patent number 12,272,637
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating structures for semiconductor devices and methods o...
- Patent number 12,272,616
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,272,666
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Eunsil Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 12,266,619
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed density interconnect architectures using hybrid fan-out
- Patent number 12,266,611
- Issue date Apr 1, 2025
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF PRODUCING HIGH POWER MODULE PACKAGE STRUCTURES
- Publication number 20250174515
- Publication date May 29, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device and method for manufacturing the same
- Publication number 20250174592
- Publication date May 29, 2025
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TESTING SEMICONDUCTOR PACKAGE
- Publication number 20250174499
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-HUI LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED HIGH FREQUENCY AESA ANTENNA CONNECTION METHOD
- Publication number 20250167154
- Publication date May 22, 2025
- Rockwell Collins, Inc.
- James B. Mayfield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER
- Publication number 20250167158
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250167145
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...
- Publication number 20250167156
- Publication date May 22, 2025
- SAMSUNG ELECTRONICS CO., LTD.
- Aenee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
- Publication number 20250167180
- Publication date May 22, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...
- Publication number 20250167065
- Publication date May 22, 2025
- SK HYNIX INC.
- Jun Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250167155
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- SEUNGSOO HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250167159
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGING POP MECHANICAL ATTACH METHOD
- Publication number 20250167183
- Publication date May 22, 2025
- Intel Corporation
- David O'SULLIVAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR REDUCING SEMICONDUCTOR DEVICE DELAMINATION
- Publication number 20250157973
- Publication date May 15, 2025
- ADVANCED MICRO DEVICES, INC.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20250159812
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250160031
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR INTERCONNECTING DIES
- Publication number 20250157940
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250149491
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH ACTIVE SILICON BRIDGE
- Publication number 20250149525
- Publication date May 8, 2025
- ADVANCED MICRO DEVICES, INC.
- Deepak Vasant KULKARNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A REDISTRIBUTION LAYER (RDL) STRUCTURE...
- Publication number 20250149524
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Sheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DEVICE GRADED EMBEDDING PACKAGE SUBSTRATE AND MANUFACTURING M...
- Publication number 20250149461
- Publication date May 8, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250149466
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Jaesic Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE, METHOD OF MANUFACTURING THE WIRING STRUCTURE, AND...
- Publication number 20250140676
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Jeongrim SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER PACKAGE WITH VERTICAL INTERCONNECT
- Publication number 20250140729
- Publication date May 1, 2025
- Infineon Technologies Austria AG
- Chee Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH THERMOELECTRIC COOLING
- Publication number 20250140642
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SHUNT AND PATTERNED METAL TRACE
- Publication number 20250140708
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH ISOLATED DIES
- Publication number 20250140624
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Hau NGUYEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE, SEMICONDUCTOR PACKAGE COMPRISING THE SAME, AND ME...
- Publication number 20250140727
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Wonbin Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE
- Publication number 20250140728
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Taehoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGES PROVIDING ENHANCED MECHANICAL STRENGTH AND METHODS...
- Publication number 20250140754
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH MULTIPLE CHIP STRUCTURES
- Publication number 20250140757
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Structure, shape, material or disposition of high density interconnect preforms

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming RDLs and structure formed thereof

Package structure and manufacturing method thereof

Integrated circuit package and method

Methods of manufacturing a fan-out panel level semiconductor package

Pre-packaged chip, method of manufacturing a pre-packaged chip, sem...

Chiplet first architecture for die tiling applications

Electronic device and manufacturing method thereof

Integrating and accessing passive components in wafer-level packages

Aligning bumps in fan-out packaging process

Package structure and method of fabricating the same

Fan-out semiconductor package and electronic device including the same

Chiplets 3D SoIC system integration and fabrication methods

Semiconductor package and method of fabricating the same

High power module package structures

Semiconductor packages

Arrangement comprising an integrated circuit package and a heatsink...

Semiconductor device and method of stacking devices using support f...

Semiconductor device with open cavity and method therefor

Flexible electronic structure

Package structure

Optoelectronic device package and method of manufacturing the same

Electronic package and method of forming the same

Light emitting device, and electronic apparatus

Chip package and method of forming a chip package

Logic drive based on multichip package comprising standard commodit...

Integrated fan-out package with 3D magnetic core inductor

Heat-dissipating structures for semiconductor devices and methods o...

Semiconductor package and method of manufacturing the same

Integrated devices in semiconductor packages and methods of forming...

Mixed density interconnect architectures using hybrid fan-out

Patents Applicationslast 30 patents

METHODS OF PRODUCING HIGH POWER MODULE PACKAGE STRUCTURES

Electronic device and method for manufacturing the same

METHOD OF TESTING SEMICONDUCTOR PACKAGE

ADVANCED HIGH FREQUENCY AESA ANTENNA CONNECTION METHOD

CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...

INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...

SEMICONDUCTOR PACKAGES

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

FAN OUT PACKAGING POP MECHANICAL ATTACH METHOD

SYSTEMS AND METHODS FOR REDUCING SEMICONDUCTOR DEVICE DELAMINATION

INTEGRATED CIRCUIT STRUCTURE

ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF

SYSTEMS AND METHODS FOR INTERCONNECTING DIES

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

CHIP PACKAGE WITH ACTIVE SILICON BRIDGE

PACKAGE STRUCTURE INCLUDING A REDISTRIBUTION LAYER (RDL) STRUCTURE...

MULTI-DEVICE GRADED EMBEDDING PACKAGE SUBSTRATE AND MANUFACTURING M...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

WIRING STRUCTURE, METHOD OF MANUFACTURING THE WIRING STRUCTURE, AND...

MOLDED POWER PACKAGE WITH VERTICAL INTERCONNECT

INTEGRATED CIRCUIT DEVICE WITH THERMOELECTRIC COOLING

SEMICONDUCTOR PACKAGE WITH SHUNT AND PATTERNED METAL TRACE

PACKAGES WITH ISOLATED DIES

WIRING STRUCTURE, SEMICONDUCTOR PACKAGE COMPRISING THE SAME, AND ME...

SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE

FAN-OUT PACKAGES PROVIDING ENHANCED MECHANICAL STRENGTH AND METHODS...

CHIP PACKAGE STRUCTURE WITH MULTIPLE CHIP STRUCTURES