TREA

Structure, shape, material or disposition of high density interconnect preforms

Follow

Industry

  • CPC
  • H01L24/20
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/20Structure, shape, material or disposition of high density interconnect preforms
Industries