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Structure, shape, material or disposition of high density interconnect preforms
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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Structure, shape, material or disposition of high density interconnect preforms
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last 30 patents
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Stacked via structure
Patent number
11,973,023
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming an upper conductive structure having multilayer...
Patent number
11,973,050
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Tzu-Yu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
11,973,037
Issue date
Apr 30, 2024
Powertech Technology Inc.
Shang-Yu Chang Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,973,042
Issue date
Apr 30, 2024
Samsung Electronics Co., Ltd.
Jingu Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device package and method of manufacturing the same
Patent number
11,973,039
Issue date
Apr 30, 2024
Advanced Semiconductor Engineering, Inc.
Chia-Hao Sung
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Chiplet first architecture for die tiling applications
Patent number
11,973,041
Issue date
Apr 30, 2024
Intel Corporation
Srinivas Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package structure with improved antenna patterns performance
Patent number
11,973,038
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Fang-Yu Liang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Molded direct contact interconnect structure without capture pads a...
Patent number
11,973,051
Issue date
Apr 30, 2024
Deca Technologies USA, Inc.
Robin Davis
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
System and method for sub-column parallel digitizers for hybrid sta...
Patent number
11,973,090
Issue date
Apr 30, 2024
DePuy Synthes Products, Inc.
Laurent Blanquart
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out package having a main die and a dummy die
Patent number
11,967,563
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yan-Fu Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package including post
Patent number
11,967,578
Issue date
Apr 23, 2024
Samsung Electronics Co., Ltd.
Jaekul Lee
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Packaged semiconductor device and method for fabricating a packaged...
Patent number
11,967,562
Issue date
Apr 23, 2024
Infineon Technologies AG
Horst Theuss
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Electronic device package and fabricating method thereof
Patent number
11,961,867
Issue date
Apr 16, 2024
Amkor Technology Singapore Holding Pte Ltd.
Jin Young Kim
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,961,789
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna apparatus and method
Patent number
11,961,809
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Feng-Wei Kuo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
RF devices with enhanced performance and methods of forming the same
Patent number
11,961,813
Issue date
Apr 16, 2024
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package structure
Patent number
11,953,740
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chung-Ming Weng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package stacking using chip to wafer bonding
Patent number
11,955,462
Issue date
Apr 9, 2024
Intel Corporation
Georg Seidemann
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method of forming vertical interconnect st...
Patent number
11,955,467
Issue date
Apr 9, 2024
STATS ChipPAC Pte. Ltd.
Junghwan Jang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Advanced info POP and method of forming thereof
Patent number
11,955,460
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Da Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution structure for semiconductor device and method of for...
Patent number
11,948,918
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Po-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method
Patent number
11,948,926
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method
Patent number
11,948,890
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Hao Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structures and method of forming the same
Patent number
11,948,862
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method
Patent number
11,942,464
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hao-Jan Pei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method
Patent number
11,942,433
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a semiconductor package
Patent number
11,942,434
Issue date
Mar 26, 2024
Samsung Electronics Co., Ltd.
Sangkyu Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including a through-electrode penetrating a m...
Patent number
11,942,458
Issue date
Mar 26, 2024
Samsung Electronics Co., Ltd.
Doohwan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded structure, manufacturing method thereof and substrate
Patent number
11,942,465
Issue date
Mar 26, 2024
Zhuhai ACCESS Semiconductor Co., Ltd.
Xianming Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices including seed structure and method of manufa...
Patent number
11,935,858
Issue date
Mar 19, 2024
Samsung Electronics Co., Ltd.
Seungmin Baek
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
COMPOSITE COMPONENT
Publication number
20240136268
Publication date
Apr 25, 2024
Murata Manufacturing Co., Ltd.
Yoshiaki SATAKE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE
Publication number
20240136299
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
InFO-POP Structures with TIVs Having Cavities
Publication number
20240136298
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Dp., Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
Publication number
20240138071
Publication date
Apr 25, 2024
IBIDEN CO., LTD.
Shogo FUKUI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...
Publication number
20240128208
Publication date
Apr 18, 2024
nD-HI Technologies Lab, Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240128195
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Sangwoong Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES
Publication number
20240128223
Publication date
Apr 18, 2024
Intel Corporation
Bernd Waidhas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE RECONSTITUTION AND HIGH-DENSITY INTERCONNECTS FOR EMBEDDED CHIPS
Publication number
20240128222
Publication date
Apr 18, 2024
Neuralink Corp.
Supin Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE
Publication number
20240128227
Publication date
Apr 18, 2024
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Perceval COUDRAIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STIFFENER PACKAGE AND METHOD OF FABRICATING STIFFENER PACKAGE
Publication number
20240120211
Publication date
Apr 11, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Jin Young Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Embedded Package with Electrically Isolating Dielectric Liner
Publication number
20240120248
Publication date
Apr 11, 2024
INFINEON TECHNOLOGIES AG
Eung San Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ASSEMBLY OF AN INTEGRATED CIRCUIT IN A CHIP SCALE BALL GRID ARRAY
Publication number
20240113062
Publication date
Apr 4, 2024
Azimuth Industrial Company, Inc.
David Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Package and Method
Publication number
20240113071
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chung-Shi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH ACTIVE MOLD PACKAGE AND METHOD THEREFOR
Publication number
20240105660
Publication date
Mar 28, 2024
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Three-Dimensional Semiconductor Device and Method
Publication number
20240105631
Publication date
Mar 28, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jeng-An Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION METALLIZATION AND METHOD T...
Publication number
20240105659
Publication date
Mar 28, 2024
NXP B.V.
Kuan-Hsiang Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY PACKAGES AND METHODS OF FORMING SAME
Publication number
20240105682
Publication date
Mar 28, 2024
Taiwan Semiconductor Manufacturing Co, LTD.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH REINFORCED DIELECTRIC AND METHOD THEREFOR
Publication number
20240105658
Publication date
Mar 28, 2024
NXP B.V.
Tsung Nan Lo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING A PRINTE...
Publication number
20240105548
Publication date
Mar 28, 2024
ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
Uwe WALTRICH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME
Publication number
20240096642
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240096760
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE
Publication number
20240097090
Publication date
Mar 21, 2024
CORETRONIC CORPORATION
Ming-Chuan Chih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNEC...
Publication number
20240096809
Publication date
Mar 21, 2024
Intel Corporation
Hiroki Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP HIGH-DENSITY INTERCONNECTION PACKAGE STRUCTURE AND MANUFACTURI...
Publication number
20240096836
Publication date
Mar 21, 2024
Zhuhai ACCESS Semiconductor Co., Ltd
Xianming CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIPLETS 3D SOIC SYSTEM INTEGRATION AND FABRICATION METHODS
Publication number
20240088077
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240088124
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing company Ltd.
HSIANG-TAI LU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE
Publication number
20240088056
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jhih-Yu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Stacking Devices Using Support F...
Publication number
20240088060
Publication date
Mar 14, 2024
STATS ChipPAC Pte Ltd.
GunHyuck Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ALIGNMENT MARKS
Publication number
20240088055
Publication date
Mar 14, 2024
Samsung Electronics Co., Ltd.
Inhyung SONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...
Publication number
20240087914
Publication date
Mar 14, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Bora Baloglu
H01 - BASIC ELECTRIC ELEMENTS