Structure, shape, material or disposition of the strap connectors after the connecting process

Industry

CPC
H01L24/39

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/39Structure, shape, material or disposition of the strap connectors after the connecting process

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,532,590
- Issue date Dec 20, 2022
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,777,476
- Issue date Sep 15, 2020
- Mitsubishi Electric Corporation
- Yuki Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and method for manufacturing same
- Patent number 10,475,721
- Issue date Nov 12, 2019
- Mitsubishi Electric Corporation
- Yasunari Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and method for manufacturing same
- Patent number 10,283,430
- Issue date May 7, 2019
- Mitsubishi Electric Corporation
- Yasunari Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency module
- Patent number 9,653,389
- Issue date May 16, 2017
- Rohm Co., Ltd.
- Kenichi Yoshimochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package
- Patent number 9,496,205
- Issue date Nov 15, 2016
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-embedded packages with backside die connection
- Patent number 9,437,516
- Issue date Sep 6, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency module
- Patent number 9,431,329
- Issue date Aug 30, 2016
- Rohm Co., Ltd.
- Kenichi Yoshimochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 9,318,354
- Issue date Apr 19, 2016
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency module
- Patent number 9,269,656
- Issue date Feb 23, 2016
- Rohm Co., Ltd.
- Kenichi Yoshimochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 9,159,656
- Issue date Oct 13, 2015
- Fairchild Semiconductor Corporation
- Oseob Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Power semiconductor package
- Patent number 9,054,090
- Issue date Jun 9, 2015
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package with multiple dies
- Patent number 9,041,187
- Issue date May 26, 2015
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 8,952,551
- Issue date Feb 10, 2015
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of mixed semiconductor encapsulation structure with multi...
- Patent number 8,933,550
- Issue date Jan 13, 2015
- Alpha & Omega Semiconductor, Inc.
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency module
- Patent number 8,928,049
- Issue date Jan 6, 2015
- Rohm Co., Ltd.
- Kenichi Yoshimochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic assembly with joined bond elements having lowered i...
- Patent number 8,816,514
- Issue date Aug 26, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,786,072
- Issue date Jul 22, 2014
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 8,664,752
- Issue date Mar 4, 2014
- Fairchild Semiconductor Corporation
- Oseob Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Flange package for a semiconductor device
- Patent number 8,618,650
- Issue date Dec 31, 2013
- Estivation Properties LLC
- Alex Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device package and fabrication method
- Patent number 8,563,360
- Issue date Oct 22, 2013
- Alpha & Omega Semiconductor, Inc.
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded clip structure
- Patent number 8,513,059
- Issue date Aug 20, 2013
- Fairchild Semiconductor Corporation
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module including substrates spaced from each other
- Patent number 8,514,579
- Issue date Aug 20, 2013
- Infineon Technologies AG
- Thilo Stolze
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 8,497,164
- Issue date Jul 30, 2013
- Fairchild Semiconductor Corporation
- Armand Vincent C. Jereza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly
- Patent number 8,472,949
- Issue date Jun 25, 2013
- Infineon Technologies AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 8,410,592
- Issue date Apr 2, 2013
- Infineon Technologies, AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF package
- Patent number 8,410,601
- Issue date Apr 2, 2013
- Microsemi Corporation
- Benjamin A. Samples
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with joined bond elements having lowered i...
- Patent number 8,410,618
- Issue date Apr 2, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency module
- Patent number 8,390,041
- Issue date Mar 5, 2013
- Rohm Co., Ltd.
- Kenichi Yoshimochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked-die package for battery power management
- Patent number 8,344,519
- Issue date Jan 1, 2013
- Alpha and Omega Semiconductor Incorporated
- Jun Lu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20190214326
- Publication date Jul 11, 2019
- Mitsubishi Electric Corporation
- Yasunari HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190148251
- Publication date May 16, 2019
- Mitsubishi Electric Corporation
- Yuki OKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package with Multiple Dies
- Publication number 20150008572
- Publication date Jan 8, 2015
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140374926
- Publication date Dec 25, 2014
- Kabushiki Kaisha Toshiba
- Takeshi MIYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package
- Publication number 20140319665
- Publication date Oct 30, 2014
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140284803
- Publication date Sep 25, 2014
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20140167238
- Publication date Jun 19, 2014
- Fairchild Semiconductor Corporation
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20140124565
- Publication date May 8, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20130292834
- Publication date Nov 7, 2013
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF A MIXED ALLOY LEAD FRAME FOR PACKAGING POWER...
- Publication number 20130273697
- Publication date Oct 17, 2013
- Zhi Qiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH EFFICIENCY MODULE
- Publication number 20130163211
- Publication date Jun 27, 2013
- ROHM CO., LTD.
- Kenichi Yoshimochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLANGE PACKAGE FOR A SEMICONDUCTOR DEVICE
- Publication number 20130087894
- Publication date Apr 11, 2013
- Estivation Properties LLC
- Alex Elliott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINK
- Publication number 20130017652
- Publication date Jan 17, 2013
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING
- Publication number 20130009296
- Publication date Jan 10, 2013
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS
- Publication number 20130009297
- Publication date Jan 10, 2013
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20120329214
- Publication date Dec 27, 2012
- Armand Vincent C. Jereza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure of Mixed Semiconductor Encapsulation Structure with Multi...
- Publication number 20120193695
- Publication date Aug 2, 2012
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Fabricating the Same
- Publication number 20120187562
- Publication date Jul 26, 2012
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH TWO COMPONENT LEAD FRAME
- Publication number 20120181677
- Publication date Jul 19, 2012
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20120181675
- Publication date Jul 19, 2012
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20120181676
- Publication date Jul 19, 2012
- GEM Service, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20110285020
- Publication date Nov 24, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED-DIE PACKAGE FOR BATTERY POWER MANAGEMENT
- Publication number 20110278709
- Publication date Nov 17, 2011
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLDED CLIP STRUCTURE
- Publication number 20110272794
- Publication date Nov 10, 2011
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20110147953
- Publication date Jun 23, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF PACKAGE
- Publication number 20110116237
- Publication date May 19, 2011
- MICROSEMI CORPORATION
- Benjamin A. Samples
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USE OF DISCRETE CONDUCTIVE LAYER IN SEMICONDUCTOR DEVICE TO RE-ROUT...
- Publication number 20110108998
- Publication date May 12, 2011
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH EFFICIENCY MODULE
- Publication number 20110096509
- Publication date Apr 28, 2011
- Rohm Co., Ltd.
- Kenichi Yoshimochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MIXED ALLOY LEAD FRAME FOR PACKAGING POWER SEMICONDUCTOR DEVICES AN...
- Publication number 20110073999
- Publication date Mar 31, 2011
- Zhi Qiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Circuit Substrate Assembly and a Power Ele...
- Publication number 20110053319
- Publication date Mar 3, 2011
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Structure, shape, material or disposition of the strap connectors after the connecting process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device

Power semiconductor device and method for manufacturing same

Power semiconductor device and method for manufacturing same

High efficiency module

Power semiconductor package

Chip-embedded packages with backside die connection

High efficiency module

Semiconductor package and fabrication method thereof

High efficiency module

Semiconductor die package and method for making the same

Power semiconductor package

Power semiconductor package with multiple dies

Semiconductor package and method for fabricating the same

Structure of mixed semiconductor encapsulation structure with multi...

High efficiency module

Microelectronic assembly with joined bond elements having lowered i...

Semiconductor package

Semiconductor die package and method for making the same

Flange package for a semiconductor device

Power semiconductor device package and fabrication method

Pre-molded clip structure

Power semiconductor module including substrates spaced from each other

Semiconductor die package and method for making the same

Semiconductor assembly

Semiconductor device and method for producing the same

RF package

Microelectronic assembly with joined bond elements having lowered i...

High efficiency module

Stacked-die package for battery power management

Patents Applicationslast 30 patents

POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE

Power Semiconductor Package with Multiple Dies

SEMICONDUCTOR DEVICE

Power Semiconductor Package

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

FABRICATION METHOD OF A MIXED ALLOY LEAD FRAME FOR PACKAGING POWER...

HIGH EFFICIENCY MODULE

FLANGE PACKAGE FOR A SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINK

SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING

SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

Structure of Mixed Semiconductor Encapsulation Structure with Multi...

Semiconductor Package and Method for Fabricating the Same

SEMICONDUCTOR DEVICE PACKAGE WITH TWO COMPONENT LEAD FRAME

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

POWER SEMICONDUCTOR DEVICE PACKAGING

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

STACKED-DIE PACKAGE FOR BATTERY POWER MANAGEMENT

PRE-MOLDED CLIP STRUCTURE

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

RF PACKAGE

USE OF DISCRETE CONDUCTIVE LAYER IN SEMICONDUCTOR DEVICE TO RE-ROUT...

HIGH EFFICIENCY MODULE

MIXED ALLOY LEAD FRAME FOR PACKAGING POWER SEMICONDUCTOR DEVICES AN...

Method for Fabricating a Circuit Substrate Assembly and a Power Ele...