Structure, shape, material or disposition of the wire connectors after the connecting process

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process

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Patents Grantslast 30 patents

Information Patent Grant
Radiation plate structure, semiconductor device, and method for man...
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- Issue date Jun 23, 2020
- Mitsubishi Electric Corporation
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate, method of manufacturing the same, display panel,...
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- Issue date Apr 28, 2020
- Chengdu Boe Optoelectronics Technology Co., Ltd.
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Information Patent Grant
Method for producing a component, and a component
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- Issue date Jan 28, 2020
- Osram Opto Semiconductors GmbH
- Juergen Moosburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded wire bond wires
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
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- Issue date Nov 19, 2019
- Mitsubishi Electric Corporation
- Shoko Araki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER ELECTRONICS MODULE AND A METHOD OF PRODUCING A POWER ELECTRON...
- Publication number 20210066157
- Publication date Mar 4, 2021
- ABB Schweiz AG
- Jorma Manninen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION PLATE STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD FOR MAN...
- Publication number 20180294203
- Publication date Oct 11, 2018
- Mitsubishi Electric Corporation
- Yukimasa HAYASHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20180261517
- Publication date Sep 13, 2018
- Mitsubishi Electric Corporation
- Shoko ARAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A COMPONENT, AND A COMPONENT
- Publication number 20180219146
- Publication date Aug 2, 2018
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