TREA

Structure, shape, material or disposition of the wire connectors prior to the connecting process

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Industry

  • CPC
  • H01L2224/44
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Embedded wire bond wires
    • Patent number 10,490,528
    • Issue date Nov 26, 2019
    • Invensas Corporation
    • Ashok S. Prabhu
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    INDUCTIVE COMPENSATION IN MEMORY SYSTEMS
    • Publication number 20200065270
    • Publication date Feb 27, 2020
    • SANDISK TECHNOLOGIES LLC
    • Md. Sayed Hossain Mobin
    • G06 - COMPUTING CALCULATING COUNTING