Structure

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CPC
H01L2224/1701

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1701Structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bond pad with micro-protrusions for direct metallic bonding
- Patent number 12,087,719
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and package structure
- Patent number 11,894,332
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 11,075,166
- Issue date Jul 27, 2021
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and package structure
- Patent number 11,024,594
- Issue date Jun 1, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad with micro-protrusions for direct metallic bonding
- Patent number 10,923,448
- Issue date Feb 16, 2021
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and semicond...
- Patent number 10,818,583
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Company
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 10,790,231
- Issue date Sep 29, 2020
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked radio frequency devices
- Patent number 10,510,702
- Issue date Dec 17, 2019
- Skyworks Solutions, Inc.
- Ambarish Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 10,418,329
- Issue date Sep 17, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless package with non-collapsible bump
- Patent number 10,269,751
- Issue date Apr 23, 2019
- Nexperia B.V.
- Wai Wong Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and package structure
- Patent number 10,141,281
- Issue date Nov 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,090,231
- Issue date Oct 2, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,049,998
- Issue date Aug 14, 2018
- Invensas Corporation
- Rajesh Katkar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Managing parasitic capacitance and voltage handling of stacked radi...
- Patent number 10,050,002
- Issue date Aug 14, 2018
- Skyworks Solutions, Inc.
- Ambarish Roy
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 10,026,680
- Issue date Jul 17, 2018
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-scrub process for fluxless micro-bump bonding
- Patent number 9,875,986
- Issue date Jan 23, 2018
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarity-tolerant reworkable interconnect with integrated testing
- Patent number 9,865,569
- Issue date Jan 9, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 9,793,198
- Issue date Oct 17, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 9,786,586
- Issue date Oct 10, 2017
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and semicond...
- Patent number 9,773,724
- Issue date Sep 26, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interposer structure and m...
- Patent number 9,659,897
- Issue date May 23, 2017
- STATS ChipPAC Pte. Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus of packaging with interposers
- Patent number 9,627,223
- Issue date Apr 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 9,437,566
- Issue date Sep 6, 2016
- Invensas Corporation
- Rajesh Katkar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die interconnect
- Patent number 9,385,099
- Issue date Jul 5, 2016
- NXP, B.V.
- Leonardus Antonius Elisabeth van Gemert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit packaging system with interposer structure and m...
- Patent number 9,355,983
- Issue date May 31, 2016
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure for stacked dies
- Patent number 9,312,225
- Issue date Apr 12, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making bumpless flipchip interco...
- Patent number 9,240,331
- Issue date Jan 19, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming bump structure having tapered sidewalls for stack...
- Patent number 8,513,119
- Issue date Aug 20, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 8,367,539
- Issue date Feb 5, 2013
- Panasonic Corporation
- Daisuke Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an electronic module comprising an active com...
- Patent number 6,991,151
- Issue date Jan 31, 2006
- Alcatel
- Louis Giraudet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE AND PACKAGE STRUCTURE
- Publication number 20240136317
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220068742
- Publication date Mar 3, 2022
- Unimicron Technology Corp.
- Cheng-Hui WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate and Package Structure
- Publication number 20210288012
- Publication date Sep 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING
- Publication number 20210175194
- Publication date Jun 10, 2021
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...
- Publication number 20200395301
- Publication date Dec 17, 2020
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...
- Publication number 20190355666
- Publication date Nov 21, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate and Package Structure
- Publication number 20190096839
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS PACKAGE WITH NON-COLLAPSIBLE BUMP
- Publication number 20180122763
- Publication date May 3, 2018
- Nexperia B.V.
- Wai Wong Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20180053708
- Publication date Feb 22, 2018
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20180019191
- Publication date Jan 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...
- Publication number 20180012830
- Publication date Jan 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING
- Publication number 20170287864
- Publication date Oct 5, 2017
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-SCRUB PROCESS FOR FLUXLESS MICRO-BUMP BONDING
- Publication number 20170103963
- Publication date Apr 13, 2017
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate and Package Structure
- Publication number 20160358878
- Publication date Dec 8, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- WEI-HUNG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARITY-TOLERANT REWORKABLE INTERCONNECT WITH INTEGRATED TESTING
- Publication number 20160240513
- Publication date Aug 18, 2016
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus of Packaging with Interposers
- Publication number 20160204079
- Publication date Jul 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING
- Publication number 20160093583
- Publication date Mar 31, 2016
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND METHOD OF FABRICATING THE SAME
- Publication number 20150332996
- Publication date Nov 19, 2015
- UNITED MICROELECTRONICS CORP.
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20150303120
- Publication date Oct 22, 2015
- UNITED MICROELECTRONICS CORP.
- Jubao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE INTERCONNECT
- Publication number 20150279803
- Publication date Oct 1, 2015
- NXP B.V.
- Leonardus Antonius Elisabeth van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Managing Parasitic Capacitance and Voltage Handling of Stacked Radi...
- Publication number 20150137335
- Publication date May 21, 2015
- SKYWORKS SOLUTIONS, INC.
- Ambarish Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PACKAGES INCLUDING CONDUCTIVE UNDERFILL M...
- Publication number 20140291834
- Publication date Oct 2, 2014
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...
- Publication number 20140210074
- Publication date Jul 31, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making Bumpless Flipchip Interco...
- Publication number 20140175661
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus of Packaging with Interposers
- Publication number 20140167269
- Publication date Jun 19, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Structure for Stacked Dies
- Publication number 20130299992
- Publication date Nov 14, 2013
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20120319289
- Publication date Dec 20, 2012
- Shinko Electric Industries Co., Ltd.
- Kenichi MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20120098126
- Publication date Apr 26, 2012
- Renesas Electronics Corporation
- Toshihiro IWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20110233767
- Publication date Sep 29, 2011
- PANASONIC CORPORATION
- Daisuke SAKURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Structure for Stacked Dies
- Publication number 20100140805
- Publication date Jun 10, 2010
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bond pad with micro-protrusions for direct metallic bonding

Substrate and package structure

Microelectronic structures having multiple microelectronic devices...

Substrate and package structure

Bond pad with micro-protrusions for direct metallic bonding

Semiconductor devices, methods of manufacture thereof, and semicond...

Microelectronic structures having multiple microelectronic devices...

Stacked radio frequency devices

Microelectronic structures having multiple microelectronic devices...

Leadless package with non-collapsible bump

Substrate and package structure

Conductive connections, structures with such connections, and metho...

Conductive connections, structures with such connections, and metho...

Managing parasitic capacitance and voltage handling of stacked radi...

Semiconductor package and fabrication method thereof

Micro-scrub process for fluxless micro-bump bonding

Planarity-tolerant reworkable interconnect with integrated testing

Conductive connections, structures with such connections, and metho...

Semiconductor package and fabrication method thereof

Semiconductor devices, methods of manufacture thereof, and semicond...

Integrated circuit packaging system with interposer structure and m...

Methods and apparatus of packaging with interposers

Conductive connections, structures with such connections, and metho...

Die interconnect

Integrated circuit packaging system with interposer structure and m...

Bump structure for stacked dies

Semiconductor device and method of making bumpless flipchip interco...

Method of forming bump structure having tapered sidewalls for stack...

Semiconductor device and semiconductor device manufacturing method

Method of fabricating an electronic module comprising an active com...

Patents Applicationslast 30 patents

SUBSTRATE AND PACKAGE STRUCTURE

CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

Substrate and Package Structure

BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING

MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...

MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...

Substrate and Package Structure

LEADLESS PACKAGE WITH NON-COLLAPSIBLE BUMP

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...

Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...

BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING

MICRO-SCRUB PROCESS FOR FLUXLESS MICRO-BUMP BONDING

Substrate and Package Structure

PLANARITY-TOLERANT REWORKABLE INTERCONNECT WITH INTEGRATED TESTING

Methods and Apparatus of Packaging with Interposers

BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING

INTERPOSER AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

DIE INTERCONNECT

Managing Parasitic Capacitance and Voltage Handling of Stacked Radi...

SEMICONDUCTOR DEVICES AND PACKAGES INCLUDING CONDUCTIVE UNDERFILL M...

Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...

Semiconductor Device and Method of Making Bumpless Flipchip Interco...

Methods and Apparatus of Packaging with Interposers

Bump Structure for Stacked Dies

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Bump Structure for Stacked Dies