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H01L2924/1611
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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H01L2924/1611
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Patents Grants
last 30 patents
Information
Patent Grant
Bonding structure and method thereof
Patent number
12,015,001
Issue date
Jun 18, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Wen-Chuan Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and method for forming the same
Patent number
11,984,381
Issue date
May 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Chen Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3DIC package comprising perforated foil sheet
Patent number
11,257,690
Issue date
Feb 22, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging structures with improved adhesion and strength
Patent number
10,971,418
Issue date
Apr 6, 2021
Skyworks Solutions, Inc.
Bradley Paul Barber
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Chip on film package and heat-dissipation structure for a chip package
Patent number
10,770,368
Issue date
Sep 8, 2020
Novatek Microelectronics Corp.
Wen-Ching Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3DIC package comprising perforated foil sheet
Patent number
10,685,854
Issue date
Jun 16, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging structures with improved adhesion and strength
Patent number
10,453,763
Issue date
Oct 22, 2019
Skyworks Solutions, Inc.
Bradley Paul Barber
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Electronic module and method of manufacturing the same
Patent number
9,991,184
Issue date
Jun 5, 2018
Shindengen Electric Manufacturing Co., Ltd.
Kosuke Ikeda
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE...
Publication number
20240387317
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Po-Chen Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
Publication number
20240363577
Publication date
Oct 31, 2024
Siliconware Precision Industries Co., Ltd.
Pin-Jing SU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240321674
Publication date
Sep 26, 2024
MEDIATEK INC.
Pu-Shan HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING STRUCTURE AND METHOD THEREOF
Publication number
20240304580
Publication date
Sep 12, 2024
Taiwan Semiconductor Manufacturing company Ltd.
WEN-CHUAN TAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING SEMICONDUCTOR PACKAGE STRUCTURE
Publication number
20240258193
Publication date
Aug 1, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Chen LAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
Publication number
20240186213
Publication date
Jun 6, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Jae Jin REE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH A HEAT DISSIPATION MEMBER
Publication number
20240170366
Publication date
May 23, 2024
Samsung Electronics Co., Ltd.
Jonggyu Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Packages and Methods of Forming the Same
Publication number
20240128148
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chang-Jung Hsueh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method Forming Same
Publication number
20230395461
Publication date
Dec 7, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Wen-Yi Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REINFORCED STRUCTURE WITH CAPPING LAYER AND METHODS OF FORMING THE...
Publication number
20230395450
Publication date
Dec 7, 2023
Taiwan Semiconductor Manufacturing Company Limited
Jing-Ye Juang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ASSEMBLY LID AND METHODS FOR FORMING THE SAME
Publication number
20230378007
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Company Limited
Yu-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME
Publication number
20230378024
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Sheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS AROUND INDIVIDUAL DIES
Publication number
20230298953
Publication date
Sep 21, 2023
Intel Corporation
Pouya Talebbeydokhti
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING STRUCTURE AND METHOD THEREOF
Publication number
20230299028
Publication date
Sep 21, 2023
Taiwan Semiconductor Manufacturing company Ltd.
WEN-CHUAN TAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE
Publication number
20230187305
Publication date
Jun 15, 2023
Hitachi Astemo, Ltd.
Hiromi SHIMAZU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR MODULE, METHOD FOR ASSEMBLING A POWER SEMICONDU...
Publication number
20230170287
Publication date
Jun 1, 2023
INFINEON TECHNOLOGIES AG
Ulrich Nolten
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method for Manufacturing The Same
Publication number
20230154822
Publication date
May 18, 2023
Nippon Telegraph and Telephone Corporation
Yusuke Araki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH-FREQUENCEY PACKAGE, HIGH-FREQUENCY MODULE, AND RADIO WAVE ABSO...
Publication number
20230103894
Publication date
Apr 6, 2023
NEC Corporation
Yuki YOSHIMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20230071542
Publication date
Mar 9, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230058480
Publication date
Feb 23, 2023
KIOXIA Corporation
Satoshi TSUKIYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package Assembly Including Lid With Additional Stress Mitigating Fe...
Publication number
20230018343
Publication date
Jan 19, 2023
Taiwan Semiconductor Manufacturing Company Limited
Yu-Sheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURES AND METHOD FOR FORMING THE SAME
Publication number
20220359465
Publication date
Nov 10, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chin-Hua Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING STRUCTURES WITH IMPROVED ADHESION AND STRENGTH
Publication number
20200013689
Publication date
Jan 9, 2020
SKYWORKS SOLUTIONS, INC.
Bradley Paul Barber
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING STRUCTURES WITH IMPROVED ADHESION AND STRENGTH
Publication number
20180047650
Publication date
Feb 15, 2018
SKYWORKS SOLUTIONS, INC.
Bradley Paul Barber
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3DIC Package Comprising Perforated Foil Sheet
Publication number
20170250092
Publication date
Aug 31, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS