Structure

Industry

CPC
H01L2924/1631

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1631Structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding structure and method thereof
- Patent number 12,015,001
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Chuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,456,287
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked silicon package assembly having thermal management
- Patent number 11,355,412
- Issue date Jun 7, 2022
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an electronic device comprising forming an i...
- Patent number 11,244,910
- Issue date Feb 8, 2022
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image pickup device and electronic apparatus to increas...
- Patent number 10,986,292
- Issue date Apr 20, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kenji Mishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and method of manufacturing the same
- Patent number 10,916,520
- Issue date Feb 9, 2021
- Mitsubishi Electric Corporation
- Kiyoshi Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for bonding package lid
- Patent number 10,879,140
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,867,835
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor element
- Patent number 10,868,209
- Issue date Dec 15, 2020
- OSRAM OLED GmbH
- Choon Kim Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,748,830
- Issue date Aug 18, 2020
- Mitsubishi Electric Corporation
- Yukimasa Hayashida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an electronic device and a stacked electroni...
- Patent number 10,672,721
- Issue date Jun 2, 2020
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for thermal interface material (TIM) bond lin...
- Patent number 10,529,645
- Issue date Jan 7, 2020
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity package with composite substrate
- Patent number 10,490,510
- Issue date Nov 26, 2019
- Analog Devices, Inc.
- Xiaojie Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component storage substrate and housing package
- Patent number 10,396,002
- Issue date Aug 27, 2019
- KYOCERA Corporation
- Sentaro Yamamoto
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Light emitting device
- Patent number 10,340,429
- Issue date Jul 2, 2019
- Koha Co., Ltd.
- Daisuke Inomata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for bonding package lid
- Patent number 10,269,668
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting substrate, electronic device, and ele...
- Patent number 10,249,564
- Issue date Apr 2, 2019
- Kyocera Corporation
- Kensaku Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,157,772
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with cavities, and methods of fabrication
- Patent number 9,812,406
- Issue date Nov 7, 2017
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency component and high-frequency module including the same
- Patent number 9,743,519
- Issue date Aug 22, 2017
- Murata Manufacturing Co., Ltd.
- Kiyofumi Takai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 9,735,043
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity package with composite substrate
- Patent number 9,728,510
- Issue date Aug 8, 2017
- Analog Devices, Inc.
- Xiaojie Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 9,716,049
- Issue date Jul 25, 2017
- SOCIONEXT INC.
- Kazuyuki Urago
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for bonding package lid
- Patent number 9,673,119
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 9,391,029
- Issue date Jul 12, 2016
- Kabushiki Kaisha Toshiba
- Shinya Hayashiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and method for manufacturing the same
- Patent number 8,995,142
- Issue date Mar 31, 2015
- Hitachi Automotive Systems, Ltd.
- Masato Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoplastic material
- Patent number 8,728,606
- Issue date May 20, 2014
- IQLP, LLC
- Michael A. Zimmerman
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer level package and a method of forming a wafer level package
- Patent number 8,729,695
- Issue date May 20, 2014
- Agency for Science, Technology and Research
- Chirayarikathu Veedu Sankarapillai Premachandran
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multiple patterning wiring board, wiring board and electronic appar...
- Patent number 8,658,908
- Issue date Feb 25, 2014
- Kyocera Corporation
- Shuzou Nakashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micromechanical method and corresponding assembly for bonding semic...
- Patent number 8,638,000
- Issue date Jan 28, 2014
- Robert Bosch GmbH
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20240321810
- Publication date Sep 26, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-CHIAO TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD THEREOF
- Publication number 20240304580
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-CHUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240186213
- Publication date Jun 6, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Jin REE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240128148
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240120252
- Publication date Apr 11, 2024
- RENESAS ELECTRONICS CORPORATION
- Nobuhiro KINOSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240088093
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240079366
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Jonggyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...
- Publication number 20240071974
- Publication date Feb 29, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY LID AND METHODS FOR FORMING THE SAME
- Publication number 20230378007
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS AROUND INDIVIDUAL DIES
- Publication number 20230298953
- Publication date Sep 21, 2023
- Intel Corporation
- Pouya Talebbeydokhti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD THEREOF
- Publication number 20230299028
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-CHUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230178451
- Publication date Jun 8, 2023
- Siliconware Precision Industries Co., Ltd.
- Hsin-Jou Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCEY PACKAGE, HIGH-FREQUENCY MODULE, AND RADIO WAVE ABSO...
- Publication number 20230103894
- Publication date Apr 6, 2023
- NEC Corporation
- Yuki YOSHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Assembly Including Lid With Additional Stress Mitigating Fe...
- Publication number 20230018343
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING PACKAGE HOUSING IN ENGRAVED SURFACE FO...
- Publication number 20230011694
- Publication date Jan 12, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING AN ELECTRONIC DEVICE AND A STACKED ELECTRONI...
- Publication number 20190103368
- Publication date Apr 4, 2019
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR THERMAL INTERFACE MATERIAL (TIM) BOND LIN...
- Publication number 20180358280
- Publication date Dec 13, 2018
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELE...
- Publication number 20180061751
- Publication date Mar 1, 2018
- Kyocera Corporation
- Kensaku MURAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Package and a Method of Forming a Wafer Level Package
- Publication number 20130020713
- Publication date Jan 24, 2013
- Chirayarikathu Veedu Sankarapillai Premachandran
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Power Module and Method for Manufacturing the Same
- Publication number 20130010440
- Publication date Jan 10, 2013
- Hitachi Automotive Systems, Ltd.
- Masato Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromechanical Method and Corresponding Assembly for Bonding Semic...
- Publication number 20120280409
- Publication date Nov 8, 2012
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MOLD DESIGN AND SEMICONDUCTOR PACKAGE
- Publication number 20120018869
- Publication date Jan 26, 2012
- United Test & Assembly Center Ltd.
- Ravi Kanth KOLAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRUCTURE, CIRCUIT DEVICE AND ELECTRONIC APPARATUS
- Publication number 20110317386
- Publication date Dec 29, 2011
- PANASONIC CORPORATION
- Masahito Kawabata
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multiple Patterning Wiring Board, Wiring Board Wiring Board and Ele...
- Publication number 20110315439
- Publication date Dec 29, 2011
- KYOCERA CORPORATION
- Shuzou Nakashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELD CASE AND MEMS MICROPHONE HAVING IT
- Publication number 20110116661
- Publication date May 19, 2011
- PANASONIC CORPORATION
- Katsuhiro Makihata
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPOSITE OF AT LEAST TWO SEMICONDUCTOR SUBSTRATES AND A PRODUCTION...
- Publication number 20100308475
- Publication date Dec 9, 2010
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Power Semiconductor Module, Power Semiconductor Module Assembly and...
- Publication number 20100252922
- Publication date Oct 7, 2010
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOPLASTIC MATERIAL
- Publication number 20100203283
- Publication date Aug 12, 2010
- Michael Zimmerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20100200983
- Publication date Aug 12, 2010
- Omron Corporation
- Kazuyuki Ono
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SHIELD CASE AND MEMS MICROPHONE HAVING IT
- Publication number 20100167799
- Publication date Jul 1, 2010
- Katsuhiro Makihata
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding structure and method thereof

Package structure and method of fabricating the same

Stacked silicon package assembly having thermal management

Method for fabricating an electronic device comprising forming an i...

Solid-state image pickup device and electronic apparatus to increas...

Semiconductor device, and method of manufacturing the same

System and method for bonding package lid

Semiconductor packaging structure and process

Sensor element

Semiconductor device

Method for fabricating an electronic device and a stacked electroni...

Methods and apparatus for thermal interface material (TIM) bond lin...

Cavity package with composite substrate

Electronic component storage substrate and housing package

Light emitting device

System and method for bonding package lid

Electronic component mounting substrate, electronic device, and ele...

Semiconductor packaging structure and process

Microelectronic assemblies with cavities, and methods of fabrication

High-frequency component and high-frequency module including the same

Semiconductor packaging structure and process

Cavity package with composite substrate

Semiconductor device and manufacturing method of semiconductor device

System and method for bonding package lid

Electronic device

Power module and method for manufacturing the same

Thermoplastic material

Wafer level package and a method of forming a wafer level package

Multiple patterning wiring board, wiring board and electronic appar...

Micromechanical method and corresponding assembly for bonding semic...

Patents Applicationslast 30 patents

CHIP PACKAGE STRUCTURE

BONDING STRUCTURE AND METHOD THEREOF

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

Integrated Circuit Packages and Methods of Forming the Same

SEMICONDUCTOR DEVICE

Integrated Circuit Packages and Methods of Forming the Same

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...

PACKAGE ASSEMBLY LID AND METHODS FOR FORMING THE SAME

MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS AROUND INDIVIDUAL DIES

BONDING STRUCTURE AND METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

HIGH-FREQUENCEY PACKAGE, HIGH-FREQUENCY MODULE, AND RADIO WAVE ABSO...

Package Assembly Including Lid With Additional Stress Mitigating Fe...

SEMICONDUCTOR PACKAGE HAVING PACKAGE HOUSING IN ENGRAVED SURFACE FO...

METHOD FOR FABRICATING AN ELECTRONIC DEVICE AND A STACKED ELECTRONI...

METHODS AND APPARATUS FOR THERMAL INTERFACE MATERIAL (TIM) BOND LIN...

ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELE...

Wafer Level Package and a Method of Forming a Wafer Level Package

Power Module and Method for Manufacturing the Same

Micromechanical Method and Corresponding Assembly for Bonding Semic...

MOLD DESIGN AND SEMICONDUCTOR PACKAGE

CONNECTING STRUCTURE, CIRCUIT DEVICE AND ELECTRONIC APPARATUS

Multiple Patterning Wiring Board, Wiring Board Wiring Board and Ele...

SHIELD CASE AND MEMS MICROPHONE HAVING IT

COMPOSITE OF AT LEAST TWO SEMICONDUCTOR SUBSTRATES AND A PRODUCTION...

Power Semiconductor Module, Power Semiconductor Module Assembly and...

THERMOPLASTIC MATERIAL

ELECTRONIC COMPONENT

SHIELD CASE AND MEMS MICROPHONE HAVING IT