Tantalum [Ta] as principal constituent

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H01L2224/29181

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29181Tantalum [Ta] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonded structure and method of manufacturing the same
- Patent number 11,094,661
- Issue date Aug 17, 2021
- Kabushiki Kaisha Toyota Chuo Kenkyusho
- Hirofumi Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dam for three-dimensional integrated circuit
- Patent number 10,867,878
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for semiconductor, and semiconductor device
- Patent number 10,818,610
- Issue date Oct 27, 2020
- LG Chem, Ltd.
- Hee Jung Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device package and methods of packaging thereof
- Patent number 10,297,583
- Issue date May 21, 2019
- Infineon Technologies AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanently bonding wafers by a connecting layer by mean...
- Patent number 10,163,681
- Issue date Dec 25, 2018
- EV Group E. Thallner GmbH
- Klaus Martinschitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dam for three-dimensional integrated circuit
- Patent number 10,020,236
- Issue date Jul 10, 2018
- Taiwan Semiconductar Manufacturing Campany
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing composite structure with metal/metal bonding
- Patent number 9,905,531
- Issue date Feb 27, 2018
- Soitec
- Ionut Radu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically integrated wafers with thermal dissipation
- Patent number 9,812,428
- Issue date Nov 7, 2017
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Zhijiong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for coating and bonding substrates
- Patent number 9,358,765
- Issue date Jun 7, 2016
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package systems
- Patent number 9,355,896
- Issue date May 31, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding pad for thermocompression bonding, process for producing a...
- Patent number 9,281,280
- Issue date Mar 8, 2016
- Robert Bosch GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package systems and manufacturing methods thereof
- Patent number 9,112,001
- Issue date Aug 18, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package systems having an opening in a substrate thereof and manufa...
- Patent number 9,000,578
- Issue date Apr 7, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Submicron connection layer and method for using the same to connect...
- Patent number 8,951,837
- Issue date Feb 10, 2015
- National Chiao Tung University
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,884,470
- Issue date Nov 11, 2014
- Semiconductor Energy Laboratory Co., Ltd.
- Tatsuji Nishijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and methods of packaging thereof
- Patent number 8,846,452
- Issue date Sep 30, 2014
- Infineon Technologies AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive bonding material, method of bonding with th...
- Patent number 8,840,811
- Issue date Sep 23, 2014
- Hitachi Chemical Company, Ltd.
- Yuusuke Yasuda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Package systems having a eutectic bonding material and manufacturin...
- Patent number 8,674,495
- Issue date Mar 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate bonding with metal germanium silicon material
- Patent number 8,592,926
- Issue date Nov 26, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate bonding with metal germanium silicon material
- Patent number 8,058,143
- Issue date Nov 15, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER
- Publication number 20240282658
- Publication date Aug 22, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240038626
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP HEAT DISSIPATING STRUCTURE, PROCESS AND SEMICONDUCTOR DEVICE
- Publication number 20230386959
- Publication date Nov 30, 2023
- HEFEI SMAT TECHNOLOGY CO.,LTD.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE
- Publication number 20190326226
- Publication date Oct 24, 2019
- LG CHEM, LTD.
- Hee Jung KIM
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Dam for Three-Dimensional Integrated Circuit
- Publication number 20180323118
- Publication date Nov 8, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY INTEGRATED WAFERS WITH THERMAL DISSIPATION
- Publication number 20170040295
- Publication date Feb 9, 2017
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Zhijiong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING COMPOSITE STRUCTURE WITH METAL/METAL BONDING
- Publication number 20150179603
- Publication date Jun 25, 2015
- SOITEC
- Ionut Radu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING METALLIC BONDING LAYER AND METHOD OF MANUFACTURIN...
- Publication number 20140273318
- Publication date Sep 18, 2014
- Samsung Electronics Co., Ltd.
- Yung Ho RYU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF
- Publication number 20140170849
- Publication date Jun 19, 2014
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Chia-Pao SHU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEAN...
- Publication number 20140154867
- Publication date Jun 5, 2014
- EV Group E. Thallner GmbH
- Klaus Martinschitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device Package and Methods of Packaging Thereof
- Publication number 20140057393
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD FOR THERMOCOMPRESSION BONDING, PROCESS FOR PRODUCING A...
- Publication number 20140035168
- Publication date Feb 6, 2014
- ROBERT BOSCH GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUBMICRON CONNECTION LAYER AND METHOD FOR USING THE SAME TO CONNECT...
- Publication number 20140008801
- Publication date Jan 9, 2014
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF
- Publication number 20120086126
- Publication date Apr 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao SHU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF
- Publication number 20120086127
- Publication date Apr 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao SHU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL
- Publication number 20120068325
- Publication date Mar 22, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device
- Publication number 20120062430
- Publication date Mar 15, 2012
- Semiconductor Energy Laboratory Co., Ltd
- Tatsuji NISHIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE BONDING MATERIAL, METHOD OF BONDING WITH TH...
- Publication number 20100270515
- Publication date Oct 28, 2010
- Yuusuke YASUDA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL
- Publication number 20100181676
- Publication date Jul 22, 2010
- RUBEN B. MONTEZ
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Tantalum [Ta] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonded structure and method of manufacturing the same

Method and apparatus for creating a bond between objects based on f...

Dam for three-dimensional integrated circuit

Adhesive film for semiconductor, and semiconductor device

Semiconductor device package and methods of packaging thereof

Method for permanently bonding wafers by a connecting layer by mean...

Dam for three-dimensional integrated circuit

Method for producing composite structure with metal/metal bonding

Vertically integrated wafers with thermal dissipation

Method for coating and bonding substrates

Package systems

Bonding pad for thermocompression bonding, process for producing a...

Package systems and manufacturing methods thereof

Package systems having an opening in a substrate thereof and manufa...

Submicron connection layer and method for using the same to connect...

Semiconductor device

Semiconductor device package and methods of packaging thereof

Electrically conductive bonding material, method of bonding with th...

Package systems having a eutectic bonding material and manufacturin...

Substrate bonding with metal germanium silicon material

Substrate bonding with metal germanium silicon material

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP HEAT DISSIPATING STRUCTURE, PROCESS AND SEMICONDUCTOR DEVICE

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

ADHESIVE FILM FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE

Dam for Three-Dimensional Integrated Circuit

VERTICALLY INTEGRATED WAFERS WITH THERMAL DISSIPATION

METHOD FOR PRODUCING COMPOSITE STRUCTURE WITH METAL/METAL BONDING

METHOD OF FORMING METALLIC BONDING LAYER AND METHOD OF MANUFACTURIN...

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEAN...

Semiconductor Device Package and Methods of Packaging Thereof

BONDING PAD FOR THERMOCOMPRESSION BONDING, PROCESS FOR PRODUCING A...

SUBMICRON CONNECTION LAYER AND METHOD FOR USING THE SAME TO CONNECT...

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL

Semiconductor Device

ELECTRICALLY CONDUCTIVE BONDING MATERIAL, METHOD OF BONDING WITH TH...

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL