Tantalum (Ta) as principal constituent

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H01L2224/48881

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48881Tantalum (Ta) as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and inspection device
- Patent number 12,040,303
- Issue date Jul 16, 2024
- Kabushiki Kaisha Toshiba
- Mitsuaki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having copper interconnect for bonding
- Patent number 8,759,970
- Issue date Jun 24, 2014
- Round Rock Research, LLC
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level processing method and structure to manufacture semicond...
- Patent number 8,431,977
- Issue date Apr 30, 2013
- Megica Corporation
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure having dummy plugs and/or patterns formed therea...
- Patent number 8,030,781
- Issue date Oct 4, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and semiconductor device having copper interconnect for bonding
- Patent number 7,592,246
- Issue date Sep 22, 2009
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect
- Patent number 7,569,934
- Issue date Aug 4, 2009
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnection with conductive polymer layer and method of...
- Patent number 7,538,434
- Issue date May 26, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect
- Patent number 7,511,363
- Issue date Mar 31, 2009
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect
- Patent number 7,489,041
- Issue date Feb 10, 2009
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect for semiconductor device
- Patent number 7,345,358
- Issue date Mar 18, 2008
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving copper interconnects of semiconductor devices f...
- Patent number 7,338,889
- Issue date Mar 4, 2008
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving copper interconnects of semiconductor devices f...
- Patent number 6,835,643
- Issue date Dec 28, 2004
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving copper interconnects of semiconductor devices f...
- Patent number 6,544,880
- Issue date Apr 8, 2003
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND INSPECTION DEVICE
- Publication number 20210296279
- Publication date Sep 23, 2021
- Kabushiki Kaisha Toshiba
- Mitsuaki KATO
- G01 - MEASURING TESTING
Information Patent Application
BOND PAD STRUCTURE TO REDUCE BOND PAD CORROSION
- Publication number 20130043598
- Publication date Feb 21, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Bonding Wire
- Publication number 20120267784
- Publication date Oct 25, 2012
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PROCESSING METHOD AND STRUCTURE TO MANUFACTURE SEMICOND...
- Publication number 20110304008
- Publication date Dec 15, 2011
- Magica Corporation
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE HAVING DUMMY PLUGS AND/OR PATTERNS FORMED THEREA...
- Publication number 20100072632
- Publication date Mar 25, 2010
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SEMICONDUCTOR DEVICE HAVING COPPER INTERCONNECT FOR BONDING
- Publication number 20090309222
- Publication date Dec 17, 2009
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnection with conductive polymer layer and method of...
- Publication number 20060202346
- Publication date Sep 14, 2006
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnect
- Publication number 20060138660
- Publication date Jun 29, 2006
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnect
- Publication number 20060071336
- Publication date Apr 6, 2006
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnect
- Publication number 20060055057
- Publication date Mar 16, 2006
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnect
- Publication number 20060055058
- Publication date Mar 16, 2006
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnect
- Publication number 20060055060
- Publication date Mar 16, 2006
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnect
- Publication number 20060055059
- Publication date Mar 16, 2006
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and semiconductor device having copper interconnect for bonding
- Publication number 20050218483
- Publication date Oct 6, 2005
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnect
- Publication number 20050212128
- Publication date Sep 29, 2005
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and semiconductor device having copper interconnect for bonding
- Publication number 20050098888
- Publication date May 12, 2005
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of improving copper interconnect of semiconductor devices fo...
- Publication number 20040171246
- Publication date Sep 2, 2004
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of improving copper interconnect of semiconductor devices fo...
- Publication number 20030143830
- Publication date Jul 31, 2003
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of improving copper interconnects of semiconductor devices f...
- Publication number 20030141567
- Publication date Jul 31, 2003
- SALMAN AKRAM
- H01 - BASIC ELECTRIC ELEMENTS

Tantalum (Ta) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and inspection device

Semiconductor device having copper interconnect for bonding

Wafer level processing method and structure to manufacture semicond...

Bond pad structure having dummy plugs and/or patterns formed therea...

Method and semiconductor device having copper interconnect for bonding

Copper interconnect

Copper interconnection with conductive polymer layer and method of...

Copper interconnect

Copper interconnect

Copper interconnect for semiconductor device

Method of improving copper interconnects of semiconductor devices f...

Method of improving copper interconnects of semiconductor devices f...

Method of improving copper interconnects of semiconductor devices f...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND INSPECTION DEVICE

BOND PAD STRUCTURE TO REDUCE BOND PAD CORROSION

Semiconductor Device and Bonding Wire

WAFER LEVEL PROCESSING METHOD AND STRUCTURE TO MANUFACTURE SEMICOND...

BOND PAD STRUCTURE HAVING DUMMY PLUGS AND/OR PATTERNS FORMED THEREA...

METHOD AND SEMICONDUCTOR DEVICE HAVING COPPER INTERCONNECT FOR BONDING

Copper interconnection with conductive polymer layer and method of...

Copper interconnect

Copper interconnect

Copper interconnect

Copper interconnect

Copper interconnect

Copper interconnect

Method and semiconductor device having copper interconnect for bonding

Copper interconnect

Method and semiconductor device having copper interconnect for bonding

Method of improving copper interconnect of semiconductor devices fo...

Method of improving copper interconnect of semiconductor devices fo...

Method of improving copper interconnects of semiconductor devices f...