Tantalum [Ta] as principal constituent

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H01L2224/81481

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81481Tantalum [Ta] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Bridge interconnection with layered interconnect structures
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- Issue date Oct 29, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no-lead (QFN) package without leadframe and direct contac...
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- Issue date Sep 5, 2023
- Deca Technologies USA, Inc.
- Robin Davis
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Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 11,694,960
- Issue date Jul 4, 2023
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 11,133,257
- Issue date Sep 28, 2021
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 10,475,745
- Issue date Nov 12, 2019
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 9,640,485
- Issue date May 2, 2017
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
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- Samsung Electronics Co., Ltd.
- Seongho Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240071990
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20210384129
- Publication date Dec 9, 2021
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20200043852
- Publication date Feb 6, 2020
- Intel Corporation
- Yueli Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20140353827
- Publication date Dec 4, 2014
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20120236230
- Publication date Sep 20, 2012
- Sharp Kabushiki Kaisha
- Hiroki Nakahama
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