Temperature control

Industry

CPC
B24B37/015

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/015Temperature control

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Channel cut polishing machine
- Patent number 12,134,164
- Issue date Nov 5, 2024
- UChicago Argonne, LLC
- Elina Kasman
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical polishing apparatus
- Patent number 12,103,133
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method and polishing apparatus
- Patent number 12,076,830
- Issue date Sep 3, 2024
- Ebara Corporation
- Masashi Kabasawa
- B24 - GRINDING POLISHING
Information Patent Grant
Methods of detecting non-conforming substrate processing events dur...
- Patent number 12,036,635
- Issue date Jul 16, 2024
- Applied Materials, Inc.
- Jeonghoon Oh
- B24 - GRINDING POLISHING
Information Patent Grant
Temperature regulating apparatus and polishing apparatus
- Patent number 12,023,777
- Issue date Jul 2, 2024
- Ebara Corporation
- Keisuke Kamiki
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing method
- Patent number 12,017,322
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for adjusting pad surface temperature and polishing apparatus
- Patent number 11,992,915
- Issue date May 28, 2024
- Ebara Corporation
- Shuji Uozumi
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus, chemical mechanical polish...
- Patent number 11,986,921
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Myung-Ki Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing method, polishing agent and cleaning agent for polishing
- Patent number 11,986,920
- Issue date May 21, 2024
- Kioxia Corporation
- Mikiya Sakashita
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad, method for producing the same and method of fabricat...
- Patent number 11,951,591
- Issue date Apr 9, 2024
- SK ENPULSE CO., LTD.
- Hye Young Heo
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head, substrate processing apparatus including the same a...
- Patent number 11,919,122
- Issue date Mar 5, 2024
- Samsung Display Co., Ltd.
- Seung Bae Kang
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for CMP temperature control
- Patent number 11,919,123
- Issue date Mar 5, 2024
- Applied Materials, Inc.
- Surajit Kumar
- B24 - GRINDING POLISHING
Information Patent Grant
Pad-temperature regulating apparatus, method of regulating pad-temp...
- Patent number 11,919,124
- Issue date Mar 5, 2024
- Ebara Corporation
- Toru Maruyama
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing system with platen temperature control
- Patent number 11,911,869
- Issue date Feb 27, 2024
- Applied Materials, Inc.
- Jeonghoon Oh
- B24 - GRINDING POLISHING
Information Patent Grant
Temperature control in chemical mechanical polish
- Patent number 11,904,430
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kei-Wei Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Low-temperature metal CMP for minimizing dishing and corrosion, and...
- Patent number 11,897,079
- Issue date Feb 13, 2024
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 11,897,080
- Issue date Feb 13, 2024
- Ebara Corporation
- Masashi Kabasawa
- B24 - GRINDING POLISHING
Information Patent Grant
Method of polishing silicon wafer
- Patent number 11,890,719
- Issue date Feb 6, 2024
- Sumco Corporation
- Shuhei Matsuda
- B24 - GRINDING POLISHING
Information Patent Grant
Temperature-based in-situ edge assymetry correction during CMP
- Patent number 11,865,671
- Issue date Jan 9, 2024
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical planarization membrane
- Patent number 11,850,702
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ping Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Pad-temperature regulating apparatus, and polishing apparatus
- Patent number 11,839,947
- Issue date Dec 12, 2023
- Ebara Corporation
- Keisuke Kamiki
- B24 - GRINDING POLISHING
Information Patent Grant
Control of steam generation for chemical mechanical polishing
- Patent number 11,833,637
- Issue date Dec 5, 2023
- Applied Materials, Inc.
- Hari Soundararajan
- F22 - STEAM GENERATION
Information Patent Grant
Pad-temperature regulating apparatus, pad-temperature regulating me...
- Patent number 11,826,871
- Issue date Nov 28, 2023
- Ebara Corporation
- Shuji Uozumi
- B24 - GRINDING POLISHING
Information Patent Grant
Temperature and slurry flow rate control in CMP
- Patent number 11,826,872
- Issue date Nov 28, 2023
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Grant
Control of steam generation for chemical mechanical polishing
- Patent number 11,801,582
- Issue date Oct 31, 2023
- Applied Materials, Inc.
- Hari Soundararajan
- B24 - GRINDING POLISHING
Information Patent Grant
Methods and apparatus to control a fluid dispenser on a metallurgic...
- Patent number 11,787,007
- Issue date Oct 17, 2023
- Illinois Tool Works Inc.
- Michael E. Keeble
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus including a multi-zone platen
- Patent number 11,772,228
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Hsun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing temperature scanning apparatus for te...
- Patent number 11,752,589
- Issue date Sep 12, 2023
- Applied Materials, Inc.
- Hari Soundararajan
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate polish edge uniformity control with secondary fluid dispense
- Patent number 11,724,355
- Issue date Aug 15, 2023
- Applied Materials, Inc.
- Justin H. Wong
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer thermal removal control
- Patent number 11,707,813
- Issue date Jul 25, 2023
- GlobalWafers Co., Ltd.
- Emanuele Corsi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STEAM GENERATION FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20240342855
- Publication date Oct 17, 2024
- Applied Materials, Inc.
- Chad Pollard
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING METHOD
- Publication number 20240308021
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE POLISHING APPARATUS
- Publication number 20240286243
- Publication date Aug 29, 2024
- KCTECH CO., LTD.
- Sung Ho SHIN
- B24 - GRINDING POLISHING
Information Patent Application
Wafer Temperature Control System and Control Method, Computer Devic...
- Publication number 20240269797
- Publication date Aug 15, 2024
- Shanghai Huali Integrated Circuit Corporation
- Qingqing Duan
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING APPARATUS AND METHOD OF POLISHING SUBSTRATE
- Publication number 20240261930
- Publication date Aug 8, 2024
- Samsung Electronics Co., Ltd.
- Yejin Choi
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR CONTROLLING SUBSTRATE POLISH EDGE UNIFORMITY
- Publication number 20240253183
- Publication date Aug 1, 2024
- Applied Materials, Inc.
- Priscilla Michelle Diep LAROSA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF CREATING CORRELATION RELATIONAL FORMULA FOR DETERMINING P...
- Publication number 20240246191
- Publication date Jul 25, 2024
- SUMCO CORPORATION
- Yuki NAKANO
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS
- Publication number 20240238935
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Gihwan Kim
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING APPARATUS
- Publication number 20240238939
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Jihyeon Kim
- B08 - CLEANING
Information Patent Application
LIGHT INTENSITY ADJUSTMENT METHOD FOR OPTICAL FILM THICKNESS MEASUR...
- Publication number 20240207997
- Publication date Jun 27, 2024
- EBARA CORPORATION
- Masaki KINOSHITA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD, AND POLISHING APPARATUS
- Publication number 20240181594
- Publication date Jun 6, 2024
- EBARA CORPORATION
- Masashi KABASAWA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS
- Publication number 20240157503
- Publication date May 16, 2024
- EBARA CORPORATION
- Seungho YUN
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL
- Publication number 20240157504
- Publication date May 16, 2024
- Applied Materials, Inc.
- Surajit Kumar
- B24 - GRINDING POLISHING
Information Patent Application
Temperature Control in Chemical Mechanical Polish
- Publication number 20240149388
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kei-Wei Chen
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR CMP TEMPERATURE CONTROL
- Publication number 20240109163
- Publication date Apr 4, 2024
- Applied Materials, Inc.
- Haosheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD
- Publication number 20240087963
- Publication date Mar 14, 2024
- EBARA CORPORATION
- Akira FUKUNAGA
- B24 - GRINDING POLISHING
Information Patent Application
PROCESSING APPARATUS
- Publication number 20240066659
- Publication date Feb 29, 2024
- Disco Corporation
- Tomoya OGANE
- B24 - GRINDING POLISHING
Information Patent Application
LOW-TEMPERATURE METAL CMP FOR MINIMIZING DISHING AND CORROSION, AND...
- Publication number 20240066660
- Publication date Feb 29, 2024
- Applied Materials, Inc.
- Haosheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING OF CMP TEMPERATURE CONTROL SYSTEM
- Publication number 20240042570
- Publication date Feb 8, 2024
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS
- Publication number 20240033876
- Publication date Feb 1, 2024
- EBARA CORPORATION
- Shumpei MIURA
- B24 - GRINDING POLISHING
Information Patent Application
TEMPERATURE AND SLURRY FLOW RATE CONTROL IN CMP
- Publication number 20240025006
- Publication date Jan 25, 2024
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL
- Publication number 20230415296
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Shou-Sung Chang
- B24 - GRINDING POLISHING
Information Patent Application
CONTROL OF STEAM GENERATION FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20230415297
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Hari Soundararajan
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20230381914
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-HSI HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING PAD AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
- Publication number 20230381913
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Donghoon KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen
- Publication number 20230364733
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Hsun Chang
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING TEMPERATURE SCANNING APPARATUS FOR TE...
- Publication number 20230356351
- Publication date Nov 9, 2023
- Applied Materials, Inc.
- Hari Soundararajan
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR WAFER THERMAL REMOVAL CONTROL
- Publication number 20230347469
- Publication date Nov 2, 2023
- GLOBALWAFERS CO., LTD.
- Emanuele Corsi
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISH EDGE UNIFORMITY CONTROL WITH SECONDARY FLUID DISPENSE
- Publication number 20230339066
- Publication date Oct 26, 2023
- Applied Materials, Inc.
- Justin H. WONG
- B24 - GRINDING POLISHING
Information Patent Application
EXTERNAL HEATING SYSTEM FOR USE IN CHEMICAL MECHANICAL POLISHING SY...
- Publication number 20230294237
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Sheng LIN
- B24 - GRINDING POLISHING

Temperature control

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Channel cut polishing machine

Chemical-mechanical polishing apparatus

Polishing method and polishing apparatus

Methods of detecting non-conforming substrate processing events dur...

Temperature regulating apparatus and polishing apparatus

Chemical mechanical polishing method

System for adjusting pad surface temperature and polishing apparatus

Chemical mechanical polishing apparatus, chemical mechanical polish...

Polishing method, polishing agent and cleaning agent for polishing

Polishing pad, method for producing the same and method of fabricat...

Polishing head, substrate processing apparatus including the same a...

Apparatus and method for CMP temperature control

Pad-temperature regulating apparatus, method of regulating pad-temp...

Chemical mechanical polishing system with platen temperature control

Temperature control in chemical mechanical polish

Low-temperature metal CMP for minimizing dishing and corrosion, and...

Polishing apparatus

Method of polishing silicon wafer

Temperature-based in-situ edge assymetry correction during CMP

Chemical mechanical planarization membrane

Pad-temperature regulating apparatus, and polishing apparatus

Control of steam generation for chemical mechanical polishing

Pad-temperature regulating apparatus, pad-temperature regulating me...

Temperature and slurry flow rate control in CMP

Control of steam generation for chemical mechanical polishing

Methods and apparatus to control a fluid dispenser on a metallurgic...

Chemical mechanical polishing apparatus including a multi-zone platen

Chemical mechanical polishing temperature scanning apparatus for te...

Substrate polish edge uniformity control with secondary fluid dispense

Semiconductor wafer thermal removal control

Patents Applicationslast 30 patents

STEAM GENERATION FOR CHEMICAL MECHANICAL POLISHING

CHEMICAL MECHANICAL POLISHING METHOD

SUBSTRATE POLISHING APPARATUS

Wafer Temperature Control System and Control Method, Computer Devic...

SUBSTRATE POLISHING APPARATUS AND METHOD OF POLISHING SUBSTRATE

APPARATUS AND METHOD FOR CONTROLLING SUBSTRATE POLISH EDGE UNIFORMITY

METHOD OF CREATING CORRELATION RELATIONAL FORMULA FOR DETERMINING P...

CHEMICAL MECHANICAL POLISHING APPARATUS

SUBSTRATE POLISHING APPARATUS

LIGHT INTENSITY ADJUSTMENT METHOD FOR OPTICAL FILM THICKNESS MEASUR...

POLISHING METHOD, AND POLISHING APPARATUS

POLISHING APPARATUS

APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL

Temperature Control in Chemical Mechanical Polish

METHOD FOR CMP TEMPERATURE CONTROL

SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD

PROCESSING APPARATUS

LOW-TEMPERATURE METAL CMP FOR MINIMIZING DISHING AND CORROSION, AND...

CLEANING OF CMP TEMPERATURE CONTROL SYSTEM

POLISHING APPARATUS

TEMPERATURE AND SLURRY FLOW RATE CONTROL IN CMP

APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL

CONTROL OF STEAM GENERATION FOR CHEMICAL MECHANICAL POLISHING

APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

POLISHING PAD AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME

Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen

CHEMICAL MECHANICAL POLISHING TEMPERATURE SCANNING APPARATUS FOR TE...

SEMICONDUCTOR WAFER THERMAL REMOVAL CONTROL

SUBSTRATE POLISH EDGE UNIFORMITY CONTROL WITH SECONDARY FLUID DISPENSE

EXTERNAL HEATING SYSTEM FOR USE IN CHEMICAL MECHANICAL POLISHING SY...