Temperature range 150 C=<T<200 C, 423.15 K =< T < 473.15K

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CPC
H01L2924/20105

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/20105Temperature range 150 C=<T<200 C, 423.15 K =< T < 473.15K

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Die bonding pads and methods of forming the same
- Patent number 12,300,644
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding method
- Patent number 12,266,623
- Issue date Apr 1, 2025
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Yunzhi Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,154,882
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for fabricating hybrid bonded structure
- Patent number 12,021,103
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer and integrated circuit including redistributio...
- Patent number 12,021,046
- Issue date Jun 25, 2024
- STMicroelectronics S.r.l.
- Paolo Colpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage curing methodology by inducing curvature
- Patent number 11,929,260
- Issue date Mar 12, 2024
- Applied Materials, Inc.
- Fang Jie Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of power semiconductor device, power semicondu...
- Patent number 11,894,337
- Issue date Feb 6, 2024
- Mitsubishi Electric Corporation
- Keisuke Kawamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, wire bonding structure, semic...
- Patent number 11,876,066
- Issue date Jan 16, 2024
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module and manufacturing method thereof
- Patent number 11,817,414
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Won Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,652,072
- Issue date May 16, 2023
- Renesas Electronics Corporation
- Takashi Tonegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting method and mounting device
- Patent number 11,495,571
- Issue date Nov 8, 2022
- Toray Engineering Co., Ltd.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a redistribution layer, redistribution laye...
- Patent number 11,469,194
- Issue date Oct 11, 2022
- STMicroelectronics S.r.l.
- Paolo Colpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,456,264
- Issue date Sep 27, 2022
- Renesas Electronics Corporation
- Yoshiaki Sato
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit (IC) packages employing split, double-sided meta...
- Patent number 11,456,291
- Issue date Sep 27, 2022
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonded structure
- Patent number 11,437,422
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 11,417,619
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Package structure and method for connecting components
- Patent number 11,355,472
- Issue date Jun 7, 2022
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary bonding scheme
- Patent number 11,328,972
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for allowing restoration of interconnection of di...
- Patent number 11,251,151
- Issue date Feb 15, 2022
- Mitsubishi Electric Corporation
- Jeffrey Ewanchuk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of power semiconductor device, power semicondu...
- Patent number 11,121,116
- Issue date Sep 14, 2021
- Mitsubishi Electric Corporation
- Keisuke Kawamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder joining of electronic structures
- Patent number 11,043,468
- Issue date Jun 22, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,004,817
- Issue date May 11, 2021
- SOCIONEXT INC.
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 10,998,284
- Issue date May 4, 2021
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Device packaging facility and method, and device processing apparat...
- Patent number 10,937,757
- Issue date Mar 2, 2021
- Semigear, Inc.
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip bonding method
- Patent number 10,910,339
- Issue date Feb 2, 2021
- Samsung Electronics Co., Ltd.
- Hwail Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering material
- Patent number 10,888,957
- Issue date Jan 12, 2021
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Non-porous copper to copper interconnect
- Patent number 10,804,241
- Issue date Oct 13, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and bonding method thereof
- Patent number 10,756,050
- Issue date Aug 25, 2020
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250107298
- Publication date Mar 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046747
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20250046750
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR FABRICATING HYBRID BONDED STRUCTURE
- Publication number 20240313026
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240164118
- Publication date May 16, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuaki TSUCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128217
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE
- Publication number 20240128227
- Publication date Apr 18, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Perceval COUDRAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING METHOD
- Publication number 20240038705
- Publication date Feb 1, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yunzhi LING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonding Pads and Methods of Forming the Same
- Publication number 20230307392
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20230282611
- Publication date Sep 7, 2023
- FUJI ELECTRIC CO., LTD.
- Hiroki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...
- Publication number 20230230950
- Publication date Jul 20, 2023
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Yuechen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230115289
- Publication date Apr 13, 2023
- Mitsubishi Electric Corporation
- Koji YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...
- Publication number 20230005848
- Publication date Jan 5, 2023
- STMicroelectronics S.r.l.
- Paolo COLPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING HYBRID BONDED STRUCTURE
- Publication number 20220359601
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220336395
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER NANOPARTICLES SYNTHESIS METHOD FOR LOW TEMPERATURE AND PRESS...
- Publication number 20220108975
- Publication date Apr 7, 2022
- STMicroelectronics S.r.l.
- Cristina MANOLA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...
- Publication number 20220077104
- Publication date Mar 10, 2022
- The Regents of the University of California
- Mike Breeden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20220013489
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Won Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING SPLIT, DOUBLE-SIDED META...
- Publication number 20210407979
- Publication date Dec 30, 2021
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A CIRCUIT CARRIER, CIRCUIT CARRIER, METHOD FOR...
- Publication number 20210210406
- Publication date Jul 8, 2021
- Heraeus Deutschland GmbH & Co. KG
- Ronald EISELE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210057362
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED STRUCTURE
- Publication number 20200295070
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR ALLOWING RESTORATION OF INTERCONNECTION OF DI...
- Publication number 20200286848
- Publication date Sep 10, 2020
- Mitsubishi Electric Corporation
- Jeffrey EWANCHUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF POWER SEMICONDUCTOR DEVICE, POWER SEMICONDU...
- Publication number 20200235072
- Publication date Jul 23, 2020
- Mitsubishi Electric Corporation
- Keisuke KAWAMOTO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES
- Publication number 20200161272
- Publication date May 21, 2020
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-POROUS COPPER TO COPPER INTERCONNECT
- Publication number 20200098723
- Publication date Mar 26, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP BONDING METHOD
- Publication number 20200058615
- Publication date Feb 20, 2020
- Samsung Electronics Co., Ltd.
- HWAIL JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...
- Publication number 20200051935
- Publication date Feb 13, 2020
- STMicroelectronics S.r.l.
- Michele MOLGG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND BONDING METHOD THEREOF
- Publication number 20200043890
- Publication date Feb 6, 2020
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Temperature range 150 C=<T<200 C, 423.15 K =< T < 473.15K

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Die bonding pads and methods of forming the same

Substrate bonding method

Solder reflow apparatus and method of manufacturing an electronic d...

Low pressure sintering powder

Method for fabricating hybrid bonded structure

Redistribution layer and integrated circuit including redistributio...

Low warpage curing methodology by inducing curvature

Manufacturing method of power semiconductor device, power semicondu...

Palladium-coated copper bonding wire, wire bonding structure, semic...

Display module and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Mounting method and mounting device

Method of manufacturing a redistribution layer, redistribution laye...

Method of manufacturing semiconductor device

Integrated circuit (IC) packages employing split, double-sided meta...

Hybrid bonded structure

Package and manufacturing method thereof

Sintering materials and attachment methods using same

Package structure and method for connecting components

Temporary bonding scheme

System and method for allowing restoration of interconnection of di...

Manufacturing method of power semiconductor device, power semicondu...

Lead-free solder joining of electronic structures

Semiconductor device and method for manufacturing the same

Low pressure sintering powder

Device packaging facility and method, and device processing apparat...

Flip chip bonding method

Soldering material

Non-porous copper to copper interconnect

Package structure and bonding method thereof

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

LOW PRESSURE SINTERING POWDER

METHOD FOR FABRICATING HYBRID BONDED STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE

SUBSTRATE BONDING METHOD

Die Bonding Pads and Methods of Forming the Same

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...

METHOD FOR FABRICATING HYBRID BONDED STRUCTURE

PACKAGE AND MANUFACTURING METHOD THEREOF

SILVER NANOPARTICLES SYNTHESIS METHOD FOR LOW TEMPERATURE AND PRESS...

METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...

DISPLAY MODULE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING SPLIT, DOUBLE-SIDED META...

METHOD FOR PRODUCING A CIRCUIT CARRIER, CIRCUIT CARRIER, METHOD FOR...

PACKAGE AND MANUFACTURING METHOD THEREOF

HYBRID BONDED STRUCTURE

SYSTEM AND METHOD FOR ALLOWING RESTORATION OF INTERCONNECTION OF DI...

MANUFACTURING METHOD OF POWER SEMICONDUCTOR DEVICE, POWER SEMICONDU...

LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES

NON-POROUS COPPER TO COPPER INTERCONNECT

FLIP CHIP BONDING METHOD

METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...

PACKAGE STRUCTURE AND BONDING METHOD THEREOF