Temperature range 250 C=<T<300 C, 523.15K =<T< 573.15K

Industry

CPC
H01L2924/20107

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/20107Temperature range 250 C=<T<300 C, 523.15K =<T< 573.15K

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Process flow for fabrication of cap metal over top metal with sinte...
- Patent number 12,159,846
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Redistribution layer and integrated circuit including redistributio...
- Patent number 12,021,046
- Issue date Jun 25, 2024
- STMicroelectronics S.r.l.
- Paolo Colpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including buffer layer
- Patent number 11,810,879
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3DIC formation with dies bonded to formed RDLs
- Patent number 11,810,899
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a redistribution layer, redistribution laye...
- Patent number 11,469,194
- Issue date Oct 11, 2022
- STMicroelectronics S.r.l.
- Paolo Colpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joining material and joining method using same
- Patent number 11,453,053
- Issue date Sep 27, 2022
- Dowa Electronics Materials Co., Ltd.
- Satoru Kurita
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,456,264
- Issue date Sep 27, 2022
- Renesas Electronics Corporation
- Yoshiaki Sato
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of fabricating high-power module
- Patent number 11,426,793
- Issue date Aug 30, 2022
- National Cheng Kung University
- In-Gann Chen
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Package and manufacturing method thereof
- Patent number 11,417,619
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of designing a layout, method of making a semiconductor stru...
- Patent number 11,309,268
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lead-free solder joining of electronic structures
- Patent number 11,043,468
- Issue date Jun 22, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC formation with dies bonded to formed RDLs
- Patent number 11,004,826
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device production method
- Patent number 10,998,283
- Issue date May 4, 2021
- TOSHIBA MEMORY CORPORATION
- Takahiko Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 10,998,284
- Issue date May 4, 2021
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Flip chip bonding method
- Patent number 10,910,339
- Issue date Feb 2, 2021
- Samsung Electronics Co., Ltd.
- Hwail Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding semiconductor substrates
- Patent number 10,886,252
- Issue date Jan 5, 2021
- Imec VZW
- Lan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered composite bonding materials and power electronics ass...
- Patent number 10,886,251
- Issue date Jan 5, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with post passivation structure
- Patent number 10,727,191
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solid-state wafer bonding of functional materials on substrates and...
- Patent number 10,679,964
- Issue date Jun 9, 2020
- The Regents of the University of California
- Shadi A. Dayeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of determining curing conditions, method of producing circui...
- Patent number 10,658,329
- Issue date May 19, 2020
- Sony Corporation
- Takeshi Ichimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste having dilatancy, electrode connection structure i...
- Patent number 10,651,143
- Issue date May 12, 2020
- SHARP KABUSHIKI KAISHA
- Tomotoshi Satoh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Conductive paste and die bonding method
- Patent number 10,615,144
- Issue date Apr 7, 2020
- Kaken Tech Co., Ltd.
- Shigeo Hori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Lead-free solder joining of electronic structures
- Patent number 10,586,782
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier-bonding methods and articles for semiconductor and interpos...
- Patent number 10,510,576
- Issue date Dec 17, 2019
- Corning Incorporated
- Darwin Gene Enicks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, electronic-component-mounted substrate and se...
- Patent number 10,504,864
- Issue date Dec 10, 2019
- Hitachi Chemical Company, Ltd.
- Kaoru Konno
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Solder paste
- Patent number 10,456,871
- Issue date Oct 29, 2019
- Heraeus Deutschland GmbH & Co. KG
- Sebastian Fritzsche
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
No clean flux composition and methods for use thereof
- Patent number 10,350,713
- Issue date Jul 16, 2019
- International Business Machines Corporation
- Victor Alvarez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for processing a die
- Patent number 10,340,227
- Issue date Jul 2, 2019
- Infineon Technologies AG
- Markus Zundel
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING STRESS CONTROL LAYER AND METHODS OF...
- Publication number 20240413034
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312868
- Publication date Sep 19, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...
- Publication number 20240274563
- Publication date Aug 15, 2024
- INFINEON TECHNOLOGIES AG
- Hock Heng CHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...
- Publication number 20240258258
- Publication date Aug 1, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128217
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE
- Publication number 20240128227
- Publication date Apr 18, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Perceval COUDRAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING METHOD
- Publication number 20240038705
- Publication date Feb 1, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yunzhi LING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230361062
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Huan Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonding Pads and Methods of Forming the Same
- Publication number 20230307392
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AG PASTE COMPOSITION AND BONDING FILM PRODUCED USING SAME
- Publication number 20230260946
- Publication date Aug 17, 2023
- AMOGREENTECH CO., LTD.
- Younghwan JUN
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...
- Publication number 20230230950
- Publication date Jul 20, 2023
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Yuechen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230115289
- Publication date Apr 13, 2023
- Mitsubishi Electric Corporation
- Koji YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...
- Publication number 20230005848
- Publication date Jan 5, 2023
- STMicroelectronics S.r.l.
- Paolo COLPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220336395
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...
- Publication number 20220077104
- Publication date Mar 10, 2022
- The Regents of the University of California
- Mike Breeden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A CIRCUIT CARRIER, CIRCUIT CARRIER, METHOD FOR...
- Publication number 20210210406
- Publication date Jul 8, 2021
- Heraeus Deutschland GmbH & Co. KG
- Ronald EISELE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210057362
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FLOW FOR FABRICATION OF CAP METAL OVER TOP METAL WITH SINTE...
- Publication number 20210005560
- Publication date Jan 7, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabricating High-Power Module
- Publication number 20200171578
- Publication date Jun 4, 2020
- National Cheng Kung University
- In-Gann Chen
- B22 - CASTING POWDER METALLURGY
Information Patent Application
LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES
- Publication number 20200161272
- Publication date May 21, 2020
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP BONDING METHOD
- Publication number 20200058615
- Publication date Feb 20, 2020
- Samsung Electronics Co., Ltd.
- HWAIL JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...
- Publication number 20200051935
- Publication date Feb 13, 2020
- STMicroelectronics S.r.l.
- Michele MOLGG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PRODUCTION METHOD
- Publication number 20200035636
- Publication date Jan 30, 2020
- Toshiba Memory Corporation
- Takahiro KAWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DETERMINING CURING CONDITIONS, METHOD OF PRODUCING CIRCUI...
- Publication number 20190267348
- Publication date Aug 29, 2019
- SONY CORPORATION
- Takeshi Ichimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINTERING BONDING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20190252348
- Publication date Aug 15, 2019
- Hyundai Motor Company
- Hiyoshi Michiaki
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CONDUCTIVE PASTE, ELECTRODE CONNECTION STRUCTURE, AND ELECTRODE CON...
- Publication number 20190157229
- Publication date May 23, 2019
- SHARP KABUSHIKI KAISHA
- Tomotoshi SATOH
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE WITH POST PASSIVATION STRUCTURE
- Publication number 20190148322
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gulbagh SINGH
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES
- Publication number 20190006312
- Publication date Jan 3, 2019
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL NANORIBBON ARRAY (VERNA) THERMAL INTERFACE MATERIALS WITH...
- Publication number 20180342405
- Publication date Nov 29, 2018
- Northrop Grumman Systems Corporation
- John A. Starkovich
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Temperature range 250 C=<T<300 C, 523.15K =<T< 573.15K

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process flow for fabrication of cap metal over top metal with sinte...

Low pressure sintering powder

Redistribution layer and integrated circuit including redistributio...

Semiconductor structure including buffer layer

3DIC formation with dies bonded to formed RDLs

Method of manufacturing a redistribution layer, redistribution laye...

Joining material and joining method using same

Method of manufacturing semiconductor device

Method of fabricating high-power module

Package and manufacturing method thereof

Sintering materials and attachment methods using same

Method of designing a layout, method of making a semiconductor stru...

Lead-free solder joining of electronic structures

3DIC formation with dies bonded to formed RDLs

Semiconductor device production method

Low pressure sintering powder

Flip chip bonding method

Method of bonding semiconductor substrates

Multi-layered composite bonding materials and power electronics ass...

Semiconductor device with post passivation structure

Solid-state wafer bonding of functional materials on substrates and...

Method of determining curing conditions, method of producing circui...

Conductive paste having dilatancy, electrode connection structure i...

Conductive paste and die bonding method

Lead-free solder joining of electronic structures

Carrier-bonding methods and articles for semiconductor and interpos...

Adhesive composition, electronic-component-mounted substrate and se...

Solder paste

No clean flux composition and methods for use thereof

Method for processing a die

Patents Applicationslast 30 patents

LOW PRESSURE SINTERING POWDER

SEMICONDUCTOR DEVICE INCLUDING STRESS CONTROL LAYER AND METHODS OF...

SEMICONDUCTOR DEVICE

SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...

SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE

SUBSTRATE BONDING METHOD

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Die Bonding Pads and Methods of Forming the Same

AG PASTE COMPOSITION AND BONDING FILM PRODUCED USING SAME

SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...

PACKAGE AND MANUFACTURING METHOD THEREOF

METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...

METHOD FOR PRODUCING A CIRCUIT CARRIER, CIRCUIT CARRIER, METHOD FOR...

PACKAGE AND MANUFACTURING METHOD THEREOF

PROCESS FLOW FOR FABRICATION OF CAP METAL OVER TOP METAL WITH SINTE...

Method of Fabricating High-Power Module

LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES

FLIP CHIP BONDING METHOD

METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...

SEMICONDUCTOR DEVICE PRODUCTION METHOD

METHOD OF DETERMINING CURING CONDITIONS, METHOD OF PRODUCING CIRCUI...

SINTERING BONDING METHOD FOR SEMICONDUCTOR DEVICE

CONDUCTIVE PASTE, ELECTRODE CONNECTION STRUCTURE, AND ELECTRODE CON...

SEMICONDUCTOR DEVICE WITH POST PASSIVATION STRUCTURE

LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES

VERTICAL NANORIBBON ARRAY (VERNA) THERMAL INTERFACE MATERIALS WITH...