Temperature range 60 C=<T<100 C, 333.15 K =< T< 373.15K

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CPC
H01L2924/20103

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/20103Temperature range 60 C=<T<100 C, 333.15 K =< T< 373.15K

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Redistribution layer and integrated circuit including redistributio...
- Patent number 12,021,046
- Issue date Jun 25, 2024
- STMicroelectronics S.r.l.
- Paolo Colpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting method and mounting device
- Patent number 11,495,571
- Issue date Nov 8, 2022
- Toray Engineering Co., Ltd.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a redistribution layer, redistribution laye...
- Patent number 11,469,194
- Issue date Oct 11, 2022
- STMicroelectronics S.r.l.
- Paolo Colpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for connecting components
- Patent number 11,355,472
- Issue date Jun 7, 2022
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary bonding scheme
- Patent number 11,328,972
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film-shaped firing material and film-shaped firing material with su...
- Patent number 11,267,992
- Issue date Mar 8, 2022
- Lintec Corporation
- Isao Ichikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Lead-free solder joining of electronic structures
- Patent number 11,043,468
- Issue date Jun 22, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,004,817
- Issue date May 11, 2021
- SOCIONEXT INC.
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 10,998,284
- Issue date May 4, 2021
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Adhesive film for semiconductor
- Patent number 10,865,329
- Issue date Dec 15, 2020
- LG Chem, Ltd.
- Hee Jung Kim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesive composition for semiconductor, adhesive film for semicondu...
- Patent number 10,759,971
- Issue date Sep 1, 2020
- LG Chem, Ltd.
- Hee Jung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dye and pry process for removing quad flat no-lead packages and bot...
- Patent number 10,593,601
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Tim A. Bartsch
- G01 - MEASURING TESTING
Information Patent Grant
Lead-free solder joining of electronic structures
- Patent number 10,586,782
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,312,216
- Issue date Jun 4, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,297,568
- Issue date May 21, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dye and pry process for removing quad flat no-lead packages and bot...
- Patent number 10,262,907
- Issue date Apr 16, 2019
- International Business Machines Corporation
- Tim A. Bartsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor and manufacturing method thereof
- Patent number 10,242,963
- Issue date Mar 26, 2019
- National Tsing Hua University
- Yu-Lin Wang
- G01 - MEASURING TESTING
Information Patent Grant
Temporary bonding scheme
- Patent number 10,170,387
- Issue date Jan 1, 2019
- Taiwan Semiconductor Manufacturing Company
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal etchant compositions and methods of fabricating a semiconduct...
- Patent number 10,155,903
- Issue date Dec 18, 2018
- Samsung Electronics Co., Ltd.
- Hyosan Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for permanent bonding of wafers
- Patent number 10,083,933
- Issue date Sep 25, 2018
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure for semiconductor package and method of manufactu...
- Patent number 9,984,993
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 9,905,530
- Issue date Feb 27, 2018
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,893,029
- Issue date Feb 13, 2018
- SOCIONEXT INC.
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, electronic part, and solder
- Patent number 9,831,199
- Issue date Nov 28, 2017
- Fujitsu Limited
- Taiki Uemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced cleaning for water-soluble flux soldering
- Patent number 9,818,717
- Issue date Nov 14, 2017
- International Business Machines Corporation
- Charles C. Bureau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material and method for manufacturing semiconductor devic...
- Patent number 9,691,677
- Issue date Jun 27, 2017
- Dexerials Corporation
- Taichi Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic device including an interposer structure and...
- Patent number 9,673,172
- Issue date Jun 6, 2017
- Elta Systems Ltd.
- Yaniv Maydar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material and method for manufacturing semiconductor devic...
- Patent number 9,653,371
- Issue date May 16, 2017
- Dexerials Corporation
- Hironobu Moriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 9,633,981
- Issue date Apr 25, 2017
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...
- Publication number 20240404988
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...
- Publication number 20240404989
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...
- Publication number 20230230950
- Publication date Jul 20, 2023
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Yuechen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...
- Publication number 20230005848
- Publication date Jan 5, 2023
- STMicroelectronics S.r.l.
- Paolo COLPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-SHAPED FIRING MATERIAL AND FILM-SHAPED FIRING MATERIAL WITH SU...
- Publication number 20200277515
- Publication date Sep 3, 2020
- LINTEC CORPORATION
- Isao ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES
- Publication number 20200161272
- Publication date May 21, 2020
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...
- Publication number 20200051935
- Publication date Feb 13, 2020
- STMicroelectronics S.r.l.
- Michele MOLGG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR CONNECTING COMPONENTS
- Publication number 20190252345
- Publication date Aug 15, 2019
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVER FILM AND APPLICATION THEREOF
- Publication number 20190244927
- Publication date Aug 8, 2019
- TAIFLEX SCIENTIFIC CO., LTD.
- Sheng-Chin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Temporary Bonding Scheme
- Publication number 20190139850
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES
- Publication number 20190006312
- Publication date Jan 3, 2019
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT BONDING OF WAFERS
- Publication number 20190006313
- Publication date Jan 3, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF INTERCONNECT FOR HIGH DENSITY 2.5D AND 3D INTEGRATION
- Publication number 20180286826
- Publication date Oct 4, 2018
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180182733
- Publication date Jun 28, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180122760
- Publication date May 3, 2018
- SOCIONEXT INC.
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180026006
- Publication date Jan 25, 2018
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED CLEANING FOR WATER-SOLUBLE FLUX SOLDERING
- Publication number 20180005975
- Publication date Jan 4, 2018
- International Business Machines Corporation
- Charles C. Bureau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED CLEANING FOR WATER-SOLUBLE FLUX SOLDERING
- Publication number 20170243852
- Publication date Aug 24, 2017
- International Business Machines Corporation
- Charles C. Bureau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20170179072
- Publication date Jun 22, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC PART, AND SOLDER
- Publication number 20170125366
- Publication date May 4, 2017
- Fujitsu Limited
- Taiki Uemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PAC...
- Publication number 20160260657
- Publication date Sep 8, 2016
- Shindengen Electric Manufacturing Co., Ltd.
- Yuichi MIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20160254252
- Publication date Sep 1, 2016
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20160240503
- Publication date Aug 18, 2016
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL ETCHANT COMPOSITIONS AND METHODS OF FABRICATING A SEMICONDUCT...
- Publication number 20160204001
- Publication date Jul 14, 2016
- Hyosan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-Temperature Bonding and Sealing With Spaced Nanorods
- Publication number 20160172327
- Publication date Jun 16, 2016
- University of Connecticut
- Stephen P. Stagon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE DIE ATTACH FILM FOR LARGE DIE SEMICONDUCTOR PACKAGES AND...
- Publication number 20160148894
- Publication date May 26, 2016
- Henkel IP & Holding GmbH
- Pukun Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT BONDING OF WAFERS
- Publication number 20160111394
- Publication date Apr 21, 2016
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVIC...
- Publication number 20150348858
- Publication date Dec 3, 2015
- DEXERIALS CORPORATION
- Taichi KOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVIC...
- Publication number 20150348859
- Publication date Dec 3, 2015
- DEXERIALS CORPORATION
- Hironobu Moriyama
- H01 - BASIC ELECTRIC ELEMENTS

Temperature range 60 C=<T<100 C, 333.15 K =< T< 373.15K

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low pressure sintering powder

Redistribution layer and integrated circuit including redistributio...

Mounting method and mounting device

Method of manufacturing a redistribution layer, redistribution laye...

Package structure and method for connecting components

Temporary bonding scheme

Film-shaped firing material and film-shaped firing material with su...

Lead-free solder joining of electronic structures

Semiconductor device and method for manufacturing the same

Low pressure sintering powder

Adhesive film for semiconductor

Adhesive composition for semiconductor, adhesive film for semicondu...

Dye and pry process for removing quad flat no-lead packages and bot...

Lead-free solder joining of electronic structures

Systems and methods for bonding semiconductor elements

Systems and methods for bonding semiconductor elements

Dye and pry process for removing quad flat no-lead packages and bot...

Sensor and manufacturing method thereof

Temporary bonding scheme

Metal etchant compositions and methods of fabricating a semiconduct...

Method for permanent bonding of wafers

Bonding structure for semiconductor package and method of manufactu...

Systems and methods for bonding semiconductor elements

Semiconductor device and method for manufacturing the same

Electronic device, electronic part, and solder

Enhanced cleaning for water-soluble flux soldering

Underfill material and method for manufacturing semiconductor devic...

Integrated electronic device including an interposer structure and...

Underfill material and method for manufacturing semiconductor devic...

Systems and methods for bonding semiconductor elements

Patents Applicationslast 30 patents

LOW PRESSURE SINTERING POWDER

FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...

PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...

SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...

METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...

FILM-SHAPED FIRING MATERIAL AND FILM-SHAPED FIRING MATERIAL WITH SU...

LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES

METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...

PACKAGE STRUCTURE AND METHOD FOR CONNECTING COMPONENTS

COVER FILM AND APPLICATION THEREOF

Temporary Bonding Scheme

LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES

METHOD FOR PERMANENT BONDING OF WAFERS

METHODS OF INTERCONNECT FOR HIGH DENSITY 2.5D AND 3D INTEGRATION

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

ENHANCED CLEANING FOR WATER-SOLUBLE FLUX SOLDERING

ENHANCED CLEANING FOR WATER-SOLUBLE FLUX SOLDERING

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

ELECTRONIC DEVICE, ELECTRONIC PART, AND SOLDER

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PAC...

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

BONDING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

METAL ETCHANT COMPOSITIONS AND METHODS OF FABRICATING A SEMICONDUCT...

Low-Temperature Bonding and Sealing With Spaced Nanorods

CONDUCTIVE DIE ATTACH FILM FOR LARGE DIE SEMICONDUCTOR PACKAGES AND...

METHOD FOR PERMANENT BONDING OF WAFERS

UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVIC...

UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVIC...