Temperature range T<0 C, T<273.15 K

Industry

CPC
H01L2924/20101

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/20101Temperature range T<0 C, T<273.15 K

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,004,817
- Issue date May 11, 2021
- SOCIONEXT INC.
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,893,029
- Issue date Feb 13, 2018
- SOCIONEXT INC.
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic device including an interposer structure and...
- Patent number 9,673,172
- Issue date Jun 6, 2017
- Elta Systems Ltd.
- Yaniv Maydar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming openings and trenches i...
- Patent number 9,607,958
- Issue date Mar 28, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of integration of wafer level heat spreaders and backside in...
- Patent number 9,337,124
- Issue date May 10, 2016
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming openings and trenches i...
- Patent number 8,900,929
- Issue date Dec 2, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE FOR AN ELECTRONIC CHIP
- Publication number 20230371167
- Publication date Nov 16, 2023
- CENTRE NATIONAL D'ETUDES SPATIALES
- Pascal FEBVRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF INTERCONNECT FOR HIGH DENSITY 2.5D AND 3D INTEGRATION
- Publication number 20180286826
- Publication date Oct 4, 2018
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180122760
- Publication date May 3, 2018
- SOCIONEXT INC.
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AN INTEGRATED ELECTRONIC DEVICE INCLUDING AN INTERPOSER STRUCTURE A...
- Publication number 20150303173
- Publication date Oct 22, 2015
- ELTA SYSTEMS LTD.
- Yaniv MAYDAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Method for Fabricating an Electronic Device
- Publication number 20150214204
- Publication date Jul 30, 2015
- INFINEON TECHNOLOGIES AG
- Manfred Schindler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-STEP METHOD FOR JOINING A SEMICONDUCTOR TO A SUBSTRATE WITH CON...
- Publication number 20150123263
- Publication date May 7, 2015
- ROBERT BOSCH GmbH
- Christiane Frueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150118841
- Publication date Apr 30, 2015
- FUJITSU SEMICONDUCTOR LIMITED
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming Openings and Trenches i...
- Publication number 20150061123
- Publication date Mar 5, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming Openings and Trenches i...
- Publication number 20130249080
- Publication date Sep 26, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110156248
- Publication date Jun 30, 2011
- FUJITSU SEMICONDUCTOR LIMITED
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS

Temperature range T<0 C, T<273.15 K

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Integrated electronic device including an interposer structure and...

Semiconductor device and method for forming openings and trenches i...

Method of integration of wafer level heat spreaders and backside in...

Semiconductor device and method for forming openings and trenches i...

Patents Applicationslast 30 patents

SUBSTRATE FOR AN ELECTRONIC CHIP

METHODS OF INTERCONNECT FOR HIGH DENSITY 2.5D AND 3D INTEGRATION

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

AN INTEGRATED ELECTRONIC DEVICE INCLUDING AN INTERPOSER STRUCTURE A...

Electronic Device and Method for Fabricating an Electronic Device

TWO-STEP METHOD FOR JOINING A SEMICONDUCTOR TO A SUBSTRATE WITH CON...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Device and Method for Forming Openings and Trenches i...

Semiconductor Device and Method for Forming Openings and Trenches i...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME