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H01L2224/83095

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83095Temperature settings

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,776,932
- Issue date Oct 3, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electrical connecting structure having nano-twins copper
- Patent number 11,715,721
- Issue date Aug 1, 2023
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 11,710,719
- Issue date Jul 25, 2023
- Sumitomo Electric Device Innovations, Inc.
- Taketo Kawano
- G02 - OPTICS
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,626,383
- Issue date Apr 11, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of dismantling a stack of at least three substrates
- Patent number 11,335,584
- Issue date May 17, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Pierre Montmeat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof with Cu and S...
- Patent number 11,195,815
- Issue date Dec 7, 2021
- Denso Corporation
- Takuya Kadoguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connecting structure having nano-twins copper and method...
- Patent number 11,145,619
- Issue date Oct 12, 2021
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 11,088,042
- Issue date Aug 10, 2021
- Hitachi Metals, Ltd.
- Hisashi Tanie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for improved die bonding
- Patent number 10,756,048
- Issue date Aug 25, 2020
- Skyworks Solutions, Inc.
- José Manuel Flores
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for improved die bonding
- Patent number 10,199,351
- Issue date Feb 5, 2019
- Skyworks Solutions, Inc.
- José Manuel Flores
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room temperature metal direct bonding
- Patent number 10,141,218
- Issue date Nov 27, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer bonding structure and wafer bonding method
- Patent number 10,121,762
- Issue date Nov 6, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fu Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanomicrocrystallite paste for pressureless sintering
- Patent number 9,875,983
- Issue date Jan 23, 2018
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and chip assembly
- Patent number 9,530,754
- Issue date Dec 27, 2016
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room temperature metal direct bonding
- Patent number 9,385,024
- Issue date Jul 5, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Jointed structure and method of manufacturing same
- Patent number 9,349,704
- Issue date May 24, 2016
- Kabushiki Kaisha Toyota Chuo Kenkyusho
- Tadashi Oshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micromechanical method and corresponding assembly for bonding semic...
- Patent number 8,638,000
- Issue date Jan 28, 2014
- Robert Bosch GmbH
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Room temperature metal direct bonding
- Patent number 8,524,533
- Issue date Sep 3, 2013
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component bonding method and apparatus using vibration e...
- Patent number 8,287,670
- Issue date Oct 16, 2012
- Korea Advanced Institute of Science and Technology
- Kyung-Soo Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacture thereof, circuit boa...
- Patent number 7,868,466
- Issue date Jan 11, 2011
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room temperature metal direct bonding
- Patent number 7,842,540
- Issue date Nov 30, 2010
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature metal direct bonding
- Patent number 7,602,070
- Issue date Oct 13, 2009
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacture thereof, circuit boa...
- Patent number 7,560,819
- Issue date Jul 14, 2009
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacture thereof, circuit boa...
- Patent number 7,332,371
- Issue date Feb 19, 2008
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacture thereof, circuit boa...
- Patent number 7,198,984
- Issue date Apr 3, 2007
- Seiko Epson Corporation
- Nobuaki Hasimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, circuit board and electronic instrument that...
- Patent number 6,995,476
- Issue date Feb 7, 2006
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacture thereof, circuit boa...
- Patent number 6,972,381
- Issue date Dec 6, 2005
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for room temperature metal direct bonding
- Patent number 6,962,835
- Issue date Nov 8, 2005
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacture thereof, circuit boa...
- Patent number 6,763,994
- Issue date Jul 20, 2004
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of packaging semiconductor device using anisotropic conducti...
- Patent number 6,498,051
- Issue date Dec 24, 2002
- Citizen Watch Co., Ltd.
- Makoto Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240164118
- Publication date May 16, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuaki TSUCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAG...
- Publication number 20230326948
- Publication date Oct 12, 2023
- Samsung Electronics Co., Ltd.
- Wenjun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230115289
- Publication date Apr 13, 2023
- Mitsubishi Electric Corporation
- Koji YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER
- Publication number 20210407960
- Publication date Dec 30, 2021
- National Yang Ming Chiao Tung University
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20210313297
- Publication date Oct 7, 2021
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Taketo KAWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING
- Publication number 20210104488
- Publication date Apr 8, 2021
- DANFOSS SILICON POWER GMBH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER AND METHOD...
- Publication number 20210020599
- Publication date Jan 21, 2021
- NATIONAL CHIAO-TUNG UNIVERSITY
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200227380
- Publication date Jul 16, 2020
- Toyota Jidosha Kabushiki Kaisha
- Takuya KADOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20200203241
- Publication date Jun 25, 2020
- Hitachi Metals, Ltd.
- Hisashi TANIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR IMPROVED DIE BONDING
- Publication number 20200006283
- Publication date Jan 2, 2020
- SKYWORKS SOLUTIONS, INC.
- José Manuel FLORES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20190115247
- Publication date Apr 18, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER BONDING STRUCTURE AND WAFER BONDING METHOD
- Publication number 20180151535
- Publication date May 31, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fu Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOMICROCRYSTALLITE PASTE FOR PRESSURELESS SINTERING
- Publication number 20170317046
- Publication date Nov 2, 2017
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING
- Publication number 20170229424
- Publication date Aug 10, 2017
- DANFOSS SILICON POWER GMBH
- Ronald Eisele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PROCESS USING TEMPERATURE CONTROLLED CURVATURE CHANGE
- Publication number 20160204078
- Publication date Jul 14, 2016
- International Business Machines Corporation
- Stephen W. Bedell
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR TERNARY WAFER BONDING AND STRUCTURE THEREOF
- Publication number 20150294950
- Publication date Oct 15, 2015
- National Central University
- CHENG-YI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINTED STRUCTURE AND METHOD OF MANUFACTURING SAME
- Publication number 20150270238
- Publication date Sep 24, 2015
- KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
- Tadashi OSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS
- Publication number 20150060898
- Publication date Mar 5, 2015
- Reactive NanoTechnologies, Inc
- David Van Heerden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20140370658
- Publication date Dec 18, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20130233473
- Publication date Sep 12, 2013
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Micromechanical Method and Corresponding Assembly for Bonding Semic...
- Publication number 20120280409
- Publication date Nov 8, 2012
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS
- Publication number 20110089462
- Publication date Apr 21, 2011
- David Van Heerden
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20110041329
- Publication date Feb 24, 2011
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT BONDING METHOD AND APPARATUS USING VIBRATION E...
- Publication number 20100206457
- Publication date Aug 19, 2010
- Korea Advanced Institute of Science and Technology (KAIST)
- Kyung-Soo KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of manufacture thereof, circuit boa...
- Publication number 20080128921
- Publication date Jun 5, 2008
- SEIKO EPSON CORPORATION
- Nobuaki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20070232023
- Publication date Oct 4, 2007
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF, CIRCUIT BOA...
- Publication number 20070132099
- Publication date Jun 14, 2007
- SEIKO EPSON CORPORATION
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of manufacture thereof, circuit boa...
- Publication number 20060172460
- Publication date Aug 3, 2006
- SEIKO EPSON CORPORATION
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of manufacture thereof, circuit boa...
- Publication number 20060099739
- Publication date May 11, 2006
- SEIKO EPSON CORPORATION
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Room temperature metal direct bonding
- Publication number 20050161795
- Publication date Jul 28, 2005
- Ziptronix
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Temperature settings

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process and device for low-temperature pressure sintering

Electrical connecting structure having nano-twins copper

Method for manufacturing electronic device

Process and device for low-temperature pressure sintering

Method of dismantling a stack of at least three substrates

Semiconductor device and manufacturing method thereof with Cu and S...

Electrical connecting structure having nano-twins copper and method...

Semiconductor device and production method therefor

Methods for improved die bonding

Method and device for improved die bonding

Room temperature metal direct bonding

Wafer bonding structure and wafer bonding method

Nanomicrocrystallite paste for pressureless sintering

Chip package and chip assembly

Room temperature metal direct bonding

Jointed structure and method of manufacturing same

Micromechanical method and corresponding assembly for bonding semic...

Room temperature metal direct bonding

Electronic component bonding method and apparatus using vibration e...

Semiconductor device and method of manufacture thereof, circuit boa...

Room temperature metal direct bonding

Room temperature metal direct bonding

Semiconductor device and method of manufacture thereof, circuit boa...

Semiconductor device and method of manufacture thereof, circuit boa...

Semiconductor device and method of manufacture thereof, circuit boa...

Semiconductor device, circuit board and electronic instrument that...

Semiconductor device and method of manufacture thereof, circuit boa...

Method for room temperature metal direct bonding

Semiconductor device and method of manufacture thereof, circuit boa...

Method of packaging semiconductor device using anisotropic conducti...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAG...

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING

ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER AND METHOD...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

METHODS FOR IMPROVED DIE BONDING

ROOM TEMPERATURE METAL DIRECT BONDING

WAFER BONDING STRUCTURE AND WAFER BONDING METHOD

NANOMICROCRYSTALLITE PASTE FOR PRESSURELESS SINTERING

PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING

BONDING PROCESS USING TEMPERATURE CONTROLLED CURVATURE CHANGE

METHOD FOR TERNARY WAFER BONDING AND STRUCTURE THEREOF

JOINTED STRUCTURE AND METHOD OF MANUFACTURING SAME

METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS

ROOM TEMPERATURE METAL DIRECT BONDING

ROOM TEMPERATURE METAL DIRECT BONDING

Micromechanical Method and Corresponding Assembly for Bonding Semic...

METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS

ROOM TEMPERATURE METAL DIRECT BONDING

ELECTRONIC COMPONENT BONDING METHOD AND APPARATUS USING VIBRATION E...

Semiconductor device and method of manufacture thereof, circuit boa...

ROOM TEMPERATURE METAL DIRECT BONDING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF, CIRCUIT BOA...

Semiconductor device and method of manufacture thereof, circuit boa...

Semiconductor device and method of manufacture thereof, circuit boa...

Room temperature metal direct bonding