Temperature settings

Industry

CPC
H01L2224/81095

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81095Temperature settings

Industries

Patents Grantslast 30 patents

Information Patent Grant
Die bonding with liquid phase solder
- Patent number 10,014,272
- Issue date Jul 3, 2018
- ASM Technology Singapore Pte. Ltd.
- Dewen Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for semiconductor device production, method for producing film...
- Patent number 9,761,475
- Issue date Sep 12, 2017
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,443,790
- Issue date Sep 13, 2016
- PS4 Luxco S.A.R.L.
- Osamu Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 9,129,840
- Issue date Sep 8, 2015
- Fuji Electric Co., Ltd.
- Norihiro Nashida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and encapsulant for flip-chip assembly
- Patent number 9,064,820
- Issue date Jun 23, 2015
- MEKIEC MANUFACTURING CORPORATION (THAILAND) LTD
- Sathid Jitjongruck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for semiconductor device production, method for producing film...
- Patent number 8,986,486
- Issue date Mar 24, 2015
- Nitto Denko Corporation
- Naohide Takamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device
- Patent number 8,659,152
- Issue date Feb 25, 2014
- Osamu Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with warpage control and method...
- Patent number 8,455,991
- Issue date Jun 4, 2013
- Stats Chippac Ltd.
- Yung Kuan Hsiao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312868
- Publication date Sep 19, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CONNECTION STRUCTURE, ROOM-TEMPERATURE FLIP CONNECTION STRUCTU...
- Publication number 20240145428
- Publication date May 2, 2024
- Sony Semiconductor Solutions Corporation
- KAZUHIDE TERAHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20150123270
- Publication date May 7, 2015
- Kabushiki Kaisha Toshiba
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND ENCAPSULANT FOR FLIP-CHIP ASSEMBLY
- Publication number 20150054154
- Publication date Feb 26, 2015
- MEKTEC MANUFACTURING CORPORATION (THAILAND) LTD
- Sathid Jitjongruck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140361445
- Publication date Dec 11, 2014
- Norihiro NASHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140217560
- Publication date Aug 7, 2014
- Elpida Memory, Inc.
- Osamu FUJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE CONTROL AND METHOD...
- Publication number 20120074588
- Publication date Mar 29, 2012
- Yung Kuan Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120061827
- Publication date Mar 15, 2012
- Elpida Memory, Inc.
- Osamu FUJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR SEMICONDUCTOR DEVICE PRODUCTION, METHOD FOR PRODUCING FILM...
- Publication number 20120024469
- Publication date Feb 2, 2012
- Nitto Denko Corporation
- Naohide TAKAMOTO
- B32 - LAYERED PRODUCTS

Temperature settings

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Die bonding with liquid phase solder

Film for semiconductor device production, method for producing film...

Semiconductor device

Semiconductor device and method for manufacturing same

Method and encapsulant for flip-chip assembly

Film for semiconductor device production, method for producing film...

Semiconductor device

Integrated circuit packaging system with warpage control and method...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

FLIP CONNECTION STRUCTURE, ROOM-TEMPERATURE FLIP CONNECTION STRUCTU...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

METHOD AND ENCAPSULANT FOR FLIP-CHIP ASSEMBLY

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE CONTROL AND METHOD...

SEMICONDUCTOR DEVICE

FILM FOR SEMICONDUCTOR DEVICE PRODUCTION, METHOD FOR PRODUCING FILM...