Temporary protective insulating layer

Industry

CPC
H05K2203/1383

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1383Temporary protective insulating layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing shielded printed wiring board and shielded...
- Patent number 12,150,239
- Issue date Nov 19, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Sirou Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making interconnect substrate and insulating sheet
- Patent number 11,612,063
- Issue date Mar 21, 2023
- Shinko Electric Industries Co., Ltd.
- Tomoaki Machida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device fabric integration
- Patent number 11,360,512
- Issue date Jun 14, 2022
- Intel Corporation
- Nadine L. Dabby
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing the printed board
- Patent number 11,229,123
- Issue date Jan 18, 2022
- Nichia Corporation
- Masaaki Katsumata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for treating millimetre and/or micrometre and/or nanometre s...
- Patent number 11,027,481
- Issue date Jun 8, 2021
- EV Group E. Thallner GmbH
- Gerald Mittendorfer
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 10,993,327
- Issue date Apr 27, 2021
- Avary Holding (Shenzhen) Co., Limited.
- Lin-Jie Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming conductive vias using a light guide
- Patent number 10,712,664
- Issue date Jul 14, 2020
- International Business Machines Corporation
- Gerald Bartley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing conductive line
- Patent number 10,615,054
- Issue date Apr 7, 2020
- Unimicron Technology Corp.
- Shih-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of masking and de-masking
- Patent number 10,448,519
- Issue date Oct 15, 2019
- HZO, INC.
- Joshua Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Use of combined masking techniques and/or combined material removal...
- Patent number 10,098,236
- Issue date Oct 9, 2018
- HZO, INC.
- Vimal Kumar Kasagani
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Manufacturing method of double sided printed circuit board
- Patent number 10,080,299
- Issue date Sep 18, 2018
- INKTEC CO., LTD.
- Kwang-Choon Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of multilayer printed wiring board
- Patent number 10,004,148
- Issue date Jun 19, 2018
- Nippon Mektron, Ltd.
- Shoji Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self-decap cavity fabrication process and structure
- Patent number 9,999,134
- Issue date Jun 12, 2018
- Multek Technologies Limited
- Mark Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Work pieces and methods of laser drilling through holes in substrat...
- Patent number 9,953,912
- Issue date Apr 24, 2018
- Corning Incorporated
- Uta-Barbara Goers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and package substrate
- Patent number 9,867,296
- Issue date Jan 9, 2018
- LG Innotek Co., Ltd
- Dong Sun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting substrate, manufacturing method for the same, and componen...
- Patent number 9,814,139
- Issue date Nov 7, 2017
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Toshihiko Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of multilayer printed wiring board
- Patent number 9,788,439
- Issue date Oct 10, 2017
- Nippon Mektron, Ltd.
- Shoji Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support body, method of manufacturing support body, method of manuf...
- Patent number 9,763,332
- Issue date Sep 12, 2017
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of providing a flexible semiconductor device and flexible se...
- Patent number 9,721,825
- Issue date Aug 1, 2017
- Arizona Board of Regents, a body corporate of the State of Arizona, acting fo...
- Michael A. Marrs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded printed circuit board
- Patent number 9,629,248
- Issue date Apr 18, 2017
- LG Innotek Co., Ltd
- Deok Soon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board, method for manufacturing printed wiring board...
- Patent number 9,578,745
- Issue date Feb 21, 2017
- Ibiden Co., Ltd.
- Kazuhiro Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Line width protector printed circuit board and method of manufactur...
- Patent number 9,386,706
- Issue date Jul 5, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sung Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of preparing a flexible substrate assembly and flexible subs...
- Patent number 9,155,190
- Issue date Oct 6, 2015
- AZ Board of Regents, a body corporate of the State of AZ Acting for and on be...
- Jesmin Haq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Strippable adhesion composition and uses thereof
- Patent number 9,115,298
- Issue date Aug 25, 2015
- Chi Mei Corporation
- Kuang-Chieh Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 9,107,332
- Issue date Aug 11, 2015
- Zhen Ding Technology Co., Ltd.
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 9,107,329
- Issue date Aug 11, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Chang Bo Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabricating method of circuit board and circuit board
- Patent number 9,066,458
- Issue date Jun 23, 2015
- Via Technologies, Inc.
- Chen-Yueh Kung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer printed circuit board having mo...
- Patent number 8,850,701
- Issue date Oct 7, 2014
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Xue-Jun Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded structure
- Patent number 8,729,397
- Issue date May 20, 2014
- Unimicron Technology Corp.
- Yi-Chun Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photonic heating of silver grids
- Patent number 8,722,322
- Issue date May 13, 2014
- Eastman Kodak Company
- Donald R. Preuss
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20230007785
- Publication date Jan 5, 2023
- Nitto Denko Corporation
- Kenya TAKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING INTERCONNECT SUBSTRATE AND INSULATING SHEET
- Publication number 20220046805
- Publication date Feb 10, 2022
- Shinko Electric Industries Co., Ltd.
- Tomoaki MACHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Manufacturing Shielded Printed Wiring Board and Shielded...
- Publication number 20210410272
- Publication date Dec 30, 2021
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Sirou YAMAUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200413544
- Publication date Dec 31, 2020
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WORK PIECES AND METHODS OF LASER DRILLING THROUGH HOLES IN SUBSTRAT...
- Publication number 20180204792
- Publication date Jul 19, 2018
- Corning Incorporated
- Uta-Barbara Goers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILA...
- Publication number 20170367197
- Publication date Dec 21, 2017
- NIPPON MEKTRON, LTD.
- Shoji Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WORK PIECES AND METHODS OF LASER DRILLING THROUGH HOLES IN SUBSTRAT...
- Publication number 20160322291
- Publication date Nov 3, 2016
- Corning Incorporated
- Uta-Barbara Goers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILA...
- Publication number 20160295707
- Publication date Oct 6, 2016
- NIPPON MEKTRON, LTD.
- Shoji TAKANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPPORT BODY, METHOD OF MANUFACTURING SUPPORT BODY, METHOD OF MANUF...
- Publication number 20160066433
- Publication date Mar 3, 2016
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTIVE FILM WITH DYE MATERIALS FOR LASER ABSORPTION ENHANCEMENT...
- Publication number 20140299356
- Publication date Oct 9, 2014
- Chong Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROVIDING AN ELECTRONIC DEVICE STRUCTURE AND RELATED ELEC...
- Publication number 20140254113
- Publication date Sep 11, 2014
- Arizona Board of Regents, a body corporate of the State of Arizona Acting for...
- Emmett Howard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRIPPABLE ADHESION COMPOSITION AND USES THEREOF
- Publication number 20140162060
- Publication date Jun 12, 2014
- CHI MEI CORPORATION
- Kuang-Chieh LI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRINTED CIRCUIT BAORD AND METHOD FOR MANUFACTURING SAME
- Publication number 20140054075
- Publication date Feb 27, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- WEN-HUNG HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPPORT BODY, METHOD OF MANUFACTURING SUPPORT BODY, METHOD OF MANUF...
- Publication number 20140020931
- Publication date Jan 23, 2014
- Kazuhiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Preparing A Flexible Substrate Assembly And Flexible Subs...
- Publication number 20130271930
- Publication date Oct 17, 2013
- Arizona Board of Regents, a body corporate of the State of Arizona Acting for...
- Jesmin Haq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATING METHOD OF CIRCUIT BOARD AND CIRCUIT BOARD
- Publication number 20130213692
- Publication date Aug 22, 2013
- VIA TECHNOLOGIES, INC.
- Chen-Yueh Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC HEATING OF SILVER GRIDS
- Publication number 20130196269
- Publication date Aug 1, 2013
- Donald R. Preuss
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130146343
- Publication date Jun 13, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Su Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20120285924
- Publication date Nov 15, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chang Bo LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20120204424
- Publication date Aug 16, 2012
- Shinko Electric Industries Co., Ltd.
- Yuji YUKIIRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ENHANCING METALLIZATION IN SELECTIVE DEPOSITION PROCESSES
- Publication number 20120196039
- Publication date Aug 2, 2012
- CAMTEK LTD
- Muhammad Iraqi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20120160803
- Publication date Jun 28, 2012
- ZHEN DING TECHNOLOGY CO., LTD.
- XUE-JUN CAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20120144666
- Publication date Jun 14, 2012
- Shinko Electric Industries Co., Ltd.
- Yuji YUKIIRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED STRUCTURE
- Publication number 20120085569
- Publication date Apr 12, 2012
- Yi-Chun Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING WIRING BOARD
- Publication number 20120085730
- Publication date Apr 12, 2012
- Fujitsu Limited
- Shinya SASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCT HAVING THROUGH-HOLE AND LASER PROCESSING METHOD
- Publication number 20110318530
- Publication date Dec 29, 2011
- Sumitomo Electric Industries, Ltd.
- Hidehiko MISHIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PREPARING A FLEXIBLE SUBSTRATE ASSEMBLY AND FLEXIBLE SUBS...
- Publication number 20110228492
- Publication date Sep 22, 2011
- Arizona Board of Regents, for and on behalf of Arizona State University
- Jesmin Haq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A SUBSTRATE FOR A MICROELECTRONIC DEVICE, A...
- Publication number 20110135883
- Publication date Jun 9, 2011
- Houssam Jomaa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING THROUGH HOLE AND PRODUCT WITH THE FORMED THROUGH...
- Publication number 20110003114
- Publication date Jan 6, 2011
- Susumu Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer ceramic board and manufacturing method thereof
- Publication number 20100300733
- Publication date Dec 2, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Yong Suk Kim
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Temporary protective insulating layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing shielded printed wiring board and shielded...

Method of making interconnect substrate and insulating sheet

Electronic device fabric integration

Method of manufacturing the printed board

Method for treating millimetre and/or micrometre and/or nanometre s...

Circuit board and method for manufacturing the same

Forming conductive vias using a light guide

Method for manufacturing conductive line

Method of masking and de-masking

Use of combined masking techniques and/or combined material removal...

Manufacturing method of double sided printed circuit board

Manufacturing method of multilayer printed wiring board

Self-decap cavity fabrication process and structure

Work pieces and methods of laser drilling through holes in substrat...

Printed circuit board and package substrate

Mounting substrate, manufacturing method for the same, and componen...

Manufacturing method of multilayer printed wiring board

Support body, method of manufacturing support body, method of manuf...

Method of providing a flexible semiconductor device and flexible se...

Embedded printed circuit board

Printed wiring board, method for manufacturing printed wiring board...

Line width protector printed circuit board and method of manufactur...

Method of preparing a flexible substrate assembly and flexible subs...

Strippable adhesion composition and uses thereof

Method for manufacturing printed circuit board

Method for manufacturing printed circuit board

Fabricating method of circuit board and circuit board

Method for manufacturing multilayer printed circuit board having mo...

Embedded structure

Photonic heating of silver grids

Patents Applicationslast 30 patents

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

METHOD OF MAKING INTERCONNECT SUBSTRATE AND INSULATING SHEET

Method for Manufacturing Shielded Printed Wiring Board and Shielded...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

WORK PIECES AND METHODS OF LASER DRILLING THROUGH HOLES IN SUBSTRAT...

MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILA...

WORK PIECES AND METHODS OF LASER DRILLING THROUGH HOLES IN SUBSTRAT...

MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILA...

SUPPORT BODY, METHOD OF MANUFACTURING SUPPORT BODY, METHOD OF MANUF...

PROTECTIVE FILM WITH DYE MATERIALS FOR LASER ABSORPTION ENHANCEMENT...

METHOD OF PROVIDING AN ELECTRONIC DEVICE STRUCTURE AND RELATED ELEC...

STRIPPABLE ADHESION COMPOSITION AND USES THEREOF

PRINTED CIRCUIT BAORD AND METHOD FOR MANUFACTURING SAME

SUPPORT BODY, METHOD OF MANUFACTURING SUPPORT BODY, METHOD OF MANUF...

Method Of Preparing A Flexible Substrate Assembly And Flexible Subs...

FABRICATING METHOD OF CIRCUIT BOARD AND CIRCUIT BOARD

PHOTONIC HEATING OF SILVER GRIDS

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

METHOD FOR MANUFACTURING WIRING BOARD

METHOD FOR ENHANCING METALLIZATION IN SELECTIVE DEPOSITION PROCESSES

METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD

METHOD FOR MANUFACTURING WIRING BOARD

EMBEDDED STRUCTURE

METHOD OF MANUFACTURING WIRING BOARD

PRODUCT HAVING THROUGH-HOLE AND LASER PROCESSING METHOD

METHOD OF PREPARING A FLEXIBLE SUBSTRATE ASSEMBLY AND FLEXIBLE SUBS...

METHOD OF MANUFACTURING A SUBSTRATE FOR A MICROELECTRONIC DEVICE, A...

METHOD FOR FORMING THROUGH HOLE AND PRODUCT WITH THE FORMED THROUGH...

Multilayer ceramic board and manufacturing method thereof