Temporary substrate used as encapsulation process aid

Industry

CPC
H01L21/568

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/568Temporary substrate used as encapsulation process aid

Industries

Patents Grantslast 30 patents

Information Patent Grant
Stacked via structure
- Patent number 11,973,023
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,973,037
- Issue date Apr 30, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,973,042
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Jingu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,973,039
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- Chia-Hao Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplet first architecture for die tiling applications
- Patent number 11,973,041
- Issue date Apr 30, 2024
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple die assembly
- Patent number 11,973,058
- Issue date Apr 30, 2024
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package including stacked chips and chip couplers
- Patent number 11,973,061
- Issue date Apr 30, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with improved antenna patterns performance
- Patent number 11,973,038
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct contact interconnect structure without capture pads a...
- Patent number 11,973,051
- Issue date Apr 30, 2024
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,967,549
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Jung Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info packages including thermal dissipation blocks
- Patent number 11,967,591
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device and method for fabricating a packaged...
- Patent number 11,967,562
- Issue date Apr 23, 2024
- Infineon Technologies AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical lithography system and method of using the same
- Patent number 11,960,211
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and related methods
- Patent number 11,961,775
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabricating method thereof
- Patent number 11,961,867
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,961,789
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a wafer-level chip-scale...
- Patent number 11,961,764
- Issue date Apr 16, 2024
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,961,800
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure comprising buffer layer for reducing thermal stre...
- Patent number 11,961,777
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,955,348
- Issue date Apr 9, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
- Patent number 11,955,434
- Issue date Apr 9, 2024
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,955,459
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Hang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic carrier for high aspect ratio fanout
- Patent number 11,955,349
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stacking using chip to wafer bonding
- Patent number 11,955,462
- Issue date Apr 9, 2024
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out package with integrated peripheral devices and methods
- Patent number 11,955,395
- Issue date Apr 9, 2024
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package device
- Patent number 11,955,433
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming vertical interconnect st...
- Patent number 11,955,467
- Issue date Apr 9, 2024
- STATS ChipPAC Pte. Ltd.
- Junghwan Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced info POP and method of forming thereof
- Patent number 11,955,460
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,948,808
- Issue date Apr 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of chip package with fan-out feature
- Patent number 11,948,892
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FAN-OUT PACKAGING FOR A MULTICHIP PACKAGE
- Publication number 20240145457
- Publication date May 2, 2024
- Micron Technology, Inc.
- Faxing CHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240145256
- Publication date May 2, 2024
- Resonac Corporation
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND SEMICONDUCTOR PACKAGE
- Publication number 20240145326
- Publication date May 2, 2024
- Samsung Electronics Co., LTD
- Seungchul OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240145396
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Sehoon JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240145397
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Jeongho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL LEVEL SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240145258
- Publication date May 2, 2024
- STMicroelectronics Pte Ltd
- David GANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...
- Publication number 20240136297
- Publication date Apr 25, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yingqiang YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE
- Publication number 20240136299
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240136246
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20240128206
- Publication date Apr 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Peng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS
- Publication number 20240128205
- Publication date Apr 18, 2024
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF
- Publication number 20240128635
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE
- Publication number 20240128227
- Publication date Apr 18, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Perceval COUDRAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240120325
- Publication date Apr 11, 2024
- Powertech Technology Inc.
- Pei-chun TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING DEVICE CAPABLE OF DETECTING RISK OF IMPACT OF ELECTROSTAT...
- Publication number 20240120241
- Publication date Apr 11, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240113089
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240113090
- Publication date Apr 4, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Myoung KI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Semiconductor Device and Method
- Publication number 20240105631
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jeng-An Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH EMBEDDED CHIP AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240105661
- Publication date Mar 28, 2024
- Unimicron Technology Corp.
- Yu-Shen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE, AND CHIP SYSTEM
- Publication number 20240105678
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking Hybrid Substrates with...
- Publication number 20240105630
- Publication date Mar 28, 2024
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240105642
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240105662
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Jungho SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240096760
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096837
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240096781
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Ti Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240096822
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20240088056
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH HYBRID FANOUTS AND ASSOCIATED METHODS...
- Publication number 20240088100
- Publication date Mar 14, 2024
- Lodestar Licensing Group LLC
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240088062
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS

Temporary substrate used as encapsulation process aid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacked via structure

Package structure and manufacturing method thereof

Semiconductor package

Semiconductor device package and method of manufacturing the same

Chiplet first architecture for die tiling applications

Multiple die assembly

Chip package including stacked chips and chip couplers

Package structure with improved antenna patterns performance

Molded direct contact interconnect structure without capture pads a...

Semiconductor package

Info packages including thermal dissipation blocks

Packaged semiconductor device and method for fabricating a packaged...

Optical lithography system and method of using the same

Semiconductor devices and related methods

Electronic device package and fabricating method thereof

Semiconductor package and manufacturing method thereof

Semiconductor device and method of making a wafer-level chip-scale...

Via for semiconductor device connection and methods of forming the...

Package structure comprising buffer layer for reducing thermal stre...

RF devices with enhanced performance and methods of forming the same

Ultra small molded module integrated with die by module-on-wafer as...

Package structure

Anisotropic carrier for high aspect ratio fanout

Package stacking using chip to wafer bonding

Fan out package with integrated peripheral devices and methods

Package-on-package device

Semiconductor device and method of forming vertical interconnect st...

Advanced info POP and method of forming thereof

Semiconductor device and manufacturing method thereof

Formation method of chip package with fan-out feature

Patents Applicationslast 30 patents

FAN-OUT PACKAGING FOR A MULTICHIP PACKAGE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

PANEL LEVEL SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...

SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF

SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE

STACKED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGING DEVICE CAPABLE OF DETECTING RISK OF IMPACT OF ELECTROSTAT...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

Three-Dimensional Semiconductor Device and Method

CIRCUIT BOARD WITH EMBEDDED CHIP AND METHOD OF MANUFACTURING THE SAME

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE, AND CHIP SYSTEM

Semiconductor Device and Method of Stacking Hybrid Substrates with...

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE

PACKAGE STRUCTURE

METHOD OF FORMING SEMICONDUCTOR DEVICE

SEMICONDUCTOR ASSEMBLIES WITH HYBRID FANOUTS AND ASSOCIATED METHODS...

PACKAGE STRUCTURE