Testing of materials or semi-finished products

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CPC
G01R31/2831

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GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R31/00Arrangements for testing electric properties Arrangements for locating electric faults Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

Current Industry

G01R31/2831Testing of materials or semi-finished products

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method and system for thermal control of devices in an electronics...
- Patent number 12,292,484
- Issue date May 6, 2025
- AEHR Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for thermal control of devices in electronics tester
- Patent number 12,265,136
- Issue date Apr 1, 2025
- AEHR Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test apparatus
- Patent number 12,241,926
- Issue date Mar 4, 2025
- Advantest Corporation
- Naoyoshi Watanabe
- G01 - MEASURING TESTING
Information Patent Grant
Wafer metrology technologies
- Patent number 12,241,924
- Issue date Mar 4, 2025
- FemtoMetrix, Inc.
- Viktor Koldiaev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing method and testing system
- Patent number 12,222,385
- Issue date Feb 11, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yu-Ting Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Element having antenna array structure
- Patent number 12,218,441
- Issue date Feb 4, 2025
- Canon Kabushiki Kaisha
- Yasushi Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Motorized chuck stage controlling method
- Patent number 12,196,808
- Issue date Jan 14, 2025
- MPI CORPORATION
- Sebastian Giessmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Terahertz device
- Patent number 12,174,114
- Issue date Dec 24, 2024
- Rohm Co., Ltd.
- Kazuisao Tsuruda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for measuring semiconductor multilayer structure...
- Patent number 12,165,931
- Issue date Dec 10, 2024
- SHANGHAI ASPIRING SEMICONDUCTOR EQUIPMENT CO., LTD.
- Chongji Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer inspection system and annular seat thereof
- Patent number 12,158,493
- Issue date Dec 3, 2024
- MPI Corporation
- Yi-Hsuan Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Analysis apparatus, analysis method, and recording medium having re...
- Patent number 12,146,896
- Issue date Nov 19, 2024
- Advantest Corporation
- Yuji Sakai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system for regulating plasma dicing rates
- Patent number 12,142,527
- Issue date Nov 12, 2024
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual mode current and temperature sensing for SiC devices
- Patent number 12,132,104
- Issue date Oct 29, 2024
- Infineon Technologies AG
- Dethard Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate yield prediction based on spectra data from...
- Patent number 12,111,355
- Issue date Oct 8, 2024
- Onto Innovation Inc.
- Xin Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Random characteristic evaluation of subject maps
- Patent number 12,107,019
- Issue date Oct 1, 2024
- Kabushiki Kaisha Toshiba
- Shun Hirao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods to monitor leakage current
- Patent number 12,085,601
- Issue date Sep 10, 2024
- STMicroelectronics S.r.l.
- Romeo Letor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection jig and inspection device
- Patent number 12,072,352
- Issue date Aug 27, 2024
- Nidec-Read Corporation
- Michio Kaida
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor testing device and method of operating the same
- Patent number 12,050,245
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kong-Beng Thei
- G01 - MEASURING TESTING
Information Patent Grant
Flexible input/output (I/O) allocation for integrated circuit scan...
- Patent number 12,032,015
- Issue date Jul 9, 2024
- Amazon Technologies, Inc.
- Ilan Strulovici
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for thermal control of devices in an electronics...
- Patent number 12,007,451
- Issue date Jun 11, 2024
- AEHR Test Systems
- Jovan Jovanovic
- G01 - MEASURING TESTING
Information Patent Grant
Test circuit and method for operating the same
- Patent number 12,007,431
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chia-Wei Huang
- G01 - MEASURING TESTING
Information Patent Grant
Burn-in board and burn-in apparatus
- Patent number 11,994,552
- Issue date May 28, 2024
- Advantest Corporation
- Hiroaki Takeuchi
- G01 - MEASURING TESTING
Information Patent Grant
Probe card with angled probe and wafer testing method using the same
- Patent number 11,994,555
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Chun Wu
- G01 - MEASURING TESTING
Information Patent Grant
Substrate analysis apparatus and substrate analysis method
- Patent number 11,982,705
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Youn Gon Oh
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for high precision optical characterization of...
- Patent number 11,940,488
- Issue date Mar 26, 2024
- XCalipr Corporation
- William W. Chism
- G01 - MEASURING TESTING
Information Patent Grant
Film for component manufacture and component manufacturing method
- Patent number 11,942,349
- Issue date Mar 26, 2024
- Mitsui Chemicals Tohcello, Inc.
- Eiji Hayashishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for simulating electricity of wafer chip
- Patent number 11,927,620
- Issue date Mar 12, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hongxiang Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Inspection apparatus and inspection method
- Patent number 11,927,539
- Issue date Mar 12, 2024
- Tokyo Electron Limited
- Naoki Akiyama
- G01 - MEASURING TESTING
Information Patent Grant
Test circuits and semiconductor test methods
- Patent number 11,860,217
- Issue date Jan 2, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- ChihCheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for generating chip probing wafer map
- Patent number 11,852,673
- Issue date Dec 26, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Ying-Ju Wu
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
AUTOMATIC MAVERICK WAFER SCREENING USING MEASURED DIE PARAMETER AGA...
- Publication number 20250172607
- Publication date May 29, 2025
- Infineon Technologies Canada Inc.
- Iman ABDALI MASHHADI
- G01 - MEASURING TESTING
Information Patent Application
A Probe Card Stroke Compensation System and Method
- Publication number 20250164527
- Publication date May 22, 2025
- Shanghai Zenfocus Semi-Tech Co., Ltd.
- Jian Liang
- G01 - MEASURING TESTING
Information Patent Application
WAFER METROLOGY TECHNOLOGIES
- Publication number 20250155486
- Publication date May 15, 2025
- FemtoMetrix, Inc.
- Viktor Koldiaev
- G01 - MEASURING TESTING
Information Patent Application
PROBE SYSTEM FOR DOUBLE SIDE PROBING, METHOD OF OPERATING THE SAME...
- Publication number 20250147067
- Publication date May 8, 2025
- MPI Corporation
- PO-YI TING
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR CREATING PRODUCT-LIKE STRESSED SURROGATE TEST WAFERS
- Publication number 20250140614
- Publication date May 1, 2025
- TOKYO ELECTRON LIMITED
- Anthony R. SCHEPIS
- G01 - MEASURING TESTING
Information Patent Application
EVALUATION METHOD OF METAL CONTAMINATION
- Publication number 20250138080
- Publication date May 1, 2025
- GlobalWafers Japan Co., Ltd.
- Takahiro MAETA
- G01 - MEASURING TESTING
Information Patent Application
PROBER, PERFORMANCE BOARD, PROBE CARD, AND SUBSTRATE INSPECTING APP...
- Publication number 20250093384
- Publication date Mar 20, 2025
- KIOXIA Corporation
- Hiroki KAMATA
- G01 - MEASURING TESTING
Information Patent Application
WAFER TEST CASSETTE
- Publication number 20250093411
- Publication date Mar 20, 2025
- XINGR TECHNOLOGIES (ZHEJIANG) LIMITED
- CHOON LEONG LOU
- G01 - MEASURING TESTING
Information Patent Application
WAFER TEST SYSTEM
- Publication number 20250093387
- Publication date Mar 20, 2025
- XINGR TECHNOLOGIES (ZHEJIANG) LIMITED
- CHOON LEONG LOU
- G01 - MEASURING TESTING
Information Patent Application
METHOD, APPARATUS, AND ELECTRONIC DEVICE FOR TESTING WAFER
- Publication number 20250067795
- Publication date Feb 27, 2025
- SEMI-TECH Co., Ltd.
- Lincheng Han
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR WAFER AND OPERATING METHOD OF TEST CIRCUIT OF SEMICON...
- Publication number 20250069961
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Jinyong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING MODULE
- Publication number 20250060405
- Publication date Feb 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Wei-Zhong LI
- G01 - MEASURING TESTING
Information Patent Application
WAFER ANALYZING DEVICE AND WAFER ANALYZING SYSTEM
- Publication number 20250052808
- Publication date Feb 13, 2025
- SK HYNIX INC.
- Tae Beom KIM
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR OPTIMIZING LAYOUT PATTERN AND SEMICONDUCTOR WAFER
- Publication number 20250006562
- Publication date Jan 2, 2025
- WINBOND ELECTRONICS CORP.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICS IN ELECTRONICS TESTER
- Publication number 20240426938
- Publication date Dec 26, 2024
- Aehr Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICES IN AN ELECTRONICS...
- Publication number 20240426939
- Publication date Dec 26, 2024
- Aehr Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER
- Publication number 20240410934
- Publication date Dec 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei Zhong LI
- G01 - MEASURING TESTING
Information Patent Application
TEMPERATURE CALIBRATION SYSTEM, INSPECTION APPARATUS, AND TEMPERATU...
- Publication number 20240402021
- Publication date Dec 5, 2024
- TOKYO ELECTRON LIMITED
- Tomohiro OTA
- G01 - MEASURING TESTING
Information Patent Application
PROBE SYSTEM FOR TESTING DEVICE UNDER TEST INTEGRATED IN SEMICONDUC...
- Publication number 20240402218
- Publication date Dec 5, 2024
- MPI CORPORATION
- CHIN-TIEN YANG
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CURRENT MONITOR
- Publication number 20240353475
- Publication date Oct 24, 2024
- NVIDIA Corporation
- Miguel Rodriguez
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Computer-Implemented Method for Determining a Quality State of a Wafer
- Publication number 20240353473
- Publication date Oct 24, 2024
- ROBERT BOSCH GmbH
- Jonas Bergdolt
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR TESTING DEVICE AND METHOD OF OPERATING THE SAME
- Publication number 20240353474
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kong-Beng THEI
- G01 - MEASURING TESTING
Information Patent Application
PREHEATING CONTROL SYSTEM, PREHEATING CONTROL METHOD AND NON-TRANSI...
- Publication number 20240345135
- Publication date Oct 17, 2024
- NANYA TECHNOLOGY CORPORATION
- Tien Yu CHEN
- G01 - MEASURING TESTING
Information Patent Application
TEST CIRCUIT CAPABLE OF EFFICIENTLY UTILIZING MOUNTING AREA
- Publication number 20240345159
- Publication date Oct 17, 2024
- TECHWIDU CO., LTD.
- Hyoung-Rae KIM
- G01 - MEASURING TESTING
Information Patent Application
ULTRA-COMPACT AND MICROPOWER CIRCUIT TO MONITOR PROCESS, VOLTAGE, A...
- Publication number 20240329112
- Publication date Oct 3, 2024
- Avago Technologies International Sales Pte. Limited
- Alberto Grassi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
TEST FIXTURE AND EARLY WARNING SYSTEM
- Publication number 20240329079
- Publication date Oct 3, 2024
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- YING-QUAN ZHAO
- G01 - MEASURING TESTING
Information Patent Application
WAFER TEST PAD
- Publication number 20240329113
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Pin Chiu
- G01 - MEASURING TESTING
Information Patent Application
ELECTRICAL DEVICE RELIABILITY PROPERTIES PREDICTION DEVICE AND ELEC...
- Publication number 20240319259
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Minseok KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER TESTING APPARATUS AND CONTROL METHOD THEREOF
- Publication number 20240319229
- Publication date Sep 26, 2024
- Samsung Electronics Co., LTD
- Chunghyun KIM
- G01 - MEASURING TESTING
Information Patent Application
WAFER PACKAGE FOR PROTECTION OF ALUMINUM DIE PAD OF DIE FROM DAMAGE...
- Publication number 20240321653
- Publication date Sep 26, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS

Testing of materials or semi-finished products

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and system for thermal control of devices in an electronics...

Method and system for thermal control of devices in electronics tester

Test apparatus

Wafer metrology technologies

Testing method and testing system

Element having antenna array structure

Motorized chuck stage controlling method

Terahertz device

Method and device for measuring semiconductor multilayer structure...

Wafer inspection system and annular seat thereof

Analysis apparatus, analysis method, and recording medium having re...

Method and system for regulating plasma dicing rates

Dual mode current and temperature sensing for SiC devices

Semiconductor substrate yield prediction based on spectra data from...

Random characteristic evaluation of subject maps

Systems and methods to monitor leakage current

Inspection jig and inspection device

Semiconductor testing device and method of operating the same

Flexible input/output (I/O) allocation for integrated circuit scan...

Method and system for thermal control of devices in an electronics...

Test circuit and method for operating the same

Burn-in board and burn-in apparatus

Probe card with angled probe and wafer testing method using the same

Substrate analysis apparatus and substrate analysis method

Systems and methods for high precision optical characterization of...

Film for component manufacture and component manufacturing method

Method for simulating electricity of wafer chip

Inspection apparatus and inspection method

Test circuits and semiconductor test methods

Method for generating chip probing wafer map

Patents Applicationslast 30 patents

AUTOMATIC MAVERICK WAFER SCREENING USING MEASURED DIE PARAMETER AGA...

A Probe Card Stroke Compensation System and Method

WAFER METROLOGY TECHNOLOGIES

PROBE SYSTEM FOR DOUBLE SIDE PROBING, METHOD OF OPERATING THE SAME...

METHOD FOR CREATING PRODUCT-LIKE STRESSED SURROGATE TEST WAFERS

EVALUATION METHOD OF METAL CONTAMINATION

PROBER, PERFORMANCE BOARD, PROBE CARD, AND SUBSTRATE INSPECTING APP...

WAFER TEST CASSETTE

WAFER TEST SYSTEM

METHOD, APPARATUS, AND ELECTRONIC DEVICE FOR TESTING WAFER

SEMICONDUCTOR WAFER AND OPERATING METHOD OF TEST CIRCUIT OF SEMICON...

TESTING MODULE

WAFER ANALYZING DEVICE AND WAFER ANALYZING SYSTEM

METHOD FOR OPTIMIZING LAYOUT PATTERN AND SEMICONDUCTOR WAFER

METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICS IN ELECTRONICS TESTER

METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICES IN AN ELECTRONICS...

SEMICONDUCTOR WAFER

TEMPERATURE CALIBRATION SYSTEM, INSPECTION APPARATUS, AND TEMPERATU...

PROBE SYSTEM FOR TESTING DEVICE UNDER TEST INTEGRATED IN SEMICONDUC...

INTEGRATED CURRENT MONITOR

Computer-Implemented Method for Determining a Quality State of a Wafer

SEMICONDUCTOR TESTING DEVICE AND METHOD OF OPERATING THE SAME

PREHEATING CONTROL SYSTEM, PREHEATING CONTROL METHOD AND NON-TRANSI...

TEST CIRCUIT CAPABLE OF EFFICIENTLY UTILIZING MOUNTING AREA

ULTRA-COMPACT AND MICROPOWER CIRCUIT TO MONITOR PROCESS, VOLTAGE, A...

TEST FIXTURE AND EARLY WARNING SYSTEM

WAFER TEST PAD

ELECTRICAL DEVICE RELIABILITY PROPERTIES PREDICTION DEVICE AND ELEC...

WAFER TESTING APPARATUS AND CONTROL METHOD THEREOF

WAFER PACKAGE FOR PROTECTION OF ALUMINUM DIE PAD OF DIE FROM DAMAGE...