Testing of materials or semi-finished products

Industry

CPC
G01R31/2831

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Parent Industries

GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R31/00Arrangements for testing electric properties Arrangements for locating electric faults Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

Current Industry

G01R31/2831Testing of materials or semi-finished products

Industries

Patents Grantslast 30 patents

Information Patent Grant
Motorized chuck stage controlling method
- Patent number 12,196,808
- Issue date Jan 14, 2025
- MPI CORPORATION
- Sebastian Giessmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Terahertz device
- Patent number 12,174,114
- Issue date Dec 24, 2024
- Rohm Co., Ltd.
- Kazuisao Tsuruda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for measuring semiconductor multilayer structure...
- Patent number 12,165,931
- Issue date Dec 10, 2024
- SHANGHAI ASPIRING SEMICONDUCTOR EQUIPMENT CO., LTD.
- Chongji Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer inspection system and annular seat thereof
- Patent number 12,158,493
- Issue date Dec 3, 2024
- MPI Corporation
- Yi-Hsuan Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Analysis apparatus, analysis method, and recording medium having re...
- Patent number 12,146,896
- Issue date Nov 19, 2024
- Advantest Corporation
- Yuji Sakai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system for regulating plasma dicing rates
- Patent number 12,142,527
- Issue date Nov 12, 2024
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual mode current and temperature sensing for SiC devices
- Patent number 12,132,104
- Issue date Oct 29, 2024
- Infineon Technologies AG
- Dethard Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate yield prediction based on spectra data from...
- Patent number 12,111,355
- Issue date Oct 8, 2024
- Onto Innovation Inc.
- Xin Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Random characteristic evaluation of subject maps
- Patent number 12,107,019
- Issue date Oct 1, 2024
- Kabushiki Kaisha Toshiba
- Shun Hirao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods to monitor leakage current
- Patent number 12,085,601
- Issue date Sep 10, 2024
- STMicroelectronics S.r.l.
- Romeo Letor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection jig and inspection device
- Patent number 12,072,352
- Issue date Aug 27, 2024
- Nidec-Read Corporation
- Michio Kaida
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor testing device and method of operating the same
- Patent number 12,050,245
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kong-Beng Thei
- G01 - MEASURING TESTING
Information Patent Grant
Flexible input/output (I/O) allocation for integrated circuit scan...
- Patent number 12,032,015
- Issue date Jul 9, 2024
- Amazon Technologies, Inc.
- Ilan Strulovici
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for thermal control of devices in an electronics...
- Patent number 12,007,451
- Issue date Jun 11, 2024
- AEHR Test Systems
- Jovan Jovanovic
- G01 - MEASURING TESTING
Information Patent Grant
Test circuit and method for operating the same
- Patent number 12,007,431
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chia-Wei Huang
- G01 - MEASURING TESTING
Information Patent Grant
Burn-in board and burn-in apparatus
- Patent number 11,994,552
- Issue date May 28, 2024
- Advantest Corporation
- Hiroaki Takeuchi
- G01 - MEASURING TESTING
Information Patent Grant
Probe card with angled probe and wafer testing method using the same
- Patent number 11,994,555
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Chun Wu
- G01 - MEASURING TESTING
Information Patent Grant
Substrate analysis apparatus and substrate analysis method
- Patent number 11,982,705
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Youn Gon Oh
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for high precision optical characterization of...
- Patent number 11,940,488
- Issue date Mar 26, 2024
- XCalipr Corporation
- William W. Chism
- G01 - MEASURING TESTING
Information Patent Grant
Film for component manufacture and component manufacturing method
- Patent number 11,942,349
- Issue date Mar 26, 2024
- Mitsui Chemicals Tohcello, Inc.
- Eiji Hayashishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for simulating electricity of wafer chip
- Patent number 11,927,620
- Issue date Mar 12, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hongxiang Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Inspection apparatus and inspection method
- Patent number 11,927,539
- Issue date Mar 12, 2024
- Tokyo Electron Limited
- Naoki Akiyama
- G01 - MEASURING TESTING
Information Patent Grant
Test circuits and semiconductor test methods
- Patent number 11,860,217
- Issue date Jan 2, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- ChihCheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for generating chip probing wafer map
- Patent number 11,852,673
- Issue date Dec 26, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Ying-Ju Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor substrates for electrical resistivity measurements
- Patent number 11,841,296
- Issue date Dec 12, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Marvin Montaque
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Element having antenna array structure
- Patent number 11,831,063
- Issue date Nov 28, 2023
- Canon Kabushiki Kaisha
- Yasushi Koyama
- G01 - MEASURING TESTING
Information Patent Grant
Pump and probe type second harmonic generation metrology
- Patent number 11,821,911
- Issue date Nov 21, 2023
- FemtoMetrix, Inc.
- Viktor Koldiaev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing carrier
- Patent number 11,823,965
- Issue date Nov 21, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support in a millisecond anneal system
- Patent number 11,810,802
- Issue date Nov 7, 2023
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Joseph Cibere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit for detecting crack damage of a die, method for detecting c...
- Patent number 11,804,412
- Issue date Oct 31, 2023
- Changxin Memory Technologies, Inc.
- Lingling Cao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR OPTIMIZING LAYOUT PATTERN AND SEMICONDUCTOR WAFER
- Publication number 20250006562
- Publication date Jan 2, 2025
- WINBOND ELECTRONICS CORP.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICS IN ELECTRONICS TESTER
- Publication number 20240426938
- Publication date Dec 26, 2024
- Aehr Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICES IN AN ELECTRONICS...
- Publication number 20240426939
- Publication date Dec 26, 2024
- Aehr Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER
- Publication number 20240410934
- Publication date Dec 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei Zhong LI
- G01 - MEASURING TESTING
Information Patent Application
TEMPERATURE CALIBRATION SYSTEM, INSPECTION APPARATUS, AND TEMPERATU...
- Publication number 20240402021
- Publication date Dec 5, 2024
- TOKYO ELECTRON LIMITED
- Tomohiro OTA
- G01 - MEASURING TESTING
Information Patent Application
PROBE SYSTEM FOR TESTING DEVICE UNDER TEST INTEGRATED IN SEMICONDUC...
- Publication number 20240402218
- Publication date Dec 5, 2024
- MPI CORPORATION
- CHIN-TIEN YANG
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CURRENT MONITOR
- Publication number 20240353475
- Publication date Oct 24, 2024
- NVIDIA Corporation
- Miguel Rodriguez
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Computer-Implemented Method for Determining a Quality State of a Wafer
- Publication number 20240353473
- Publication date Oct 24, 2024
- ROBERT BOSCH GmbH
- Jonas Bergdolt
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR TESTING DEVICE AND METHOD OF OPERATING THE SAME
- Publication number 20240353474
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kong-Beng THEI
- G01 - MEASURING TESTING
Information Patent Application
PREHEATING CONTROL SYSTEM, PREHEATING CONTROL METHOD AND NON-TRANSI...
- Publication number 20240345135
- Publication date Oct 17, 2024
- NANYA TECHNOLOGY CORPORATION
- Tien Yu CHEN
- G01 - MEASURING TESTING
Information Patent Application
TEST CIRCUIT CAPABLE OF EFFICIENTLY UTILIZING MOUNTING AREA
- Publication number 20240345159
- Publication date Oct 17, 2024
- TECHWIDU CO., LTD.
- Hyoung-Rae KIM
- G01 - MEASURING TESTING
Information Patent Application
ULTRA-COMPACT AND MICROPOWER CIRCUIT TO MONITOR PROCESS, VOLTAGE, A...
- Publication number 20240329112
- Publication date Oct 3, 2024
- Avago Technologies International Sales Pte. Limited
- Alberto Grassi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
TEST FIXTURE AND EARLY WARNING SYSTEM
- Publication number 20240329079
- Publication date Oct 3, 2024
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- YING-QUAN ZHAO
- G01 - MEASURING TESTING
Information Patent Application
WAFER TEST PAD
- Publication number 20240329113
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Pin Chiu
- G01 - MEASURING TESTING
Information Patent Application
ELECTRICAL DEVICE RELIABILITY PROPERTIES PREDICTION DEVICE AND ELEC...
- Publication number 20240319259
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Minseok KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER TESTING APPARATUS AND CONTROL METHOD THEREOF
- Publication number 20240319229
- Publication date Sep 26, 2024
- Samsung Electronics Co., LTD
- Chunghyun KIM
- G01 - MEASURING TESTING
Information Patent Application
WAFER PACKAGE FOR PROTECTION OF ALUMINUM DIE PAD OF DIE FROM DAMAGE...
- Publication number 20240321653
- Publication date Sep 26, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL PROBE CARD AND TESTING METHOD
- Publication number 20240310412
- Publication date Sep 19, 2024
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICES IN AN ELECTRONICS...
- Publication number 20240302451
- Publication date Sep 12, 2024
- Aehr Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST CIRCUIT AND METHOD FOR OPERATING THE SAME
- Publication number 20240288489
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIA-WEI HUANG
- G01 - MEASURING TESTING
Information Patent Application
DEVICE AND METHOD FOR SORTING SEMICONDUCTOR CHIP WITH POTENTIAL FAI...
- Publication number 20240222199
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Gooyoung Kim
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING TEST PATTERN AND METHOD OF FABRICAT...
- Publication number 20240213104
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Youngbae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TYPE MEASURING APPARATUS AND MAGNETIC FLUX DENSITY MEASURING...
- Publication number 20240151767
- Publication date May 9, 2024
- SEMES CO., LTD.
- Yongjun SEO
- G01 - MEASURING TESTING
Information Patent Application
TEST DEVICE AND TEMPERATURE CONTROL METHOD
- Publication number 20240125843
- Publication date Apr 18, 2024
- TOKYO ELECTRON LIMITED
- Hiroyuki NAKAYAMA
- G01 - MEASURING TESTING
Information Patent Application
VOICE COIL LEAF SPRING PROBER
- Publication number 20240125847
- Publication date Apr 18, 2024
- MACOM Technology Solutions Holdings, Inc.
- Timothy James VANDERWERF
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR WAFER TEST SYSTEM BY FEEDBACK CONTROL
- Publication number 20240053399
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Gibong LEE
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND DEVICE FOR MEASURING SEMICONDUCTOR MULTILAYER STRUCTURE...
- Publication number 20240038600
- Publication date Feb 1, 2024
- SHANGHAI ASPIRING SEMICONDUCTOR EQUIPMENT CO., LTD.
- Chongji HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TESTER AND WAFER TESTING METHOD AND SYSTEM
- Publication number 20240027518
- Publication date Jan 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Ching-Chung WANG
- G01 - MEASURING TESTING
Information Patent Application
ELEMENT HAVING ANTENNA ARRAY STRUCTURE
- Publication number 20240014559
- Publication date Jan 11, 2024
- Canon Kabushiki Kaisha
- Yasushi Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Mode Current and Temperature Sensing for SiC Devices
- Publication number 20230420559
- Publication date Dec 28, 2023
- INFINEON TECHNOLOGIES AG
- Dethard Peters
- H01 - BASIC ELECTRIC ELEMENTS

Testing of materials or semi-finished products

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Motorized chuck stage controlling method

Terahertz device

Method and device for measuring semiconductor multilayer structure...

Wafer inspection system and annular seat thereof

Analysis apparatus, analysis method, and recording medium having re...

Method and system for regulating plasma dicing rates

Dual mode current and temperature sensing for SiC devices

Semiconductor substrate yield prediction based on spectra data from...

Random characteristic evaluation of subject maps

Systems and methods to monitor leakage current

Inspection jig and inspection device

Semiconductor testing device and method of operating the same

Flexible input/output (I/O) allocation for integrated circuit scan...

Method and system for thermal control of devices in an electronics...

Test circuit and method for operating the same

Burn-in board and burn-in apparatus

Probe card with angled probe and wafer testing method using the same

Substrate analysis apparatus and substrate analysis method

Systems and methods for high precision optical characterization of...

Film for component manufacture and component manufacturing method

Method for simulating electricity of wafer chip

Inspection apparatus and inspection method

Test circuits and semiconductor test methods

Method for generating chip probing wafer map

Semiconductor substrates for electrical resistivity measurements

Element having antenna array structure

Pump and probe type second harmonic generation metrology

Substrate processing carrier

Substrate support in a millisecond anneal system

Circuit for detecting crack damage of a die, method for detecting c...

Patents Applicationslast 30 patents

METHOD FOR OPTIMIZING LAYOUT PATTERN AND SEMICONDUCTOR WAFER

METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICS IN ELECTRONICS TESTER

METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICES IN AN ELECTRONICS...

SEMICONDUCTOR WAFER

TEMPERATURE CALIBRATION SYSTEM, INSPECTION APPARATUS, AND TEMPERATU...

PROBE SYSTEM FOR TESTING DEVICE UNDER TEST INTEGRATED IN SEMICONDUC...

INTEGRATED CURRENT MONITOR

Computer-Implemented Method for Determining a Quality State of a Wafer

SEMICONDUCTOR TESTING DEVICE AND METHOD OF OPERATING THE SAME

PREHEATING CONTROL SYSTEM, PREHEATING CONTROL METHOD AND NON-TRANSI...

TEST CIRCUIT CAPABLE OF EFFICIENTLY UTILIZING MOUNTING AREA

ULTRA-COMPACT AND MICROPOWER CIRCUIT TO MONITOR PROCESS, VOLTAGE, A...

TEST FIXTURE AND EARLY WARNING SYSTEM

WAFER TEST PAD

ELECTRICAL DEVICE RELIABILITY PROPERTIES PREDICTION DEVICE AND ELEC...

WAFER TESTING APPARATUS AND CONTROL METHOD THEREOF

WAFER PACKAGE FOR PROTECTION OF ALUMINUM DIE PAD OF DIE FROM DAMAGE...

UNIVERSAL PROBE CARD AND TESTING METHOD

METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICES IN AN ELECTRONICS...

TEST CIRCUIT AND METHOD FOR OPERATING THE SAME

DEVICE AND METHOD FOR SORTING SEMICONDUCTOR CHIP WITH POTENTIAL FAI...

SEMICONDUCTOR PACKAGE INCLUDING TEST PATTERN AND METHOD OF FABRICAT...

WAFER TYPE MEASURING APPARATUS AND MAGNETIC FLUX DENSITY MEASURING...

TEST DEVICE AND TEMPERATURE CONTROL METHOD

VOICE COIL LEAF SPRING PROBER

SEMICONDUCTOR WAFER TEST SYSTEM BY FEEDBACK CONTROL

METHOD AND DEVICE FOR MEASURING SEMICONDUCTOR MULTILAYER STRUCTURE...

WAFER TESTER AND WAFER TESTING METHOD AND SYSTEM

ELEMENT HAVING ANTENNA ARRAY STRUCTURE

Dual Mode Current and Temperature Sensing for SiC Devices