Thallium [Tl] as principal constituent

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H01L2224/05114

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05114Thallium [Tl] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 10,319,691
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Interconnection Structure and Method of Forming Same
- Publication number 20170117245
- Publication date Apr 27, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nitride-based semiconductor light-emitting device and method of man...
- Publication number 20070051968
- Publication date Mar 8, 2007
- Shuichiro Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS