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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    FRONT-END CIRCUIT AND SEMI-CONDUCTOR DEVICE
    • Publication number 20250118708
    • Publication date Apr 10, 2025
    • RICHWAVE TECHNOLOGY CORP.
    • Kuang-Lieh Wan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTELLIGENT POWER MODULE ARRANGEMENT
    • Publication number 20250118634
    • Publication date Apr 10, 2025
    • Infineon Technologies Austria AG
    • Chang Young PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIREBOND MULTICHIP PACKAGE
    • Publication number 20250112197
    • Publication date Apr 3, 2025
    • MEDIATEK INC.
    • Yu-Liang Hsiao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    AMPLIFY DEVICE AND SEMICONDUCTOR DEVICE
    • Publication number 20250105804
    • Publication date Mar 27, 2025
    • RICHWAVE TECHNOLOGY CORP.
    • Po-Yen Ho
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURI...
    • Publication number 20250096183
    • Publication date Mar 20, 2025
    • Renesas Electronics America Inc.
    • Martin Ashley VAGUES
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20250087575
    • Publication date Mar 13, 2025
    • Fuji Electric Co., Ltd.
    • Mariko Maruyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250087636
    • Publication date Mar 13, 2025
    • Samsung Electronics Co., Ltd.
    • Inhee YOO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20250079291
    • Publication date Mar 6, 2025
    • Mitsubishi Electric Corporation
    • Shinji SAKAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SOLID STATE LIGHTING DEVICES WITH ACCESSIBLE ELECTRODES AND METHODS...
    • Publication number 20250072170
    • Publication date Feb 27, 2025
    • Micron Technology, Inc.
    • Martin F. Schubert
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20250070076
    • Publication date Feb 27, 2025
    • ROHM CO., LTD.
    • Hiroaki MATSUBARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20250069998
    • Publication date Feb 27, 2025
    • ROHM CO., LTD.
    • Takahiro KOTANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20250072012
    • Publication date Feb 27, 2025
    • Rohm Co., Ltd.
    • Masanobu TSUJI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20250062199
    • Publication date Feb 20, 2025
    • ROHM CO., LTD.
    • Hiroaki MATSUBARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MEMORY DEVICE
    • Publication number 20250062277
    • Publication date Feb 20, 2025
    • Macronix International Co., Ltd.
    • Shih-Hung Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE BRIDGE AND ITS MANUFACTURING PROCESS
    • Publication number 20250054918
    • Publication date Feb 13, 2025
    • ROBERT BOSCH GmbH
    • Irfan AYDOGMUS
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20250046687
    • Publication date Feb 6, 2025
    • Rohm Co., Ltd.
    • Hiroaki MATSUBARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COMPUTING DEVICE
    • Publication number 20250048938
    • Publication date Feb 6, 2025
    • Kabushiki Kaisha Toshiba
    • Hayato GOTO
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20250022835
    • Publication date Jan 16, 2025
    • Fuji Electric Co., Ltd.
    • Hideo AMI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-CHIP PACKAGE DEVICE
    • Publication number 20250022846
    • Publication date Jan 16, 2025
    • FORCE MOS TECHNOLOGY CO., LTD.
    • YUAN-SHUN CHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MAKING A MULTI-CHIP PACKAGE DEVICE
    • Publication number 20250022721
    • Publication date Jan 16, 2025
    • FORCE MOS TECHNOLOGY CO., LTD.
    • YUAN-SHUN CHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER PACKAGE CONFIGURED WITH ADDITIONAL FUNCTIONALITY
    • Publication number 20250014973
    • Publication date Jan 9, 2025
    • Wolfspeed, Inc.
    • Paul WHEELER
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20250006604
    • Publication date Jan 2, 2025
    • DENSO CORPORATION
    • Kazuki YAMAUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
    • Publication number 20250006775
    • Publication date Jan 2, 2025
    • ROHM CO., LTD.
    • Hiroaki MATSUBARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    • Publication number 20240421018
    • Publication date Dec 19, 2024
    • Fuji Electric Co., Ltd.
    • Kazuma KAWAMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    • Publication number 20240421123
    • Publication date Dec 19, 2024
    • Samsung Electronics Co., Ltd.
    • Chengtar Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OPTOELECTRONIC SYSTEM
    • Publication number 20240421266
    • Publication date Dec 19, 2024
    • EPISTAR CORPORATION
    • Min-Hsun HSIEH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    NITRIDE SEMICONDUCTOR MODULE
    • Publication number 20240413235
    • Publication date Dec 12, 2024
    • Rohm Co., Ltd.
    • Hirotaka Otake
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE WITH MELTABLE ENCAPSULANT ZONES
    • Publication number 20240404903
    • Publication date Dec 5, 2024
    • INFINEON TECHNOLOGIES AG
    • Anita Herzer
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF DIRECT COOLING USING A CONDUCTIVE STRIP
    • Publication number 20240395662
    • Publication date Nov 28, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Ingoo KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240395681
    • Publication date Nov 28, 2024
    • ROHM CO., LTD.
    • Bungo TANAKA
    • H01 - BASIC ELECTRIC ELEMENTS