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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/16137the bodies being arranged next to each other

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming modular 3D semiconductor...
- Patent number 11,211,359
- Issue date Dec 28, 2021
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating semiconductor package
- Patent number 11,031,371
- Issue date Jun 8, 2021
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Chin Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,879,227
- Issue date Dec 29, 2020
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip, method for manufacturing semiconductor chip, in...
- Patent number 10,658,321
- Issue date May 19, 2020
- Kabushiki Kaisha Toshiba
- Hidekazu Inoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor method for forming semiconductor structure having bum...
- Patent number 10,607,858
- Issue date Mar 31, 2020
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,580,763
- Issue date Mar 3, 2020
- Renesas Electronics Corporation
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having bump on tilting upper corner surface
- Patent number 10,290,512
- Issue date May 14, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency circuit
- Patent number 10,290,603
- Issue date May 14, 2019
- Mitsubishi Electric Corporation
- Shin Chaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,224,318
- Issue date Mar 5, 2019
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lateral cooling for multi-chip packages
- Patent number 10,147,666
- Issue date Dec 4, 2018
- Xilinx, Inc.
- Stephen M. Trimberger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for producing a chip assemblage
- Patent number 10,014,275
- Issue date Jul 3, 2018
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with lateral bump structure
- Patent number 9,935,071
- Issue date Apr 3, 2018
- Nanya Technology Corporation
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 9,847,325
- Issue date Dec 19, 2017
- Renesas Electronics Corporation
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die semiconductor structure with intermediate vertical side c...
- Patent number 9,812,425
- Issue date Nov 7, 2017
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus of packaging with interposers
- Patent number 9,627,223
- Issue date Apr 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die semiconductor structure with intermediate vertical side c...
- Patent number 9,478,524
- Issue date Oct 25, 2016
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact arrangements for stackable microelectronic package structur...
- Patent number 9,349,707
- Issue date May 24, 2016
- Invensas Corporation
- Zhuowen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 9,245,857
- Issue date Jan 26, 2016
- Novatek Microelectronics Corp.
- Jhih-Siou Cheng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Die edge side connection
- Patent number 9,209,143
- Issue date Dec 8, 2015
- Intel IP Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-organizing network with chip package having multiple interconn...
- Patent number 9,190,371
- Issue date Nov 17, 2015
- Moon J. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to enable controlled side chip interconnection for 3D integr...
- Patent number 9,136,251
- Issue date Sep 15, 2015
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for obtaining three-dimensional actin structures and uses th...
- Patent number 9,070,702
- Issue date Jun 30, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean-Christophe Gabriel
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Direct edge connection for multi-chip integrated circuits
- Patent number 8,551,816
- Issue date Oct 8, 2013
- International Business Machines Corporation
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method for three-dimensional integrated circuit and three-d...
- Patent number 8,508,041
- Issue date Aug 13, 2013
- National Chiao Tung University
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct edge connection for multi-chip integrated circuits
- Patent number 8,237,271
- Issue date Aug 7, 2012
- International Business Machines Corporation
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing Method of Semiconductive Element and Ink Jet Head Sub...
- Patent number 7,591,071
- Issue date Sep 22, 2009
- Canon Kabushiki Kaisha
- Satoshi Ibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip edge interconnect apparatus and method
- Patent number 6,611,050
- Issue date Aug 26, 2003
- International Business Machines Corporation
- Thomas G. Ference
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 5,533,664
- Issue date Jul 9, 1996
- Kabushiki Kaisha Toshiba
- Mamoru Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240429202
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- SANGHO SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...
- Publication number 20240413137
- Publication date Dec 12, 2024
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347494
- Publication date Oct 17, 2024
- Murata Manufacturing Co., Ltd.
- Mari SAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20240258228
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Juneyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240213129
- Publication date Jun 27, 2024
- Global Unichip Corporation
- Hao-Yu TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, PACKAGE FORMING METHOD, AND POWER SUPPLY MODULE
- Publication number 20240203843
- Publication date Jun 20, 2024
- Shenzhen STS Microelectronics Co., Ltd.
- Lin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DEVICE
- Publication number 20240057352
- Publication date Feb 15, 2024
- ChangXin Memory Technologies, Inc.
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY MODULE
- Publication number 20240030165
- Publication date Jan 25, 2024
- Murata Manufacturing Co., Ltd.
- Kiyoshi AIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING DIES AND AN INTERCONNECT COUPLED TO THE...
- Publication number 20230307405
- Publication date Sep 28, 2023
- ADVANCED MICRO DEVICES, INC.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230260887
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Se-Ho YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200118994
- Publication date Apr 16, 2020
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, IN...
- Publication number 20190088612
- Publication date Mar 21, 2019
- Kabushiki Kaisha Toshiba
- Hidekazu Inoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR METHOD FOR FORMING SEMICONDUCTOR STRUCTURE HAVING BUM...
- Publication number 20190074197
- Publication date Mar 7, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING A SEMICONDUCTOR PACKAGE
- Publication number 20180204814
- Publication date Jul 19, 2018
- NANYA TECHNOLOGY CORPORATION
- PO-CHUN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20180019237
- Publication date Jan 18, 2018
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A CHIP ASSEMBLAGE
- Publication number 20170271298
- Publication date Sep 21, 2017
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20170236810
- Publication date Aug 17, 2017
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D FANOUT STACKING
- Publication number 20170025380
- Publication date Jan 26, 2017
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE SEMICONDUCTOR STRUCTURE WITH INTERMEDIATE VERTICAL SIDE C...
- Publication number 20170018530
- Publication date Jan 19, 2017
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus of Packaging with Interposers
- Publication number 20160204079
- Publication date Jul 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Packaging Semiconductor Devices and Packaged Semiconduct...
- Publication number 20150357317
- Publication date Dec 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20150262943
- Publication date Sep 17, 2015
- NOVATEK MICROELECTRONICS CORP.
- Jhih-Siou Cheng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Methods and Apparatus of Packaging with Interposers
- Publication number 20140167269
- Publication date Jun 19, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20140004725
- Publication date Jan 2, 2014
- NOVATEK MICROELECTRONICS CORP.
- Jhih-Siou Cheng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD TO ENABLE CONTROLLED SIDE CHIP INTERCONNECTION FOR 3D INTEGR...
- Publication number 20130341803
- Publication date Dec 26, 2013
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT AND THREE-D...
- Publication number 20130069248
- Publication date Mar 21, 2013
- NATIONAL CHIAO-TUNG UNIVERSITY
- KUAN-NENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Edge Connection for Multi-Chip Integrated Circuits
- Publication number 20120187577
- Publication date Jul 26, 2012
- International Business Machines Corporation
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ORGANIZING NETWORK WITH CHIP PACKAGE HAVING MULTIPLE INTERCONN...
- Publication number 20120153450
- Publication date Jun 21, 2012
- Moon J. Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIRECT EDGE CONNECTION FOR MULTI-CHIP INTEGRATED CIRCUITS
- Publication number 20080315409
- Publication date Dec 25, 2008
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductive element, ink jet head substrate and manufacturing me...
- Publication number 20060170734
- Publication date Aug 3, 2006
- Canon Kabushiki Kaisha
- Satoshi Ibe
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

the bodies being arranged next to each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of forming modular 3D semiconductor...

Semiconductor package and method of fabricating semiconductor package

Electronic device

Semiconductor chip, method for manufacturing semiconductor chip, in...

Semiconductor method for forming semiconductor structure having bum...

Electronic device

Semiconductor structure having bump on tilting upper corner surface

High-frequency circuit

Electronic device

Lateral cooling for multi-chip packages

Method for producing a chip assemblage

Semiconductor package with lateral bump structure

Electronic device

Multi-die semiconductor structure with intermediate vertical side c...

Methods and apparatus of packaging with interposers

Multi-die semiconductor structure with intermediate vertical side c...

Contact arrangements for stackable microelectronic package structur...

Chip package

Die edge side connection

Self-organizing network with chip package having multiple interconn...

Method to enable controlled side chip interconnection for 3D integr...

Method for obtaining three-dimensional actin structures and uses th...

Direct edge connection for multi-chip integrated circuits

Bonding method for three-dimensional integrated circuit and three-d...

Direct edge connection for multi-chip integrated circuits

Manufacturing Method of Semiconductive Element and Ink Jet Head Sub...

Chip edge interconnect apparatus and method

Method of manufacturing a semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT DEVICE

INTERPOSER DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE, PACKAGE FORMING METHOD, AND POWER SUPPLY MODULE

SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DEVICE

HIGH-FREQUENCY MODULE

ELECTRONIC DEVICE INCLUDING DIES AND AN INTERCONNECT COUPLED TO THE...

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE

SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, IN...

SEMICONDUCTOR METHOD FOR FORMING SEMICONDUCTOR STRUCTURE HAVING BUM...

METHOD FOR PREPARING A SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE

METHOD FOR PRODUCING A CHIP ASSEMBLAGE

ELECTRONIC DEVICE

3D FANOUT STACKING

MULTI-DIE SEMICONDUCTOR STRUCTURE WITH INTERMEDIATE VERTICAL SIDE C...

Methods and Apparatus of Packaging with Interposers

Methods of Packaging Semiconductor Devices and Packaged Semiconduct...

CHIP PACKAGE

Methods and Apparatus of Packaging with Interposers

CHIP PACKAGE

METHOD TO ENABLE CONTROLLED SIDE CHIP INTERCONNECTION FOR 3D INTEGR...

BONDING METHOD FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT AND THREE-D...

Direct Edge Connection for Multi-Chip Integrated Circuits

SELF-ORGANIZING NETWORK WITH CHIP PACKAGE HAVING MULTIPLE INTERCONN...

DIRECT EDGE CONNECTION FOR MULTI-CHIP INTEGRATED CIRCUITS

Semiconductive element, ink jet head substrate and manufacturing me...