Number | Name | Date | Kind |
---|---|---|---|
4021838 | Warwick | May 1977 | A |
4772951 | Saito | Sep 1988 | A |
4990462 | Sliwa, Jr. | Feb 1991 | A |
5031072 | Malhi et al. | Jul 1991 | A |
5071792 | VanVonno et al. | Dec 1991 | A |
5075253 | Sliwa, Jr. | Dec 1991 | A |
5126286 | Chance | Jun 1992 | A |
5196652 | Mikkelsen, Jr. et al. | Mar 1993 | A |
5204925 | Bonanni et al. | Apr 1993 | A |
5229647 | Gnadinger | Jul 1993 | A |
5373189 | Massit et al. | Dec 1994 | A |
5401672 | Kurtz et al. | Mar 1995 | A |
5421908 | Yoshida et al. | Jun 1995 | A |
5439849 | McBride et al. | Aug 1995 | A |
5454160 | Nickel | Oct 1995 | A |
5606198 | Ono et al. | Feb 1997 | A |
5632631 | Fjelstad et al. | May 1997 | A |
5668409 | Gaul | Sep 1997 | A |
6069973 | Lin et al. | May 2000 | A |
Number | Date | Country |
---|---|---|
19704955 | Aug 1998 | DE |
Entry |
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Wolf, “Silicon Processing for the VLSI Era, vol. 2—Process Integration,” 1990, Lattice Press, vol. 2, pp. 273-275.* |
Mahajan et al. Concise Encyclopedia of Semiconducting Materials & Related Technologies First Edition 1992, Permagon Press, p. 95.* |
Multichip-On-Flex Plastic Encapsulated MHDI-Low Cost Substratesless Manufacturing for Microwave and Millimeterwave Modules, Cooper et al, 1996 IEEE MTT-S Digest, pp. 219-225. |